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BQ2022LPR

Texas Instruments

BQ2022LPR by Texas Instruments

BQ2022LPR by Texas Instruments is an OTP ROM with 1KX1 organization, operating at 2.7V and featuring a max clock frequency of 0.01667 MHz. It is commonly used in applications requiring low power consumption and secure non-volatile memory storage.

Median Price

$3.930

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$3.930

1k+ parts

$3.520

10k+ parts

$3.310

15

-

$3.930

$3.520

$3.310

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,915 parts In-Stock

1+ parts

$4.161

100+ parts

-

1k+ parts

-

10k+ parts

-

1,915

$4.161

-

-

-

Vyrian

USA . 4,362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,362

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 972 parts In-Stock

1+ parts

$2.601

100+ parts

-

1k+ parts

$3.092

10k+ parts

-

972

$2.601

-

$3.092

-

DigiPath Technology Company

USA . 820 parts In-Stock

1+ parts

$2.865

100+ parts

-

1k+ parts

-

10k+ parts

-

820

$2.865

-

-

-

ChromeModa Solutions

Germany . 2,930 parts In-Stock

1+ parts

$2.923

100+ parts

$2.397

1k+ parts

-

10k+ parts

-

2,930

$2.923

$2.397

-

-

IDEA Electronic Components Group

UK . 2,135 parts In-Stock

1+ parts

$2.923

100+ parts

-

1k+ parts

$2.631

10k+ parts

-

2,135

$2.923

-

$2.631

-

Corphita

USA . 1,194 parts In-Stock

1+ parts

$3.942

100+ parts

-

1k+ parts

-

10k+ parts

-

1,194

$3.942

-

-

-

Component Stockers USA

USA . 10 parts In-Stock

1+ parts

$4.430

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$4.430

-

-

-

AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$20.170

100+ parts

-

1k+ parts

-

10k+ parts

-

647

$20.170

-

-

-

Native Components

USA . 388 parts In-Stock

1+ parts

$584.960

100+ parts

$573.261

1k+ parts

$567.411

10k+ parts

$561.562

388

$584.960

$573.261

$567.411

$561.562

Northwest PG Solutions

USA . 692 parts In-Stock

1+ parts

$643.456

100+ parts

-

1k+ parts

-

10k+ parts

-

692

$643.456

-

-

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

-

-

-

-

Microchip USA

USA . 397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

397

-

-

-

-

Overview

Unlock the power of reliable data storage with the BQ2022LPR by Texas Instruments. Crafted with precision and expertise, this OTP ROM device offers unparalleled quality and performance. Its versatile applications make it a valuable asset in various industries. Experience seamless operation and peace of mind knowing your data is secure. Trust in Texas Instruments for top-notch solutions that exceed expectations. Elevate your projects with the BQ2022LPR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Operating Mode: ASYNCHRONOUS

Supports asynchronous operation, allowing for flexibility and efficient data access.

Nominal Supply Voltage / Vsup (V): 2.7

Low nominal supply voltage helps in reducing power consumption, making the product energy-efficient.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliability in various environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the performance of the product.

Memory Density: 1024 bit

With a high memory density of 1024 bit, the product can store a large amount of data in a compact form factor.

Technical Specifications

OTP ROM BQ2022LPR attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Additional Features:

ORGANIZED AS 4 PAGES OF 32 BYTES EACH

Maximum Clock Frequency (fCLK):

.01667 MHz

Input/Output Type:

COMMON

JESD-30 Code:

O-PBCY-W3

JESD-609 Code:

e3

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

3

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

1KX1

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

Package Style (Meter):

CYLINDRICAL

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

.02 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

WIRE

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Trade Compliance

BQ2022LPR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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