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5962-01-050-6939

Texas Instruments

5962-01-050-6939 by Texas Instruments

Texas Instruments' 5962-01-050-6939 is a 1KX4 OTP ROM with 4096-bit memory density. Operating at 5V, it offers a max access time of 60ns and operates in commercial temperature grades. Ideal for applications requiring non-volatile memory storage in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,709 parts In-Stock

1+ parts

-

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5,709

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Digiode

USA . 1,495 parts In-Stock

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1,495

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 835 parts In-Stock

1+ parts

$2.109

100+ parts

-

1k+ parts

$2.624

10k+ parts

-

835

$2.109

-

$2.624

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DigiPath Technology Company

USA . 2,063 parts In-Stock

1+ parts

$2.323

100+ parts

$2.137

1k+ parts

-

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2,063

$2.323

$2.137

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ChromeModa Solutions

Germany . 1,676 parts In-Stock

1+ parts

$2.370

100+ parts

$1.943

1k+ parts

-

10k+ parts

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1,676

$2.370

$1.943

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IDEA Electronic Components Group

UK . 82 parts In-Stock

1+ parts

$2.370

100+ parts

-

1k+ parts

$2.133

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82

$2.370

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$2.133

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Native Components

USA . 193 parts In-Stock

1+ parts

$8.355

100+ parts

-

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193

$8.355

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Northwest PG Solutions

USA . 1,852 parts In-Stock

1+ parts

$9.190

100+ parts

$8.271

1k+ parts

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1,852

$9.190

$8.271

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AZTECH Wire

Italy . 393 parts In-Stock

1+ parts

$9.369

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393

$9.369

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One Stop Electronics

USA . 689 parts In-Stock

1+ parts

$30.000

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689

$30.000

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Corphita

USA . 2,040 parts In-Stock

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2,040

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Overview

Unlock endless possibilities with the 5962-01-050-6939 by Texas Instruments. This OTP ROM offers unparalleled quality and reliability, backed by Texas Instruments' renowned reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications, this product delivers reliable performance, fast access times, and efficient operation. Experience the value and benefits of this cutting-edge technology, and discover how it can elevate your projects to new heights. Choose Texas Instruments for unmatched innovation and superior quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and robustness, making this product suitable for various environments.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides stable and reliable power to the OTP ROM, ensuring consistent performance.

No. of Terminals: 18

With 18 terminals, this OTP ROM offers ample connectivity options for seamless integration into different systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the OTP ROM to function efficiently even in warm environments.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of systems and devices, making this OTP ROM a versatile choice.

Memory Density: 4096 bit

The high memory density of 4096 bits allows for storing a large amount of data in the OTP ROM, making it suitable for various applications.

Maximum Access Time: 60 ns

The fast maximum access time of 60 nanoseconds ensures quick retrieval of data from the OTP ROM, enhancing performance speed.

Technical Specifications

OTP ROM 5962-01-050-6939 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

60 ns

JESD-30 Code:

R-PDIP-T18

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-050-6939 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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