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TBP18SA46J

Texas Instruments

TBP18SA46J by Texas Instruments

TBP18SA46J by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It features TTL technology, operates b/w 0-70°C, and has a package style of IN-LINE. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,388 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,388

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-

-

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Vyrian

USA . 3,924 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,924

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,618 parts In-Stock

1+ parts

$2.851

100+ parts

-

1k+ parts

$3.341

10k+ parts

-

1,618

$2.851

-

$3.341

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ChromeModa Solutions

Germany . 5,021 parts In-Stock

1+ parts

$3.203

100+ parts

$2.626

1k+ parts

-

10k+ parts

-

5,021

$3.203

$2.626

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IDEA Electronic Components Group

UK . 809 parts In-Stock

1+ parts

$3.203

100+ parts

-

1k+ parts

$2.883

10k+ parts

-

809

$3.203

-

$2.883

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AZTECH Wire

Italy . 419 parts In-Stock

1+ parts

$18.006

100+ parts

-

1k+ parts

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10k+ parts

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419

$18.006

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One Stop Electronics

USA . 694 parts In-Stock

1+ parts

$26.000

100+ parts

-

1k+ parts

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10k+ parts

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694

$26.000

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DigiPath Technology Company

USA . 2,020 parts In-Stock

1+ parts

-

100+ parts

$2.888

1k+ parts

-

10k+ parts

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2,020

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$2.888

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Corphita

USA . 1,783 parts In-Stock

1+ parts

-

100+ parts

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1,783

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Overview

Upgrade your next project with the TBP18SA46J by Texas Instruments, a premium OTP ROM that guarantees top-notch quality and reliability. Manufactured by the industry leader, this product is ideal for a wide range of applications. With its advanced technology and high memory density, this OTP ROM offers unparalleled value and benefits to customers seeking optimal performance in their designs. Trust Texas Instruments to deliver excellence in every product, including the TBP18SA46J.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal stability and reliability, making this product suitable for applications where temperature variations may occur.

No. of Terminals: 24

Having 24 terminals allows for more connectivity options and flexibility in integrating the OTP ROM into various systems.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this OTP ROM can function reliably even in demanding environments with elevated temperatures.

Organization: 512X8

The 512x8 organization provides a good balance between memory capacity and data width, making it suitable for applications requiring moderate storage and data handling capabilities.

Technology: TTL

The use of TTL technology ensures compatibility with a wide range of systems and devices, enhancing the versatility of this OTP ROM.

Memory Density: 4096 bit

With a memory density of 4096 bit, this OTP ROM offers sufficient storage capacity for storing program or configuration data in embedded systems.

Technical Specifications

OTP ROM TBP18SA46J attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

75 ns

JESD-30 Code:

R-XDIP-T24

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

155 mA

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TBP18SA46J Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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