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CMS210-250

Texas Instruments

CMS210-250 by Texas Instruments

Texas Instruments' CMS210-250 is a 128KX16 OTP ROM with 60 terminals. Operating asynchronously at 5V, it offers 3-STATE output and supports parallel mode. Ideal for commercial applications, this CMOS technology microelectronic assembly has a max access time of 250ns.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,268 parts In-Stock

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Vyrian

USA . 3,732 parts In-Stock

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Native Components

USA . 749 parts In-Stock

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$0.198

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$0.190

749

$0.198

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$0.190

Northwest PG Solutions

USA . 1,355 parts In-Stock

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$0.218

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$0.192

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$0.218

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Parana Technologies

USA . 1,070 parts In-Stock

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$2.805

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$3.291

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$2.805

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DigiPath Technology Company

USA . 981 parts In-Stock

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$3.089

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$2.842

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981

$3.089

$2.842

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ChromeModa Solutions

Germany . 6,701 parts In-Stock

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$3.152

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$2.585

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$3.152

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IDEA Electronic Components Group

UK . 1,336 parts In-Stock

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$3.152

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$2.837

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AZTECH Wire

Italy . 573 parts In-Stock

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$13.794

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One Stop Electronics

USA . 1,232 parts In-Stock

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$17.000

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Corphita

USA . 4,802 parts In-Stock

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Overview

Unlock the power of reliable and high-quality memory solutions with the Texas Instruments CMS210-250 OTP ROM. Manufactured by a trusted leader in the industry, this device offers unparalleled performance and versatility for a wide range of applications. Whether you're designing consumer electronics, industrial equipment, or automotive systems, this OTP ROM provides the perfect solution with its 128KX16 organization, 3-STATE output characteristics, and fast access time of 250 ns. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations and adds value to your projects.

Feature Benefit Bullets

Operating Mode: ASYNCHRONOUS

Allows for independent operation without requiring synchronization, providing flexibility in usage scenarios.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply ensures compatibility with most electronic systems.

No. of Terminals: 60

Sufficient number of terminals for connection to various components in a system.

Organization: 128KX16

Organized as 128K words of 16 bits each, allowing for efficient data storage and retrieval.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Memory IC Type: OTP ROM

One-Time Programmable Read-Only Memory ensures data security and integrity by preventing unwanted modifications.

Technical Specifications

OTP ROM CMS210-250 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

250 ns

Input/Output Type:

COMMON

JESD-30 Code:

X-XXMA-X60

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

60

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX16

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

CARD60

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.014 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

UNSPECIFIED

Terminal Position:

UNSPECIFIED

Trade Compliance

CMS210-250 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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