Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M27W016100M1 by STMicroelectronics is a 16Mb OTP ROM with a 3.6V max supply voltage and operates asynchronously. It features a compact SO package, ideal for space-constrained applications, and offers fast access times of up to 100 ns. This device is perfect for embedded systems requiring reliable memory solutions.
Median Price
$1.406
Lifecycle Status
Suppliers In-Stock
5
In-Stock Inventory
1k+
Vyrian
1+ parts
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100+ parts
1k+ parts
10k+ parts
Anansix
Digiode
Bristol Electronics
$0.844
Microfarads
IDEA Electronic Components Group
$2.175
$1.957
MKK Technologies
$4.090
DigiPath Technology Company
A-Z Elektronik GmbH
Alle Elektronik GmbH
Corphita
Parana Technologies
$2.600
The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, providing reliable protection for the internal components.
Surface mount capability allows for efficient use of board space and enables easier assembly in automated processes, making it a convenient choice for modern electronics.
Rectangular package shape optimizes space on printed circuit boards (PCBs) allowing for better layout and design flexibility.
Asynchronous operation enhances performance by allowing the device to operate independently of the system clock, simplifying integration into various applications.
Common I/O type offers compatibility with a wide range of electronic systems, making this OTP ROM versatile for various applications.
A nominal supply voltage of 3V aligns with standard low-power electronic components, contributing to energy efficiency.
Support for both 3V and 3.3V power supplies provides flexibility in circuit design, accommodating different requirements.
With 44 terminals, this device supports a wide range of connections, enabling greater functionality and more complex circuit designs.
The small outline package style saves space on PCBs and allows for a compact design in consumer electronics and embedded systems.
The maximum operating temperature of 70 °C ensures reliable performance in a variety of environments, making it suitable for commercial applications.
This organization provides a balance of density and accessibility, enabling efficient data management within the memory.
3-state output characteristics allow the device to effectively manage data bus systems, preventing bus contention and improving overall performance.
The minimum operating temperature of 0 °C allows for reliable functionality in varied cooling environments, expanding its application range.
Matte tin terminal finish provides excellent solderability and reduces the risk of oxidation, ensuring a strong electrical connection.
Dual terminal positioning allows for flexible board layout designs, accommodating different types of PCB configurations.
A low seated height of 3 mm aids in low-profile applications where space is critical, making it a good choice for compact device designs.
At a width of 12.6 mm, this ROM is designed to fit snugly in tight spaces without compromising performance.
Support for a minimum supply voltage of 2.7V ensures compatibility with a variety of power sources, further enhancing flexibility in applications.
The length of 28.5 mm provides an optimal size for integration into standard electronic assemblies, ensuring convenience in design processes.
Rated for commercial temperature conditions, this device is suitable for a wide range of everyday applications without compromising reliability.
Using CMOS technology ensures low power consumption and high-speed operation, which are critical for modern electronic devices.
Parallel access allows for faster data retrieval and improved performance, making it ideal for applications requiring high-speed data processing.
Gull wing terminal form enhances solderability and robustness, leading to improved connection reliability in circuit assemblies.
With 1,048,576 words of storage, this OTP ROM offers substantial memory capacity suitable for various applications needing a significant amount of data storage.
A memory width of 16 bits allows for efficient data processing, enhancing overall system performance in data-intensive applications.
A terminal pitch of 1.27 mm is compatible with most PCB designs, simplifying integration into electronic devices.
With a coding of 1M words, this OTP ROM can efficiently store a variety of programming codes, suitable for embedded systems.
Support for a maximum supply voltage of 3.6V allows for flexibility in power supply configurations while ensuring safe operation.
With a density of 16,777,216 bits, this device provides ample memory for complex applications, accommodating large data requirements.
As an OTP ROM, this memory type is ideal for applications requiring non-volatile storage that can be programmed once, ensuring data integrity.
A maximum standby current of 0.0001 Amp contributes to low power consumption during idle states, making it energy efficient.
With a maximum access time of 100 ns, this ROM provides quick data retrieval, enhancing performance in high-speed applications.
OTP ROM M27W016100M1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics
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M27W016100M1 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
1N4148WT
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N2222A
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
1N4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Semitronics
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
SN65HVD234DR
Texas Instruments
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
Boca Semiconductor
General Semiconductor
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
JBP28S45MJ
JBP28S45MJ by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at a max temperature of 125°C and has an access time of 60ns. Ideal for military-grade applications requiring reliable non-volatile memory storage in harsh environments.
TBP24SA81-55N3
TBP24SA81-55N3 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 55ns max access time. It features a rectangular package style, suitable for commercial temperature grade applications. Ideal for systems requiring fast data retrieval in a compact form factor.
TBP24SA81-55JP4
TBP24SA81-55JP4 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 55ns max access time. It features a rectangular ceramic package with 18 terminals in-line, suitable for commercial-grade TTL technology applications.
5962-01-050-6948
Texas Instruments' 5962-01-050-6948 is a 1KX4 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 60ns and operates in commercial temperature grade. This rectangular package with 18 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
5962-01-141-4360
Texas Instruments' 5962-01-141-4360 is a 32X8 OTP ROM with 16 terminals and a supply voltage of 5V. It operates b/w 0 to 70°C, has a max access time of 40ns, and consumes up to 110mA. Ideal for commercial applications requiring reliable memory storage in a rectangular plastic/epoxy package.
AT27C040-15PC
Atmel
Atmel's AT27C040-15PC is a 512Kx8 OTP ROM with 150ns access time, operating at 5V. It features a 3-STATE output and common I/O type, suitable for commercial applications requiring reliable non-volatile memory storage in a rectangular PLASTIC/EPOXY package.
SN74S478J
SN74S478J by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density and 70ns access time. It operates at 5V, has 24 terminals, and uses TTL technology. Ideal for commercial applications requiring non-volatile memory storage in a ceramic rectangular package.
JBP24S81MJ
The Texas Instruments JBP24S81MJ is a MILITARY-grade OTP ROM with 2KX4 organization, 8192-bit memory density, and 85ns max access time. It operates b/w -55°C to 125°C, making it suitable for rugged environments requiring fast non-volatile memory storage in military applications.
CBP28R165MJ
The Texas Instruments CBP28R165MJ is a MIL-STD-883 Class B OTP ROM with 2KX8 organization and 16384-bit memory density. It operates b/w -55 to 125 °C, making it ideal for military applications requiring reliable TTL technology in a ceramic package. With 24 terminals in an in-line rectangular shape, this device offers secure data storage and retrieval capabilities.
DS2502+T&R
Maxim Integrated
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Organization: 128X8;
5962-01-299-3045
Texas Instruments' 5962-01-299-3045 is an OTP ROM with 32x8 organization, 40ns max access time, and operates at 0 to 70°C. It has a ceramic rectangular package with 16 terminals in-line style. Ideal for commercial applications requiring reliable memory storage and fast data retrieval.
AT27C040-90JU-T
Microchip Technology
AT27C040-90JU-T by Microchip Technology is a 512Kx8 OTP ROM with 90 ns access time, operating at 5V. It features a parallel interface, 3-STATE output, and industrial temperature grade. Commonly used in applications requiring non-volatile memory storage with fast access times and low standby current consumption.
TBP24S81N1
TBP24S81N1 by Texas Instruments is a 2Kx4 OTP ROM with 8192-bit memory density. It operates at temperatures b/w 0-70°C and has a max access time of 70ns. Ideal for commercial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
SN74S472N3
SN74S472N3 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in commercial temperature grades. This rectangular package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology environments.
SN74186J
SN74186J by Texas Instruments is a 64x8 OTP ROM with 75ns access time. Operating b/w 0-70°C, it has a max supply current of 120mA. This TTL technology IC in ceramic package is ideal for commercial applications requiring fast memory access.
TBP28L42MJ
TBP28L42MJ by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 110ns and operates in parallel mode. This military-grade IC is ideal for applications requiring fast and reliable non-volatile memory storage.
AT27C256R-70JC
AT27C256R-70JC by Atmel is a 32KX8 OTP ROM with 70ns access time, operating at 5V. It features 3-STATE output and supports parallel interface. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.
AT27BV256-70JU
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
AT27C020-90JU
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Width: 11.43 mm;
AT27C040-15RC
AT27C040-15RC by Atmel is a 512KX8 OTP ROM with 150 ns access time, operating at 5V. It features a 3-STATE output and GULL WING terminal form. Ideal for applications requiring fast and reliable non-volatile memory storage in commercial temperature environments.
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M27W101-80K6
STMicroelectronics
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M27W101-80K6TR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .000015 Amp;
M27W01690M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
M27W016100N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M27W016110M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
M27W01690B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M27W016110B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1048576 words;
M27W01690N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M27W016100B1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
M27W016110M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
M27W016100N1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M27W016110N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Organization: 1MX16;
M27W016110S1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR; Terminal Pitch: 1.778 mm;
M27W016100S1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR; No. of Words Code: 1M;
M27W01690M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 3 mm;
M27W016100M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 16777216 bit;
M27W016110N1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 1M;
M27W016110B1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
M27W016100B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP42,.6;
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