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DS1986U-F3-PPPP

Analog Devices

DS1986U-F3-PPPP by Analog Devices

DS1986U-F3-PPPP by Analog Devices is an OTP ROM with 8KX8 organization, 8192 words, and 65536 bit memory density. It operates in synchronous mode, suitable for industrial applications. The package is a round metal disk button with serial interface and temperature range of -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,563 parts In-Stock

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Anansix

USA . 1,663 parts In-Stock

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Digiode

USA . 651 parts In-Stock

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MARBEL Systems

Belgium . 2,765 parts In-Stock

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$3.525

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Texas Native Microelectronics

USA . 571 parts In-Stock

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$4.052

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$3.890

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$3.768

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$3.566

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$3.566

Kenton Components

USA . 2,465 parts In-Stock

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$4.862

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$4.279

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Semicontronic

India . 739 parts In-Stock

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$5.000

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$4.875

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$4.850

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739

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AZTECH Wire

Italy . 687 parts In-Stock

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Qasali Group International

UK . 233 parts In-Stock

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$10.175

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$9.628

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One Stop Electronics

USA . 1,722 parts In-Stock

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$25.000

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Native Components

USA . 254 parts In-Stock

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$91.220

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Northwest PG Solutions

USA . 2,679 parts In-Stock

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Corphita

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Overview

Unlock the power of secure data storage with the Analog Devices DS1986U-F3-PPPP OTP ROM. Crafted with precision and expertise, Analog Devices guarantees top-notch quality and reliability in every product. This versatile device finds applications in a wide range of industries, offering customers peace of mind knowing their data is safe and accessible. Experience seamless operation and unparalleled performance with the DS1986U-F3-PPPP, designed to meet the demands of today's technology-driven world. Elevate your data storage solutions with Analog Devices.

Feature Benefit Bullets

Package Body Material: METAL

The use of metal in the package body provides durability and protection for the integrated circuit, making it suitable for industrial applications.

Surface Mount: YES

Enables easy installation on printed circuit boards, saving space and allowing for efficient assembly processes.

Package Shape: ROUND

The round package shape is compact and facilitates efficient placement on the PCB, maximizing use of available space.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures coordinated and efficient data transfer within the memory, improving overall performance.

Package Style (Meter): DISK BUTTON

The disk button package style is convenient for handling and installation, making it user-friendly for integration into electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the OTP ROM can withstand harsh environmental conditions and maintain reliable performance.

Organization: 8KX8

The organization of 8KX8 allows for efficient data storage and retrieval, accommodating a large number of words in a structured manner.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, making it versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the OTP ROM.

No. of Words: 8192 words

The large number of words allows for storing extensive data, making the OTP ROM suitable for applications requiring substantial memory capacity.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in system design.

Memory Density: 65536 bit

The high memory density enables the storage of large amounts of data in a compact form factor, optimizing space utilization in electronic devices.

Technical Specifications

OTP ROM DS1986U-F3-PPPP attributes and parameters. Explore more OTP ROM devices from Analog Devices

Specs

JESD-30 Code:

O-MEDB-N2

JESD-609 Code:

e0

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

2

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

METAL

Package Shape:

Package Style (Meter):

DISK BUTTON

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

END

Trade Compliance

DS1986U-F3-PPPP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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