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DS2506S

Maxim Integrated

DS2506S by Maxim Integrated

DS2506S by Maxim Integrated is an OTP ROM with 64KX1 organization, operating at -40 to 85 °C. It features a serial interface, 65536-bit memory density, and common I/O type. Ideal for industrial applications requiring small outline package style and asynchronous operation.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,496 parts In-Stock

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Anansix

USA . 949 parts In-Stock

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949

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Digiode

USA . 474 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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MARBEL Systems

Belgium . 2,255 parts In-Stock

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$2.276

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$2.276

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Texas Native Microelectronics

USA . 142 parts In-Stock

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$2.616

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$2.511

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$2.433

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$2.302

142

$2.616

$2.511

$2.433

$2.302

Kenton Components

USA . 5,372 parts In-Stock

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$3.139

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$2.762

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$2.762

Corohmni

South Africa . 361 parts In-Stock

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$4.125

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Modulus Dynamics

Lithuania . 3,409 parts In-Stock

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$4.651

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$4.651

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$4.651

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Qasali Group International

UK . 200 parts In-Stock

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$7.063

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$6.569

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$6.216

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$7.063

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$6.216

AZTECH Wire

Italy . 432 parts In-Stock

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$17.480

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One Stop Electronics

USA . 1,141 parts In-Stock

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$18.000

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Semicontronic

India . 1,490 parts In-Stock

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$28.000

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$27.300

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$27.160

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QUARKTWIN TECHNOLOGY LTD

USA . 27,496 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,525 parts In-Stock

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Continental Prestige Electronics

USA . 5,725 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,350 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Argo Parts USA

USA . 2,754 parts In-Stock

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Corphita

USA . 1,843 parts In-Stock

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Microchip USA

USA . 436 parts In-Stock

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Vigor

Singapore . 191 parts In-Stock

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Bastille Electronics

Australia . 42 parts In-Stock

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Overview

Unlock the power of secure data storage with the DS2506S by Maxim Integrated. Crafted with precision and quality in mind, this OTP ROM device offers unparalleled protection and reliability for your valuable information. Ideal for a wide range of applications, this product is designed to meet the demands of industrial environments while providing seamless integration and ease of use. Experience peace of mind knowing that your data is safe and accessible when you need it most. Upgrade to Maxim Integrated's DS2506S and elevate your data storage capabilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight casing for the OTP ROM chip.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, saving space and facilitating automated assembly processes.

Operating Mode: ASYNCHRONOUS

Allows for independent operations without the need for a clock signal, offering flexibility in usage.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently with a common supply voltage, making it compatible with a wide range of systems.

No. of Terminals: 8

Provides a simple interface for connection and communication with other components in the system.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures may be present, ensuring reliable performance.

Organization: 64KX1

Offers a large memory capacity of 64Kx1, suitable for storing a significant amount of data or instructions.

Minimum Operating Temperature: -40 °C

Can function in extreme cold conditions, making it versatile for different environmental settings.

Technology: MOS

Utilizes Metal-Oxide-Semiconductor technology for efficient and reliable data storage and retrieval.

Parallel or Serial: SERIAL

Operates in a serial manner for sequential data access, suitable for specific applications.

Technical Specifications

OTP ROM DS2506S attributes and parameters. Explore more OTP ROM devices from Maxim Integrated

Specs

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

5.31 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.13 mm

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.285 mm

Trade Compliance

DS2506S Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Maxim Integrated

Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.

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Management team

President & CEO

Tunc Doluca

Senior VP & CFO

Brian C. White

Senior VP, Technology & Manufacturing Group

Vivek Jain

Manufacturer fab locations 3

Fab name Location Fab Initiation Wafer Capacity

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Fabrication

Fab Initiation

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Philippines

Cavite

Wafer Capacity

489,000

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489,000

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Fabrication

Fab Initiation

-

USA

Beaverton

Wafer Capacity

312,000

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312,000

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Fabrication

Fab Initiation

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Thailand

Chon Buri

Wafer Capacity

194,000

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194,000

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