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BQ2024DBZR

Texas Instruments

BQ2024DBZR by Texas Instruments

BQ2024DBZR by Texas Instruments is an OTP ROM with 1.5KX1 organization, operating at 2.7V nominal voltage and 3/5V power supplies. It features a small outline package style and is suitable for applications requiring low power consumption and non-volatile memory storage in compact electronic devices.

Median Price

$1.337

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,068 parts In-Stock

1+ parts

$1.700

100+ parts

$1.490

1k+ parts

$1.370

10k+ parts

$1.270

2,068

$1.700

$1.490

$1.370

$1.270

Rochester

USA . 37,900 parts In-Stock

1+ parts

-

100+ parts

$1.170

1k+ parts

$0.971

10k+ parts

$0.866

37,900

-

$1.170

$0.971

$0.866

DigiKey

USA . 37,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.460

10k+ parts

-

37,900

-

-

$1.460

-

Verical

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.214

10k+ parts

$1.082

30,000

-

-

$1.214

$1.082

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,450 parts In-Stock

1+ parts

$0.791

100+ parts

-

1k+ parts

-

10k+ parts

-

1,450

$0.791

-

-

-

Vyrian

USA . 23,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,198

-

-

-

-

VNN

France . 2,706 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,706

-

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 24,614 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

24,614

$0.710

-

-

-

Semicontronic

India . 24,561 parts In-Stock

1+ parts

$0.710

100+ parts

$0.692

1k+ parts

$0.689

10k+ parts

-

24,561

$0.710

$0.692

$0.689

-

Corohmni

South Africa . 250 parts In-Stock

1+ parts

$0.713

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$0.713

-

-

-

Corphita

USA . 4,174 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

-

10k+ parts

-

4,174

$0.750

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$0.827

100+ parts

$0.761

1k+ parts

$0.713

10k+ parts

-

1,000

$0.827

$0.761

$0.713

-

Parana Technologies

USA . 1,487 parts In-Stock

1+ parts

$4.445

100+ parts

-

1k+ parts

$4.872

10k+ parts

-

1,487

$4.445

-

$4.872

-

DigiPath Technology Company

USA . 1,382 parts In-Stock

1+ parts

$4.894

100+ parts

$4.503

1k+ parts

-

10k+ parts

-

1,382

$4.894

$4.503

-

-

ChromeModa Solutions

Germany . 6,771 parts In-Stock

1+ parts

$4.994

100+ parts

$4.095

1k+ parts

-

10k+ parts

-

6,771

$4.994

$4.095

-

-

IDEA Electronic Components Group

UK . 403 parts In-Stock

1+ parts

$4.994

100+ parts

-

1k+ parts

$4.495

10k+ parts

-

403

$4.994

-

$4.495

-

Microchip USA

USA . 4,091 parts In-Stock

1+ parts

$6.182

100+ parts

-

1k+ parts

-

10k+ parts

-

4,091

$6.182

-

-

-

Kepictronics

USA . 6,294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,294

-

-

-

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A-Z Elektronik GmbH

Germany . 5,414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,414

-

-

-

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Argo Parts USA

USA . 4,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,470

-

-

-

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Continental Prestige Electronics

USA . 1,909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,909

-

-

-

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Alle Elektronik GmbH

Germany . 1,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,216

-

-

-

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Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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40

-

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-

-

Overview

Unlock the power of reliable and efficient memory storage with the BQ2024DBZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and innovation in every product they create. The BQ2024DBZR falls under the OTP ROM category, offering a secure and permanent storage solution for a wide range of applications. With a small outline, thin profile package style, and common input/output type, this device is versatile and user-friendly. Trust Texas Instruments to provide you with a high-performance product that exceeds your expectations, making your projects more efficient and reliable. Elevate your technology with the BQ2024DBZR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and light weight, making it ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and integrate into existing designs.

Operating Mode: ASYNCHRONOUS

The asynchronous operation mode provides flexibility in timing and control, allowing for versatile use in different systems.

Input/Output Type: COMMON

The common input/output type simplifies connections and communication with other components, enhancing overall efficiency.

Nominal Supply Voltage / Vsup (V): 2.7

The low nominal supply voltage of 2.7V helps in minimizing power consumption, making it suitable for portable devices.

Power Supplies (V): 3/5

The multiple power supply options of 3V and 5V offer compatibility with a wide range of systems and voltage requirements.

No. of Terminals: 3

With only 3 terminals, this product is easy to interface and can be quickly integrated into circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space and allows for high-density mounting, perfect for compact electronics.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in demanding environments.

Organization: 1.5KX1

The organization of 1.5KX1 provides a good balance between memory capacity and speed for efficient data storage.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics offer flexibility in interfacing with different types of devices and circuits.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20°C, this product can withstand low temperatures, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold ensures reliable connections and resistance to corrosion, prolonging the lifespan of the product.

Terminal Position: DUAL

The dual terminal position provides enhanced stability and secure connections in the circuit.

Maximum Seated Height: 1.12 mm

The low maximum seated height of 1.12 mm allows for slim and compact designs, ideal for space-constrained applications.

Maximum Clock Frequency (fCLK): 0.01667 MHz

The maximum clock frequency of 0.01667 MHz ensures efficient data transfer and processing speeds.

Width: 1.3 mm

The width of 1.3 mm enables easy integration into tight spaces and compact designs.

Minimum Supply Voltage (Vsup): 2.65 V

The low minimum supply voltage of 2.65V ensures reliable operation even under low power conditions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure and durable soldering during assembly processes.

Length: 2.92 mm

The length of 2.92 mm provides a compact form factor, suitable for miniaturized electronic devices.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it energy-efficient and reliable.

Parallel or Serial: SERIAL

The serial interface allows for simple and efficient data transfer and communication within the system.

Terminal Form: GULL WING

The gull wing terminal form provides stability and ease of soldering during installation, ensuring secure connections.

Maximum Supply Current: 0.02 mA

The low maximum supply current of 0.02 mA helps in reducing power consumption and extending battery life in portable devices.

No. of Words: 1536 words

The 1536 words memory capacity offers ample storage space for data, codes, and instructions, making it suitable for various applications.

Terminal Pitch: 0.95 mm

The terminal pitch of 0.95 mm allows for easy connections and soldering, simplifying the assembly process.

No. of Words Code: 1.5K

The 1.5K words code provides a clear indication of the memory capacity and organization, aiding in system integration and compatibility.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V offers flexibility in power supply options and compatibility with a wide range of systems.

Memory Density: 1536 bit

The memory density of 1536 bits offers efficient data storage and retrieval capabilities, enhancing overall system performance.

Memory IC Type: OTP ROM

The OTP ROM memory IC type provides non-volatile storage for critical data and instructions, ensuring data integrity and security.

Technical Specifications

OTP ROM BQ2024DBZR attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Additional Features:

ORGANIZED AS 6 PAGES OF 32 BYTES EACH

Maximum Clock Frequency (fCLK):

.01667 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.92 mm

Memory Density:

1536 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

3

No. of Words:

1536 words

No. of Words Code:

1.5K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

1.5KX1

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

OTP ROMs

Maximum Supply Current:

.02 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.3 mm

Trade Compliance

BQ2024DBZR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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