Loading...

SN74S473J4

Texas Instruments

SN74S473J4 by Texas Instruments

SN74S473J4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It features TTL technology, operates b/w 0-70°C, and has a rectangular ceramic package with 20 terminals. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,370

-

-

-

-

Vyrian

USA . 3,319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,319

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,106 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,106

$4.000

-

-

-

Parana Technologies

USA . 929 parts In-Stock

1+ parts

$5.053

100+ parts

-

1k+ parts

$5.619

10k+ parts

-

929

$5.053

-

$5.619

-

ChromeModa Solutions

Germany . 5,683 parts In-Stock

1+ parts

$5.678

100+ parts

$4.656

1k+ parts

-

10k+ parts

-

5,683

$5.678

$4.656

-

-

IDEA Electronic Components Group

UK . 1,115 parts In-Stock

1+ parts

$5.678

100+ parts

-

1k+ parts

$5.110

10k+ parts

-

1,115

$5.678

-

$5.110

-

AZTECH Wire

Italy . 439 parts In-Stock

1+ parts

$11.745

100+ parts

-

1k+ parts

-

10k+ parts

-

439

$11.745

-

-

-

Corphita

USA . 4,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,749

-

-

-

-

DigiPath Technology Company

USA . 888 parts In-Stock

1+ parts

-

100+ parts

$5.119

1k+ parts

-

10k+ parts

-

888

-

$5.119

-

-

Overview

Unlock the power of innovation with the SN74S473J4 by Texas Instruments, a high-quality OTP ROM that brings reliability and efficiency to your projects. Texas Instruments is a trusted manufacturer known for producing top-notch components, and this OTP ROM is no exception. With its 512x8 organization and 4096-bit memory density, this versatile component is perfect for a wide range of applications. Whether you're working on consumer electronics, industrial automation, or communication systems, the SN74S473J4 offers unparalleled value, benefits, and advantages. Upgrade your designs with confidence and precision using this cutting-edge product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides durability and reliability, making this product suitable for harsh operating environments.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and compact design in various electronic devices.

No. of Terminals: 20

Sufficient number of terminals for effective connectivity and functionality in electronic circuits.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for versatile application in different temperature environments.

Organization: 512X8

Efficient organization of memory storage with 512 words of width 8, providing ample data storage capacity.

Technology: TTL

TTL technology ensures fast and reliable data transmission, enhancing the performance of the OTP ROM.

Memory IC Type: OTP ROM

OTP ROM memory type offers non-volatile data storage, ensuring data retention even without power, making it ideal for storing critical data.

Maximum Access Time: 75 ns

Fast maximum access time ensures quick data retrieval and processing, enhancing overall system performance.

Technical Specifications

OTP ROM SN74S473J4 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

75 ns

JESD-30 Code:

R-XDIP-T20

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

20

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

OTP ROMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74S473J4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20