Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
BQ2022ADBZRG4 by Texas Instruments is an OTP ROM with 1KX1 organization, operating at 2.7V nominal voltage. It features a small outline package style and operates in serial mode. Ideal for applications requiring low power consumption and compact design in temperature-sensitive environments.
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PLASTIC/EPOXY - This material provides durability and protection for the ROM.
YES - Allows for easy and secure mounting on circuit boards.
RECTANGULAR - Fits well with standard designs and layouts for electronic components.
ASYNCHRONOUS - Provides flexibility in accessing data without needing a clock signal.
COMMON - Simplifies interfacing with other components in the system.
2.7 - Ideal operating voltage for reliable performance.
3/5 - Offers compatibility with multiple power supply options.
3 - Simple and straightforward connectivity for integration into circuits.
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Saves space and allows for denser circuit designs.
70 °C - Ensures stable performance under varying environmental conditions.
1KX1 - Offers a balanced ratio of memory capacity and access efficiency.
OPEN-DRAIN - Facilitates easy connection to other circuits and devices.
20 °C - Ensures reliable operation even in extreme cold conditions.
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) - Provides corrosion resistance and excellent conductivity.
DUAL - Allows for versatile placement on circuit boards.
1.12 mm - Low profile design for compact electronic systems.
0.01667 MHz - Suitable for low-speed applications requiring basic data access.
1.3 mm - Space-saving design for efficient PCB layout.
2.65 V - Ensures stable operation even at lower voltage levels.
260 - Suitable for high-temperature soldering processes.
2.92 mm - Compact size for fitting into tight spaces on circuit boards.
CMOS - Offers low power consumption and compatibility with modern digital systems.
SERIAL - Enables efficient data transfer and access for various applications.
GULL WING - Easy to solder and secure connectivity on PCBs.
0.02 mA - Low power consumption for energy-efficient operation.
1024 words - Sufficient memory capacity for storing essential data.
0.95 mm - Allows for precise and secure connection with other components.
1K - Indicates the memory capacity in a concise format.
5.5 V - Support for higher voltage levels for compatibility with different systems.
1024 bit - Provides ample storage capacity for critical information.
OTP ROM - Offers non-volatile memory storage for essential data retention.
OTP ROM BQ2022ADBZRG4 attributes and parameters. Explore more OTP ROM devices from Texas Instruments
Additional Features:
Maximum Clock Frequency (fCLK):
Input/Output Type:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
BQ2022ADBZRG4 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - BQ2022A Datasheet Update 28/Jan/2015
PCN Assembly/Origin - Qualification Assembly/Test Site 03/Mar/2014
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
STM32H743XIH6
STMicroelectronics
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
1N4148
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
2N2222A
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
SS14
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Transys Electronics
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Semitronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1554216002
Molex
WIRE AND CABLE;
SMBJ18CA
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM2675M-ADJ/NOPB
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
TBP28L46JW
TBP28L46JW by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 95ns and operates in parallel mode. Ideal for commercial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
CY27C256A-45ZC
Rochester Electronics
CY27C256A-45ZC by Rochester Electronics is a 262144-bit OTP ROM with 32KX8 organization and 45 ns access time. Operating at 5V, it offers 32768 words of memory in a small outline package for commercial applications requiring fast parallel data retrieval.
SN54S475W
SN54S475W by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 85ns max access time. It operates in a temperature range of -55 to 125°C, making it suitable for military-grade applications requiring fast data retrieval. This TTL technology-based device comes in a ceramic flatpack package with 24 terminals for surface mount installation.
BQ2026LPR
BQ2026LPR by Texas Instruments is an OTP ROM with 1.5KX1 organization, operating in asynchronous mode at 3/5V. It features a memory density of 1536 bits and operates serially at a max clock frequency of 0.01667 MHz. This IC is commonly used for applications requiring non-volatile memory storage in devices with limited space constraints.
JBP18SA46MJ
JBP18SA46MJ by Texas Instruments is a MILITARY-grade OTP ROM with 512x8 organization and 4096-bit memory density. Featuring a max operating temperature of 125°C, it has an access time of 85ns. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
AT27LV020A-12JU
Atmel
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;
DM74S288AN
DM74S288AN by National Semiconductor is a 256-bit OTP ROM with 32x8 organization. It operates asynchronously at 5V, with a max access time of 25ns. Suitable for applications requiring fast and reliable non-volatile memory storage in commercial-grade environments.
JBP18S030MW
Texas Instruments JBP18S030MW is a 256-bit OTP ROM with 32x8 organization, operating at 5V. It features a max access time of 50ns, suitable for military-grade applications requiring fast and reliable non-volatile memory storage in harsh environments. The package style is flatpack with ceramic and glass-sealed body material, making it ideal for surface-mount designs in compact spaces.
FM27C256V90
Fairchild Semiconductor
FM27C256V90 by Fairchild Semiconductor is a 32KX8 OTP ROM with 3-STATE output, operating at 5V. It features a max access time of 90ns and memory density of 262144 bit. Commonly used in commercial applications requiring non-volatile memory storage.
TBP24SA41N3
TBP24SA41N3 by Texas Instruments is a 1KX4 OTP ROM memory IC with 4096-bit density and 60ns access time. It operates b/w 0-70°C, featuring TTL technology in an 18-terminal rectangular package for commercial applications.
TBP24SA81JP4
TBP24SA81JP4 by Texas Instruments is a 2Kx4 OTP ROM with 8192-bit memory density and 70ns max access time. It features a ceramic rectangular package with 18 terminals in an in-line style, suitable for commercial temperature grade applications.
TBP24SA81-55NP3
TBP24SA81-55NP3 by Texas Instruments is a 2Kx4 OTP ROM with 8192-bit memory density and 55ns max access time. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring fast data retrieval in a compact IN-LINE package style.
AT27C1024-45JU-T
Microchip Technology
AT27C1024-45JU-T by Microchip Technology is a 64KX16 OTP ROM with 45 ns access time, operating at 5V. It features a 3-STATE output and supports parallel programming. Ideal for industrial applications requiring non-volatile memory with fast read times and low standby current consumption.
JBP28L86AMJ
JBP28L86AMJ by Texas Instruments is a MILITARY-grade OTP ROM with 1KX8 organization, 8192 bit memory density, and 175 ns max access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
5962-01-141-4360
Texas Instruments' 5962-01-141-4360 is a 32X8 OTP ROM with 16 terminals and a supply voltage of 5V. It operates b/w 0 to 70°C, has a max access time of 40ns, and consumes up to 110mA. Ideal for commercial applications requiring reliable memory storage in a rectangular plastic/epoxy package.
AT27LV040A-90JI
AT27LV040A-90JI by Atmel is a 512Kx8 OTP ROM chip with 3.3V nominal voltage, operating in asynchronous mode with 90ns access time. It features 32 terminals in a rectangular chip carrier package and is ideal for industrial applications requiring reliable non-volatile memory storage.
TBP28L42N
TBP28L42N by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 95ns and operates in parallel mode. This rectangular package IC is ideal for commercial applications requiring non-volatile memory storage.
TBP24S81NP1
TBP24S81NP1 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density. It operates at temperatures b/w 0-70°C and has a max access time of 70ns. Ideal for commercial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
JBP28SA86-60MJ
JBP28SA86-60MJ by Texas Instruments is a MILITARY-grade OTP ROM with 1KX8 organization, 8192-bit memory density, and 60 ns max access time. It operates b/w -55 to 125 °C and is ideal for applications requiring reliable non-volatile memory storage in harsh environments.
SN74S472J4
SN74S472J4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at 5V, has a max access time of 75ns, and supports TTL technology. This rectangular ceramic package with 20 terminals is ideal for commercial applications requiring non-volatile memory storage.
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TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
BQ2022ALPR
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Peak Reflow Temperature (C): NOT SPECIFIED;
BQ2022ADBZR
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Power Supplies (V): 3/5;
BQ2024DBZR
BQ2024DBZR by Texas Instruments is an OTP ROM with 1.5KX1 organization, operating at 2.7V nominal voltage and 3/5V power supplies. It features a small outline package style and is suitable for applications requiring low power consumption and non-volatile memory storage in compact electronic devices.
BQ2026DBZR
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.65 V;
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Maximum Supply Voltage (Vsup): 5.5 V;
BQ2022ALPRE3
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Terminal Finish: MATTE TIN;
BQ2022DBZR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
BQ2022DBZRG4
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Memory Width: 1;
BQ2022LPR
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Maximum Clock Frequency (fCLK): .01667 MHz;
BQ2022LPRE3
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Minimum Operating Temperature: -20 Cel;
BQ2024DBZRG4
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .95 mm;
BQ2024LPR
OTP ROM; Temperature Grade: OTHER; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Additional Features: ORGANIZED AS 6 PAGES OF 32 BYTES EACH;
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