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5962-01-158-9905

Texas Instruments

5962-01-158-9905 by Texas Instruments

Texas Instruments' 5962-01-158-9905 is a MILITARY-grade OTP ROM with 1KX4 organization, 4096-bit memory density, and 75 ns access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,235 parts In-Stock

1+ parts

-

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4,235

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Vyrian

USA . 3,002 parts In-Stock

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3,002

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 514 parts In-Stock

1+ parts

$4.002

100+ parts

-

1k+ parts

$4.469

10k+ parts

-

514

$4.002

-

$4.469

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ChromeModa Solutions

Germany . 2,267 parts In-Stock

1+ parts

$4.497

100+ parts

$3.688

1k+ parts

-

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2,267

$4.497

$3.688

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IDEA Electronic Components Group

UK . 1,096 parts In-Stock

1+ parts

$4.497

100+ parts

-

1k+ parts

$4.047

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1,096

$4.497

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$4.047

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One Stop Electronics

USA . 1,605 parts In-Stock

1+ parts

$7.000

100+ parts

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1,605

$7.000

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Native Components

USA . 301 parts In-Stock

1+ parts

$7.453

100+ parts

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301

$7.453

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AZTECH Wire

Italy . 282 parts In-Stock

1+ parts

$18.704

100+ parts

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282

$18.704

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Corphita

USA . 4,395 parts In-Stock

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4,395

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DigiPath Technology Company

USA . 1,400 parts In-Stock

1+ parts

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100+ parts

$4.054

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1,400

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$4.054

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Northwest PG Solutions

USA . 1,200 parts In-Stock

1+ parts

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$7.304

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1,200

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$7.304

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Supply Digital

USA . 830 parts In-Stock

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830

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Overview

Upgrade your electronic devices with the high-quality 5962-01-158-9905 by Texas Instruments. With its durable ceramic package and military-grade temperature tolerance, this OTP ROM memory chip is perfect for a wide range of applications. Whether you're designing aerospace systems or industrial machinery, this product offers reliability, performance, and value. Trust Texas Instruments to deliver top-notch technology that exceeds expectations. Choose the 5962-01-158-9905 for all your memory needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Provides excellent protection and durability for the internal components, ensuring long-term reliability.

Nominal Supply Voltage / Vsup (V): 5

Works with standard 5V power supplies, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments without compromising performance.

Organization: 1KX4

Organized as 1K words of 4 bits each, offering a balance between memory capacity and data width.

Technology: TTL

Utilizes TTL technology for reliable and fast data processing.

Memory Density: 4096 bit

Provides ample storage capacity for storing data or program code.

Memory IC Type: OTP ROM

Uses OTP ROM technology for secure and non-volatile data storage.

Maximum Access Time: 75 ns

Ensures quick access to stored data, making it suitable for real-time applications.

Technical Specifications

OTP ROM 5962-01-158-9905 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

75 ns

JESD-30 Code:

R-XDIP-T18

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

1KX4

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-158-9905 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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