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CBP18S42MJ

Texas Instruments

CBP18S42MJ by Texas Instruments

CBP18S42MJ by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 512x8 organization, 4096-bit memory density, and 85ns access time. Ideal for military applications requiring reliable data storage in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,016 parts In-Stock

1+ parts

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8,016

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Digiode

USA . 3,356 parts In-Stock

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3,356

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,643 parts In-Stock

1+ parts

$5.000

100+ parts

-

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1,643

$5.000

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Parana Technologies

USA . 411 parts In-Stock

1+ parts

$5.283

100+ parts

-

1k+ parts

$5.910

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411

$5.283

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$5.910

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ChromeModa Solutions

Germany . 5,206 parts In-Stock

1+ parts

$5.936

100+ parts

$4.868

1k+ parts

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5,206

$5.936

$4.868

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IDEA Electronic Components Group

UK . 1,869 parts In-Stock

1+ parts

$5.936

100+ parts

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1k+ parts

$5.342

10k+ parts

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1,869

$5.936

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$5.342

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AZTECH Wire

Italy . 441 parts In-Stock

1+ parts

$7.636

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441

$7.636

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Corphita

USA . 3,858 parts In-Stock

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3,858

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Northwest PG Solutions

USA . 1,761 parts In-Stock

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$3.269

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1,761

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$3.269

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Native Components

USA . 507 parts In-Stock

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$3.236

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507

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$3.236

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DigiPath Technology Company

USA . 453 parts In-Stock

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$5.352

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453

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$5.352

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Overview

Experience top-notch quality and reliability with the CBP18S42MJ by Texas Instruments, a leading manufacturer in the industry. This OTP ROM offers unmatched performance and durability, making it ideal for military-grade applications where precision is key. With a nominal supply voltage of 5V and a maximum operating temperature of 125°C, this product ensures superior functionality even in the harshest environments. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the CBP18S42MJ and experience the difference today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent durability and reliability, making this OTP ROM suitable for harsh environments and long-term use.

Screening Level: MIL-STD-883 Class B (Modified)

Compliance with MIL-STD-883 Class B ensures high quality and reliability, making this OTP ROM suitable for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems straightforward.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this OTP ROM can withstand elevated temperatures without compromising performance.

Organization: 512X8

The organization of 512 words by 8 bits provides a balance between memory capacity and data transfer efficiency, suitable for various applications.

Technology: TTL

Using TTL technology ensures compatibility with legacy systems and simplifies integration, making this OTP ROM a versatile choice for different projects.

Memory Density: 4096 bit

With a memory density of 4096 bits, this OTP ROM offers ample storage space for program code or data, making it suitable for a wide range of applications.

Maximum Access Time: 85 ns

The fast maximum access time of 85 ns ensures quick retrieval of information, enhancing overall system performance when using this OTP ROM.

Technical Specifications

OTP ROM CBP18S42MJ attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

85 ns

JESD-30 Code:

R-XDIP-T20

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

20

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

512X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CBP18S42MJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

NSN

5962-01-214-2155, 5962012142155, 5962-01-214-2167, 5962012142167, 5962-01-214-2160, 5962012142160, 5962-01-159-5934, 5962011595934, 5962-01-197-0048, 5962011970048, 5962-01-214-2169, 5962012142169, 5962-01-214-2154, 5962012142154, 5962-01-214-2168, 5962012142168, 5962-01-214-2171, 5962012142171, 5962-01-214-2156, 5962012142156, 5962-01-214-2157, 5962012142157, 5962-01-214-2161, 5962012142161, 5962-01-214-2158, 5962012142158, 5962-01-214-2172, 5962012142172, 5962-01-214-2170, 5962012142170, 5962-01-214-2162, 5962012142162, 5962-01-197-0047, 5962011970047, 5962-01-214-2163, 5962012142163, 5962-01-214-2159, 5962012142159, 5962-01-214-2164, 5962012142164

NIIN

012142155, 012142167, 012142160, 011595934, 011970048, 012142169, 012142154, 012142168, 012142171, 012142156, 012142157, 012142161, 012142158, 012142172, 012142170, 012142162, 011970047, 012142163, 012142159, 012142164

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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