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SNJ54S188W

Texas Instruments

SNJ54S188W by Texas Instruments

SNJ54S188W by Texas Instruments is a 32x8 OTP ROM with 50ns access time, operating b/w -55 to 125°C. It has a supply voltage of 5V and max current draw of 110mA. Ideal for military-grade applications requiring fast memory access in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,610 parts In-Stock

1+ parts

-

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6,610

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Digiode

USA . 4,021 parts In-Stock

1+ parts

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4,021

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,322 parts In-Stock

1+ parts

$4.459

100+ parts

-

1k+ parts

$4.893

10k+ parts

-

2,322

$4.459

-

$4.893

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DigiPath Technology Company

USA . 289 parts In-Stock

1+ parts

$4.910

100+ parts

$4.517

1k+ parts

-

10k+ parts

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289

$4.910

$4.517

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ChromeModa Solutions

Germany . 6,004 parts In-Stock

1+ parts

$5.010

100+ parts

$4.108

1k+ parts

-

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6,004

$5.010

$4.108

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IDEA Electronic Components Group

UK . 1,248 parts In-Stock

1+ parts

$5.010

100+ parts

-

1k+ parts

$4.509

10k+ parts

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1,248

$5.010

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$4.509

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AZTECH Wire

Italy . 702 parts In-Stock

1+ parts

$7.015

100+ parts

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702

$7.015

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One Stop Electronics

USA . 513 parts In-Stock

1+ parts

$16.000

100+ parts

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513

$16.000

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Corphita

USA . 4,857 parts In-Stock

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4,857

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Overview

Unlock the power of reliable data storage with the Texas Instruments SNJ54S188W OTP ROM. Designed with precision and quality in mind, this device offers unparalleled performance in a variety of applications. With Texas Instruments' reputation for excellence, you can trust that this OTP ROM will deliver the value and benefits you need. From military-grade technology to industrial settings, the SNJ54S188W is the perfect solution for your data storage needs. Experience the advantages of this high-quality product and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides durability and thermal protection, making the product suitable for harsh environments.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage of 5V ensures compatibility with most electronic systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance even in extreme conditions.

Organization: 32X8

Organized in 32 words of 8 bits each, offering sufficient memory storage capacity for various applications.

Technology: TTL

TTL technology ensures fast and efficient performance of the OTP ROM.

Maximum Access Time: 50 ns

Low access time ensures quick retrieval of data from the ROM, enhancing overall system speed.

Technical Specifications

OTP ROM SNJ54S188W attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

50 ns

JESD-30 Code:

R-XDFP-F16

Memory IC Type:

Memory Width:

8

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32X8

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

OTP ROMs

Maximum Supply Current:

110 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

FLAT

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54S188W Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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