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M27W101-80K6TR

STMicroelectronics

M27W101-80K6TR by STMicroelectronics

STMicroelectronics M27W101-80K6TR is an OTP ROM with 128KX8 organization, 131072 words, and 1048576 bit memory density. It operates in asynchronous mode with a max access time of 80 ns. Commonly used in industrial applications due to its CMOS technology and 3-STATE output characteristics.

Median Price

$1.549

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,837 parts In-Stock

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5,837

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Cyclops Electronics Ltd

UK . 4,210 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,750 parts In-Stock

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3,750

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Anansix

USA . 2,356 parts In-Stock

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2,356

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Digiode

USA . 1,848 parts In-Stock

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1,848

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Component Sense

UK . 155 parts In-Stock

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$1.549

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$1.549

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$1.549

155

-

$1.549

$1.549

$1.549

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 304 parts In-Stock

1+ parts

$2.000

100+ parts

-

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304

$2.000

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Aztec Data Supply Inc.

USA . 4,670 parts In-Stock

1+ parts

$3.090

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-

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4,670

$3.090

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IDEA Electronic Components Group

UK . 597 parts In-Stock

1+ parts

$3.570

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-

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$3.213

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597

$3.570

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$3.213

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Corohmni

South Africa . 131 parts In-Stock

1+ parts

$4.474

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131

$4.474

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MKK Technologies

India . 855 parts In-Stock

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$6.712

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855

$6.712

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DigiPath Technology Company

USA . 855 parts In-Stock

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$6.712

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855

$6.712

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Microchip USA

USA . 295 parts In-Stock

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$12.498

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295

$12.498

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AZTECH Wire

Italy . 294 parts In-Stock

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$13.099

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294

$13.099

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Perfect Parts

USA . 37,654 parts In-Stock

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,591 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,394 parts In-Stock

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Kepictronics

USA . 4,210 parts In-Stock

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Argo Parts USA

USA . 4,166 parts In-Stock

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Corphita

USA . 2,863 parts In-Stock

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Continental Prestige Electronics

USA . 2,656 parts In-Stock

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Parana Technologies

USA . 2,202 parts In-Stock

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$4.268

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$4.268

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Cyclops Electronics Ltd (Excess)

UK . 1,810 parts In-Stock

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Lixinc

USA . 1,479 parts In-Stock

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1,479

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Glotronic Ltd.

UK . 1,448 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Unlock the power of reliable and efficient data storage with the M27W101-80K6TR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics offers unparalleled quality and performance in OTP ROM technology. Whether used in industrial automation, consumer electronics, or automotive applications, this versatile product provides a seamless solution for your memory needs. With a wide operating temperature range and low power consumption, the M27W101-80K6TR delivers value and reliability to customers looking to optimize their systems. Experience the benefits of cutting-edge technology with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the ROM chip, ensuring long-term reliability.

Operating Mode: ASYNCHRONOUS

Allows for independent operation without requiring synchronization with external signals, offering flexibility in use.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level, making it compatible with many systems and easy to integrate.

No. of Terminals: 32

Offers sufficient connectivity options for interfacing with other components or systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments or applications.

Organization: 128KX8

Provides a good balance of memory organization, suitable for various data storage and retrieval needs.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and reliable performance.

No. of Words: 131072 words

Ample memory capacity for storing a large number of data words.

Memory IC Type: OTP ROM

Uses OTP (One-Time Programmable) technology, ensuring data security and preventing accidental changes to the stored information.

Maximum Access Time: 80 ns

Offers fast access to data, suitable for applications where quick response times are critical.

Technical Specifications

OTP ROM M27W101-80K6TR attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

80 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.000015 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

M27W101-80K6TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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