Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BQ2024DBZR by Texas Instruments is an OTP ROM with 1.5KX1 organization, operating at 2.7V nominal voltage and 3/5V power supplies. It features a small outline package style and is suitable for applications requiring low power consumption and non-volatile memory storage in compact electronic devices.
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$1.460
Verical
$1.214
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Digiode
$0.791
Vyrian
VNN
Nova Conductors
Ampacity Inc.
$0.710
Semicontronic
$0.692
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$0.713
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$0.750
Advanced Electronics
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DigiPath Technology Company
$4.894
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ChromeModa Solutions
$4.994
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IDEA Electronic Components Group
$4.495
Microchip USA
$6.182
Kepictronics
A-Z Elektronik GmbH
Argo Parts USA
Continental Prestige Electronics
Alle Elektronik GmbH
Bastille Electronics
The use of plastic/epoxy material ensures durability and light weight, making it ideal for various applications.
Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.
The rectangular shape of the package makes it easy to handle and integrate into existing designs.
The asynchronous operation mode provides flexibility in timing and control, allowing for versatile use in different systems.
The common input/output type simplifies connections and communication with other components, enhancing overall efficiency.
The low nominal supply voltage of 2.7V helps in minimizing power consumption, making it suitable for portable devices.
The multiple power supply options of 3V and 5V offer compatibility with a wide range of systems and voltage requirements.
With only 3 terminals, this product is easy to interface and can be quickly integrated into circuit designs.
The small outline, thin profile, and shrink pitch package style saves space and allows for high-density mounting, perfect for compact electronics.
The high maximum operating temperature of 70°C ensures reliable performance even in demanding environments.
The organization of 1.5KX1 provides a good balance between memory capacity and speed for efficient data storage.
The open-drain output characteristics offer flexibility in interfacing with different types of devices and circuits.
With a minimum operating temperature of -20°C, this product can withstand low temperatures, making it suitable for a wide range of applications.
The terminal finish of nickel/palladium/gold ensures reliable connections and resistance to corrosion, prolonging the lifespan of the product.
The dual terminal position provides enhanced stability and secure connections in the circuit.
The low maximum seated height of 1.12 mm allows for slim and compact designs, ideal for space-constrained applications.
The maximum clock frequency of 0.01667 MHz ensures efficient data transfer and processing speeds.
The width of 1.3 mm enables easy integration into tight spaces and compact designs.
The low minimum supply voltage of 2.65V ensures reliable operation even under low power conditions.
The high peak reflow temperature of 260°C ensures secure and durable soldering during assembly processes.
The length of 2.92 mm provides a compact form factor, suitable for miniaturized electronic devices.
The CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it energy-efficient and reliable.
The serial interface allows for simple and efficient data transfer and communication within the system.
The gull wing terminal form provides stability and ease of soldering during installation, ensuring secure connections.
The low maximum supply current of 0.02 mA helps in reducing power consumption and extending battery life in portable devices.
The 1536 words memory capacity offers ample storage space for data, codes, and instructions, making it suitable for various applications.
The terminal pitch of 0.95 mm allows for easy connections and soldering, simplifying the assembly process.
The 1.5K words code provides a clear indication of the memory capacity and organization, aiding in system integration and compatibility.
The high maximum supply voltage of 5.5V offers flexibility in power supply options and compatibility with a wide range of systems.
The memory density of 1536 bits offers efficient data storage and retrieval capabilities, enhancing overall system performance.
The OTP ROM memory IC type provides non-volatile storage for critical data and instructions, ensuring data integrity and security.
OTP ROM BQ2024DBZR attributes and parameters. Explore more OTP ROM devices from Texas Instruments
Additional Features:
Maximum Clock Frequency (fCLK):
Input/Output Type:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
BQ2024DBZR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N2222A
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
DP83848IVVX/NOPB
Texas Instruments
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
1N4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
STMicroelectronics
Hitano Enterprise
Vicor
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
Kec
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
SMBJ18CA
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
5962-01-214-2161
Texas Instruments' 5962-01-214-2161 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
TBP28L86AMJW
TBP28L86AMJW by Texas Instruments is a 1KX8 OTP ROM with 8192 bit memory density. It operates at 5V, has a max access time of 200ns, and is designed for military-grade applications. The package style is in-line, with a rectangular shape and ceramic, glass-sealed body material.
AT27C512R-45JU-T
Microchip Technology's AT27C512R-45JU-T is a 64KX8 OTP ROM with 45 ns access time, operating at 5V. It features 3-STATE output characteristics and supports parallel interface. Ideal for industrial applications requiring non-volatile memory storage in compact form factor.
5962-01-142-7326
Texas Instruments' 5962-01-142-7326 is a 32X8 OTP ROM with 5V supply, 16 terminals, and 40ns access time. Ideal for commercial applications, it features TTL technology in a rectangular plastic/epoxy package with through-hole terminals.
TBP24SA41NP3
TBP24SA41NP3 by Texas Instruments is a 1KX4 OTP ROM memory IC with 4096-bit memory density. It operates at temperatures b/w 0°C to 70°C, featuring a max access time of 60 ns. This device, housed in an IN-LINE package style, is ideal for applications requiring reliable non-volatile memory storage in commercial-grade environments.
AT27C256R-45JU
Atmel
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
CY27C256A-70ZC
Cypress Semiconductor
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 32KX8;
TBP24S10N1
TBP24S10N1 by Texas Instruments is a 256x4 OTP ROM with 1024-bit memory density. It operates at 5V, has a max access time of 55ns, and supports TTL technology. This rectangular package with 16 terminals is ideal for commercial applications requiring non-volatile memory storage.
5962-01-188-9094
Texas Instruments' 5962-01-188-9094 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
BQ2022LPR
BQ2022LPR by Texas Instruments is an OTP ROM with 1KX1 organization, operating at 2.7V and featuring a max clock frequency of 0.01667 MHz. It is commonly used in applications requiring low power consumption and secure non-volatile memory storage.
AT27C512R-45TU
Atmel's AT27C512R-45TU is a 64KX8 OTP ROM with 45 ns access time, operating at 5V. It features a small outline package, suitable for industrial applications. With 524288-bit memory density and parallel interface, it offers reliable non-volatile storage solutions.
DS2502X1
Maxim Integrated
DS2502X1 by Maxim Integrated is a 1024-bit OTP ROM with 128x8 organization. Operating at 5V, it has a max access time of 15000ns and operates in asynchronous mode. Commonly used in industrial applications due to its very thin profile grid array package style.
CMS210-200
Texas Instruments' CMS210-200 is a 128KX16 OTP ROM with 131072 words. Operating asynchronously at 5V, it features a max access time of 200ns and memory density of 2097152 bits. Ideal for applications requiring non-volatile memory storage in commercial temperature grades.
SN74S188NP3
SN74S188NP3 by Texas Instruments is a 32x8 OTP ROM with 40ns max access time, operating at 5V. It has 16 terminals in an IN-LINE package style and uses TTL technology. Ideal for commercial applications requiring non-volatile memory storage.
5962-01-186-0381
Texas Instruments' 5962-01-186-0381 is a MILITARY-grade OTP ROM with 512x8 organization, 4096-bit memory density, and 85ns max access time. It operates b/w -55 to 125 °C and has a package style of IN-LINE. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
SN74S3708NP1
SN74S3708NP1 by Texas Instruments is a 1Kx8 OTP ROM with 8192-bit memory density. Operating b/w 0°C to 70°C, it features TTL technology and through-hole terminal form. This rectangular package with 24 terminals is ideal for commercial applications requiring non-volatile memory storage.
SN74S188J
SN74S188J by Texas Instruments is a 32x8 OTP ROM with 40ns max access time. Operating at 5V, it has 16 terminals in an IN-LINE package style. Ideal for commercial applications requiring fast memory retrieval and a temperature range of 0-70°C.
AT27C020-90JU
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Width: 11.43 mm;
AT27C256R-55PC
Atmel's AT27C256R-55PC is a 32Kx8 OTP ROM with 55ns access time, operating at 5V. It features 3-STATE output and through-hole terminal form. Commonly used in commercial applications requiring non-volatile memory storage.
DS2406P+
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Package Equivalence Code: SOC6,.17;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
BQ2022ALPR
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Peak Reflow Temperature (C): NOT SPECIFIED;
BQ2022ADBZR
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Power Supplies (V): 3/5;
BQ2022ADBZRG4
BQ2022ADBZRG4 by Texas Instruments is an OTP ROM with 1KX1 organization, operating at 2.7V nominal voltage. It features a small outline package style and operates in serial mode. Ideal for applications requiring low power consumption and compact design in temperature-sensitive environments.
BQ2026DBZR
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.65 V;
BQ2026LPR
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Maximum Supply Voltage (Vsup): 5.5 V;
BQ2022ALPRE3
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Terminal Finish: MATTE TIN;
BQ2022DBZR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
BQ2022DBZRG4
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Memory Width: 1;
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Maximum Clock Frequency (fCLK): .01667 MHz;
BQ2022LPRE3
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Minimum Operating Temperature: -20 Cel;
BQ2024DBZRG4
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .95 mm;
BQ2024LPR
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Additional Features: ORGANIZED AS 6 PAGES OF 32 BYTES EACH;
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