Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Terminal Position: RADIAL; Package Body Material: METAL;
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OTP ROM DS1982-F3 attributes and parameters. Explore more OTP ROM devices from Dallas Semiconductor
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DS1982-F3 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Dallas Semiconductor, acquired by Maxim Integrated in 2002 for $2.5 billion,was a company that designed and manufactured analog, digital, and mixed-signal semiconductors (integrated circuits, or ICs).Its specialties included communications products (including T/E and Ethernet products), microcontrollers, battery management, thermal sensing and thermal management, non-volatile random-access memory, microprocessor supervisors, delay lines, silicon oscillators, digital potentiometers, real-time clocks, temperature-compensated crystal oscillators (TCXOs), iButton, and 1-Wire products. Analog Devices, Inc. (NasdaqGS:ADI) completed the acquisition of Maxim Integrated Products, Inc. (NasdaqGS:MXIM) from a group of shareholders on August 26, 2021. Analog Devices, Inc. (ADI) empowers the Intelligent Edge with the world’s most innovative analog, digital, and software solutions, to accelerate breakthroughs that benefit society and the planet.
SMBJ18CA
Semtech
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
1N4148
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
LL4148-GS08
Telefunken Microelectronics
RECTIFIER DIODE; Surface Mount: YES; JESD-609 Code: e0; No. of Elements: 1; Maximum Operating Temperature: 175 Cel; Maximum Non Repetitive Peak Forward Current: 2 A;
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
MMBT2222ALT1G
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
Fairchild Semiconductor
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
BQ2022ALPRE3
Texas Instruments
BQ2022ALPRE3 by Texas Instruments is an OTP ROM with 1024-bit memory density. It operates asynchronously at a max clock frequency of 0.01667 MHz and has a nominal voltage of 2.7V. This device, in a cylindrical package shape, is commonly used for applications requiring non-volatile memory storage with low power consumption.
CBP24SA41MJ
The Texas Instruments CBP24SA41MJ is a MIL-STD-883 Class B OTP ROM with 1KX4 organization and 4096-bit memory density. It operates b/w -55 to 125 °C, has a max access time of 75 ns, and is ideal for military-grade applications requiring reliable non-volatile memory storage.
TBP24S81-55N3
TBP24S81-55N3 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 55ns max access time. It operates b/w 0 to 70°C, making it suitable for commercial applications requiring fast data retrieval in a compact IN-LINE package style.
5962-01-214-2157
Texas Instruments' 5962-01-214-2157 is a MILITARY-grade OTP ROM with 512x8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
AT27C512R-45PU
Atmel
OTP ROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
5962-01-170-0600
Texas Instruments' 5962-01-170-0600 is a 32X8 OTP ROM with 5V supply, 16 terminals, and 40ns access time. Ideal for commercial applications requiring fast memory access in a rectangular plastic package.
TBP28L86NP3
TBP28L86NP3 by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density and 130 ns max access time. It operates at a nominal voltage of 5V and has a temperature range of 0 to 70°C. This device, in an IN-LINE package style, is ideal for applications requiring non-volatile memory storage in commercial-grade environments.
SN54S474J
SN54S474J by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 85ns and MILITARY temperature grade. This TTL technology IC is ideal for applications requiring fast non-volatile memory storage in harsh environments.
SN74S475N1
SN74S475N1 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates in commercial temperature grade range of 0-70°C, with a max access time of 75ns. This through-hole technology device has 24 terminals and is commonly used for storing fixed data in electronic systems.
HS9-6664RH-Q
Renesas Electronics
HS9-6664RH-Q by Renesas Electronics is a MILITARY-grade OTP ROM with 8KX8 organization, 8192 words, and 65536 bit memory density. It operates at temperatures ranging from -55 to 125 °C and has a supply voltage of 4.5V to 5.5V. Ideal for military applications requiring reliable non-volatile memory storage in harsh environments.
DS2502P-E64+
Analog Devices
DS2502P-E64+ by Analog Devices is a 1KX1 OTP ROM with 1024-bit memory density. It operates at 5V, -40 to 85°C, in industrial settings. The small outline, low profile package is surface mountable and features serial communication for various applications.
5962-01-180-4314
Texas Instruments' 5962-01-180-4314 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring secure non-volatile memory storage in harsh environments.
82S123/BEA
NXP Semiconductors' 82S123/BEA is a 256-bit OTP ROM with 32x8 organization, operating at 5V. It features a max access time of 50ns and operates in parallel mode. This ceramic, glass-sealed IC is ideal for military-grade applications requiring reliable non-volatile memory storage.
TBP24S10J
TBP24S10J by Texas Instruments is an OTP ROM with 256x4 organization, operating at 5V. It features a parallel interface, 55ns access time, and memory density of 1024 bit. Ideal for commercial applications requiring fast and reliable non-volatile memory storage.
CMS214-250
Texas Instruments' CMS214-250 is a 128KX8 OTP ROM with 60 terminals. Operating at 5V, it offers 3-STATE output and operates in ASYNCHRONOUS mode. Ideal for commercial applications, this CMOS technology-based device has a memory density of 1048576 bit and max access time of 250 ns.
DS2502
Dallas Semiconductor
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Shape: ROUND; Qualification: Not Qualified; Minimum Supply Voltage (Vsup): 2.8 V;
82S123BEA
Teledyne E2v (Uk)
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Shape: RECTANGULAR; JESD-30 Code: R-CDIP-T16; Minimum Supply Voltage (Vsup): 4.5 V;
TBP18SA22J
TBP18SA22J by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology environments.
SN74S472NP1
SN74S472NP1 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in commercial temperature grade. This rectangular package IC with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
JBP18SA46MJ
JBP18SA46MJ by Texas Instruments is a MILITARY-grade OTP ROM with 512x8 organization and 4096-bit memory density. Featuring a max operating temperature of 125°C, it has an access time of 85ns. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
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DS1982-F3#
Maxim Integrated
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Package Style (Meter): DISK BUTTON; Surface Mount: YES;
DS1982-F3+
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Terminal Finish: Matte Tin (Sn) - annealed; No. of Words: 1024 words;
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Operating Mode: ASYNCHRONOUS; Minimum Operating Temperature: -40 Cel;
DS1982-F3
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Memory Density: 1024 bit; Terminal Position: END;
DS1982-F5+
DS1982-F5+ by Analog Devices is a 1KX1 OTP ROM with 1024-bit memory density. Operating at 3-5V, it has an access time of 15000ns and operates in industrial temperatures. Ideal for applications requiring common I/O type and asynchronous operation in a round metal package.
DS1985U-F3-PPPP
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Qualification: Not Qualified; Terminal Position: END;
DS1985U-F3
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; No. of Words Code: 2K; Package Style (Meter): DISK BUTTON;
DS1986U-F5-PPPP
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Minimum Operating Temperature: -40 Cel; Qualification: Not Qualified;
DS1982-F5W+
OTP ROM;
DS1986U-F3
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Terminal Finish: TIN LEAD; Memory Density: 65536 bit;
DS1986U-F5
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Technology: CMOS; Surface Mount: YES;
DS1986U-F3-PPPP
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; No. of Functions: 1; Technology: CMOS;
DS1985U-F5-PPPP
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Terminal Form: NO LEAD; Maximum Supply Voltage (Vsup): 6 V;
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Surface Mount: YES; Parallel or Serial: SERIAL;
DS1985U-F5
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Minimum Supply Voltage (Vsup): 2.8 V; JESD-30 Code: O-MEDB-N2;
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Qualification: Not Qualified; Memory Width: 8;
DS1982U-F3
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Parallel or Serial: SERIAL; Technology: CMOS;
DS1982U-F3-PPPP
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;
DS1982U-F5
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Package Style (Meter): DISK BUTTON; Operating Mode: SYNCHRONOUS;
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