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5962-01-227-4351

Texas Instruments

5962-01-227-4351 by Texas Instruments

Texas Instruments' 5962-01-227-4351 is a 24-terminal OTP ROM with 1KX8 organization, TTL technology, and 8192-bit memory density. It operates b/w 0 to 70°C, has a max access time of 70 ns, and is commonly used in commercial applications requiring non-volatile memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,776 parts In-Stock

1+ parts

-

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6,776

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Digiode

USA . 4,408 parts In-Stock

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4,408

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 426 parts In-Stock

1+ parts

$0.337

100+ parts

-

1k+ parts

-

10k+ parts

$0.324

426

$0.337

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-

$0.324

Northwest PG Solutions

USA . 1,539 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

-

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$0.327

1,539

$0.371

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-

$0.327

Parana Technologies

USA . 48 parts In-Stock

1+ parts

$3.192

100+ parts

-

1k+ parts

$3.717

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48

$3.192

-

$3.717

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DigiPath Technology Company

USA . 1,969 parts In-Stock

1+ parts

$3.515

100+ parts

$3.234

1k+ parts

-

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1,969

$3.515

$3.234

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ChromeModa Solutions

Germany . 3,210 parts In-Stock

1+ parts

$3.587

100+ parts

$2.941

1k+ parts

-

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3,210

$3.587

$2.941

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IDEA Electronic Components Group

UK . 1,811 parts In-Stock

1+ parts

$3.587

100+ parts

-

1k+ parts

$3.228

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1,811

$3.587

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$3.228

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One Stop Electronics

USA . 872 parts In-Stock

1+ parts

$5.000

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872

$5.000

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AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$16.136

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638

$16.136

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Corphita

USA . 1,004 parts In-Stock

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1,004

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Overview

Unlock endless possibilities with the 5962-01-227-4351 by Texas Instruments. Crafted from top-quality materials, this OTP ROM offers unparalleled performance and reliability. Ideal for a wide range of applications, this memory IC type is designed to meet your needs with its 1KX8 organization and 8192-bit memory density. Whether you're in the industrial, automotive, or consumer electronics sector, this versatile product ensures seamless operation and maximum efficiency. Experience the difference with Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and are highly durable, ensuring reliability in various operating conditions.

No. of Terminals: 24

Having a sufficient number of terminals allows for versatile connectivity options and ease of integration into different systems.

Technology: TTL

TTL technology is known for its simplicity and reliability in digital circuits, making this OTP ROM a dependable choice for data storage.

Memory Width: 8

With a memory width of 8 bits, this OTP ROM can store and retrieve data efficiently in byte-sized chunks.

Maximum Access Time: 70 ns

The fast access time of 70 nanoseconds ensures quick retrieval of data, making this OTP ROM suitable for applications requiring high-speed operation.

Technical Specifications

OTP ROM 5962-01-227-4351 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

R-XDIP-T24

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-227-4351 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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