Loading...

CMS212-200

Texas Instruments

CMS212-200 by Texas Instruments

Texas Instruments' CMS212-200 is a 256KX16 OTP ROM with 60 terminals and operates at 5V. It features an output type of 3-STATE, parallel technology, and a memory density of 4194304 bit. Ideal for applications requiring reliable non-volatile memory storage with fast access times.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,963

-

-

-

-

Digiode

USA . 2,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,918

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 287 parts In-Stock

1+ parts

$0.227

100+ parts

-

1k+ parts

-

10k+ parts

$0.218

287

$0.227

-

-

$0.218

Northwest PG Solutions

USA . 1,592 parts In-Stock

1+ parts

$0.249

100+ parts

-

1k+ parts

-

10k+ parts

$0.220

1,592

$0.249

-

-

$0.220

Parana Technologies

USA . 2,040 parts In-Stock

1+ parts

$4.833

100+ parts

$448.790

1k+ parts

$4.349

10k+ parts

-

2,040

$4.833

$448.790

$4.349

-

DigiPath Technology Company

USA . 604 parts In-Stock

1+ parts

$5.321

100+ parts

-

1k+ parts

-

10k+ parts

-

604

$5.321

-

-

-

IDEA Electronic Components Group

UK . 1,861 parts In-Stock

1+ parts

$5.430

100+ parts

-

1k+ parts

$4.887

10k+ parts

-

1,861

$5.430

-

$4.887

-

ChromeModa Solutions

Germany . 1,800 parts In-Stock

1+ parts

$5.430

100+ parts

$4.453

1k+ parts

-

10k+ parts

-

1,800

$5.430

$4.453

-

-

One Stop Electronics

USA . 213 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$6.000

-

-

-

AZTECH Wire

Italy . 224 parts In-Stock

1+ parts

$6.626

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$6.626

-

-

-

Corphita

USA . 2,021 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,021

-

-

-

-

Overview

Unlock the power of secure and reliable data storage with the Texas Instruments CMS212-200 OTP ROM. Manufactured by a trusted industry leader, this device offers a seamless asynchronous operating mode with common input/output type, making it ideal for a wide range of applications. With its 256K x 16 organization and 3-STATE output characteristics, this product provides unmatched value and benefits to customers seeking high-quality memory solutions. Upgrade your projects with the CMS212-200 and experience the advantage of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Operating Mode: ASYNCHRONOUS

Allows for independent operation without needing synchronization, providing flexibility in usage.

Input/Output Type: COMMON

Simplifies connectivity and compatibility with other devices, making integration easier.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage level ensures easy compatibility with most systems and components.

No. of Terminals: 60

Provides ample connectivity options for various circuits and peripherals.

Maximum Operating Temperature: 55 °C

Wide temperature range allows for reliable operation in various environmental conditions.

Organization: 256KX16

Efficient organization of memory cells for optimal performance and storage capacity.

Memory IC Type: OTP ROM

One-Time Programmable Read-Only Memory offers secure and permanent data storage, ideal for critical applications.

Technical Specifications

OTP ROM CMS212-200 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

200 ns

Input/Output Type:

COMMON

JESD-30 Code:

X-XXMA-X60

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

60

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

CARD60

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.028 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

UNSPECIFIED

Terminal Position:

UNSPECIFIED

Trade Compliance

CMS212-200 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 11