Loading...

M27W016100S1T

STMicroelectronics

M27W016100S1T by STMicroelectronics

M27W016100S1T by STMicroelectronics is a 16Mbit OTP ROM with a 3V nominal supply, featuring asynchronous operation and a max access time of 100 ns. It operates in temperatures from 0 °C to 70 °C, making it ideal for commercial applications. Its compact design includes 42 terminals in an in-line package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,640

-

-

-

-

Anansix

USA . 1,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,232

-

-

-

-

Digiode

USA . 644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

644

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,749 parts In-Stock

1+ parts

$4.112

100+ parts

-

1k+ parts

$3.701

10k+ parts

-

1,749

$4.112

-

$3.701

-

MKK Technologies

India . 1,865 parts In-Stock

1+ parts

$7.733

100+ parts

-

1k+ parts

-

10k+ parts

-

1,865

$7.733

-

-

-

DigiPath Technology Company

USA . 1,865 parts In-Stock

1+ parts

$7.733

100+ parts

-

1k+ parts

-

10k+ parts

-

1,865

$7.733

-

-

-

Corphita

USA . 4,049 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,049

-

-

-

-

Parana Technologies

USA . 2,185 parts In-Stock

1+ parts

-

100+ parts

$4.917

1k+ parts

-

10k+ parts

-

2,185

-

$4.917

-

-

Overview

Unlock the potential of your designs with the M27W016100S1T from STMicroelectronics—your trusted partner in high-quality semiconductor solutions. This OTP ROM offers exceptional reliability and performance, making it ideal for a variety of applications like consumer electronics, automotive systems, and industrial controls. Enjoy seamless integration, lower power consumption, and robust data storage, resulting in enhanced product longevity and customer satisfaction. Choose STMicroelectronics for innovation you can rely on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy package material ensures good protection of the internal components, making the product reliable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and easy integration into various electronic designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simpler interfacing with other components, providing flexibility in design.

Nominal Supply Voltage / Vsup: 3 V

Operating at a nominal voltage of 3 V supports modern low-power designs, making it suitable for battery-operated devices.

No. of Terminals: 42

Having 42 terminals provides ample connection points for a range of applications, enhancing versatility.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch style is beneficial for high-density circuit layouts, optimizing space and connectivity.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C means it can be used in a variety of environments without compromising reliability.

Organization: 1MX16

An organization of 1M x 16 allows for efficient data storage and retrieval, making it well-suited for applications requiring large amounts of data.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C ensures functionality in typical room temperature conditions and mildly cold environments.

Terminal Position: DUAL

Dual terminal positioning enhances ease of soldering and board layout, facilitating better design practices.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm ensures compatibility with low-profile PCB designs.

Width: 15.24 mm

The compact width allows for efficient use of space on printed circuit boards.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7 V extends usability to lower voltage circuits, enhancing design flexibility.

Length: 36.83 mm

The length of 36.83 mm strikes a balance between compact design and sufficient surface area for effective signal transmission.

Temperature Grade: COMMERCIAL

Being commercially graded ensures suitability for general purpose and consumer applications, increasing market applicability.

Technology: CMOS

CMOS technology provides high-speed operation and low power consumption, making it efficient for various applications.

Parallel or Serial: PARALLEL

Using a parallel interface allows for faster data access compared to serial interfaces, improving overall performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal forms are known for their strong physical connection to the PCB, enhancing reliability in demanding applications.

No. of Words: 1048576 words

With 1,048,576 words, the memory capacity is substantial, making it ideal for applications requiring extensive data storage.

Memory Width: 16

A memory width of 16 bits allows for efficient data handling, suitable for processing larger data sets.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm allows for compatibility with standard PCB layouts, facilitating easier designs.

No. of Words Code: 1M

A code of 1M words indicates a significant storage capability, suitable for various applications including microcontrollers and embedded systems.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V ensures stable operation while accommodating a range of circuit designs.

Memory Density: 16777216 bit

A memory density of 16,777,216 bits provides a high data storage capacity, making it excellent for data-intensive applications.

Memory IC Type: OTP ROM

Being an OTP ROM (One-Time Programmable Read-Only Memory) makes it ideal for applications requiring secure and permanent data storage.

Maximum Access Time: 100 ns

With a maximum access time of 100 ns, the device ensures quick data retrieval, enhancing system efficiency.

Technical Specifications

OTP ROM M27W016100S1T attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

JESD-30 Code:

R-PDIP-T42

Length:

36.83 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

42

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27W016100S1T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19