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5962-01-140-2997

Texas Instruments

5962-01-140-2997 by Texas Instruments

Texas Instruments' 5962-01-140-2997 is a 5V OTP ROM with 1KX4 organization, 4096-bit memory density, and operates b/w 0 to 70°C. It has an IN-LINE package style, suitable for commercial-grade applications requiring reliable non-volatile memory storage in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,275

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Digiode

USA . 1,737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,737

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 964 parts In-Stock

1+ parts

$0.269

100+ parts

-

1k+ parts

-

10k+ parts

$0.258

964

$0.269

-

-

$0.258

Northwest PG Solutions

USA . 892 parts In-Stock

1+ parts

$0.296

100+ parts

-

1k+ parts

-

10k+ parts

$0.261

892

$0.296

-

-

$0.261

Parana Technologies

USA . 520 parts In-Stock

1+ parts

$2.628

100+ parts

-

1k+ parts

$3.118

10k+ parts

-

520

$2.628

-

$3.118

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DigiPath Technology Company

USA . 2,221 parts In-Stock

1+ parts

$2.894

100+ parts

-

1k+ parts

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10k+ parts

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2,221

$2.894

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ChromeModa Solutions

Germany . 4,063 parts In-Stock

1+ parts

$2.953

100+ parts

$2.421

1k+ parts

-

10k+ parts

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4,063

$2.953

$2.421

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IDEA Electronic Components Group

UK . 1,127 parts In-Stock

1+ parts

$2.953

100+ parts

-

1k+ parts

$2.658

10k+ parts

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1,127

$2.953

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$2.658

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AZTECH Wire

Italy . 324 parts In-Stock

1+ parts

$9.935

100+ parts

-

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324

$9.935

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One Stop Electronics

USA . 334 parts In-Stock

1+ parts

$26.000

100+ parts

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334

$26.000

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Corphita

USA . 443 parts In-Stock

1+ parts

-

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443

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Overview

Discover the unparalleled quality and reliability of the 5962-01-140-2997 by Texas Instruments, a leading manufacturer in the industry. This OTP ROM offers seamless integration and exceptional performance, making it ideal for a wide range of applications. With its innovative technology and advanced features, this product provides customers with unmatched value and benefits. Upgrade your projects with the 5962-01-140-2997 and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent durability and heat resistance, making the OTP ROM more reliable and long-lasting.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and easy to integrate.

No. of Words: 1024 words

With a 1024-word capacity, this OTP ROM can store a large amount of data efficiently.

Memory Width: 4

The 4-bit memory width allows for efficient storage and retrieval of data in a structured manner.

Technology: TTL

Using TTL technology ensures reliable and accurate data processing within the OTP ROM.

Technical Specifications

OTP ROM 5962-01-140-2997 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T18

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX4

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-140-2997 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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