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M27W016110M1T

STMicroelectronics

M27W016110M1T by STMicroelectronics

M27W016110M1T by STMicroelectronics is a 16Mb OTP ROM with a 3.6V max supply voltage and operates asynchronously. It features a compact SO package, ideal for space-constrained applications, and offers fast access times of 110 ns. This versatile memory solution is perfect for embedded systems requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,892 parts In-Stock

1+ parts

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2,892

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Digiode

USA . 1,653 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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1,653

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Vyrian

USA . 987 parts In-Stock

1+ parts

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987

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,586 parts In-Stock

1+ parts

$2.811

100+ parts

-

1k+ parts

$2.530

10k+ parts

-

1,586

$2.811

-

$2.530

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MKK Technologies

India . 1,766 parts In-Stock

1+ parts

$5.285

100+ parts

-

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10k+ parts

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1,766

$5.285

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DigiPath Technology Company

USA . 1,766 parts In-Stock

1+ parts

$5.285

100+ parts

-

1k+ parts

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10k+ parts

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1,766

$5.285

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Corphita

USA . 1,354 parts In-Stock

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1,354

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Parana Technologies

USA . 990 parts In-Stock

1+ parts

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100+ parts

$3.360

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990

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$3.360

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Overview

Unlock unparalleled performance with the M27W016110M1T from STMicroelectronics—your go-to choice for reliable OTP ROM solutions. Designed for versatility and efficiency, this high-quality memory component excels in various applications including automotive, consumer electronics, and industrial systems. With ST's commitment to innovation and excellence, you gain not only superior technology but also peace of mind, knowing you're backed by a trusted leader in semiconductor solutions. Elevate your projects and streamline operations with this exceptional product!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, making it a reliable choice for various applications.

Surface Mount: YES

Allows for efficient use of space on PCBs, enabling higher density designs.

Package Shape: RECTANGULAR

Standardized shape facilitates easy integration into various circuit layouts.

Operating Mode: ASYNCHRONOUS

Simplifies circuit design by eliminating the need for clock signals.

Input/Output Type: COMMON

Enhances compatibility with a wide range of devices and interfaces.

Nominal Supply Voltage / Vsup: 3 V

Standard voltage level ensures compatibility with many modern electronics.

Power Supplies: 3/3.3 V

Flexibility in voltage supply options increases usability in various applications.

No. of Terminals: 44

Sufficient pins available for versatile connectivity options, enhancing functionality.

Package Style (Meter): SMALL OUTLINE

Compact size aids in saving board space, ideal for space-constrained designs.

Maximum Operating Temperature: 70 °C

Suitable for commercial applications where moderate temperature tolerances are required.

Organization: 1MX16

Supports high memory density, facilitating large data storage capabilities.

Output Characteristics: 3-STATE

Enables flexible connection to multiple devices, improving data management efficiency.

Minimum Operating Temperature: 0 °C

Expands operational range to ambient conditions suitable for various environments.

Terminal Finish: MATTE TIN

Provides excellent solderability, enhancing durability and reliability of connections.

Terminal Position: DUAL

Allows for effective layout options, making integration into different designs easier.

Maximum Seated Height: 3 mm

Low profile contributes to sleek designs and allows for improved airflow in enclosures.

Width: 12.6 mm

Compact width ensures fit in limited spaces, ideal for portable electronics.

Minimum Supply Voltage: 2.7 V

Enhances versatility across a variety of applications with different voltage requirements.

Length: 28.5 mm

Standard length facilitates easy integration into existing designs and layouts.

Temperature Grade: COMMERCIAL

Appropriate for general consumer electronics, ensuring dependable performance.

Technology: CMOS

Low power consumption and high speed make it ideal for energy-efficient designs.

Parallel or Serial: PARALLEL

Allows for faster data communication, enhancing overall system performance.

Terminal Form: GULL WING

Preferred design for surface mount technology, ensuring strong mechanical connections.

No. of Words: 1048576 words

Provides substantial storage capacity, catering to a variety of application needs.

Memory Width: 16

Enables efficient data handling capabilities, balancing performance and resource utilization.

Terminal Pitch: 1.27 mm

Standard pitch makes it easier to solder and design PCBs with this component.

No. of Words Code: 1M

Indicates ample storage suitability for diverse applications requiring substantial data.

Maximum Supply Voltage: 3.6 V

Ensures compatibility with a wide range of circuit designs and improvements in performance.

Memory Density: 16777216 bit

High density allows for extensive data storage in compact designs, enhancing functionality.

Memory IC Type: OTP ROM

One-time programmable capability makes it ideal for applications requiring permanent storage.

Maximum Standby Current: 0.0001 Amp

Very low standby current improves energy efficiency, making this product eco-friendly.

Maximum Access Time: 110 ns

Fast access time enhances overall system performance and data retrieval efficiency.

Technical Specifications

OTP ROM M27W016110M1T attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

110 ns

Additional Features:

90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

28.5 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

44

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP44,.63

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

12.6 mm

Trade Compliance

M27W016110M1T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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