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AT27C020-55JU-T

Microchip Technology

AT27C020-55JU-T by Microchip Technology

AT27C020-55JU-T by Microchip Technology is a 256Kx8 OTP ROM with 55 ns access time, operating at 5V. It features a parallel interface, 3-STATE output, and industrial temperature grade. Ideal for applications requiring non-volatile memory storage in harsh environments.

Median Price

$4.760

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,300 parts In-Stock

1+ parts

$4.760

100+ parts

$4.410

1k+ parts

$4.130

10k+ parts

-

1,300

$4.760

$4.410

$4.130

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$4.553

100+ parts

-

1k+ parts

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35

$4.553

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VNN

France . 4,563 parts In-Stock

1+ parts

-

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4,563

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Vyrian

USA . 626 parts In-Stock

1+ parts

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626

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,059 parts In-Stock

1+ parts

$3.800

100+ parts

-

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1,059

$3.800

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Semicontronic

India . 755 parts In-Stock

1+ parts

$3.800

100+ parts

$3.705

1k+ parts

$3.686

10k+ parts

-

755

$3.800

$3.705

$3.686

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Aztec Data Supply Inc.

USA . 18,081 parts In-Stock

1+ parts

$4.312

100+ parts

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18,081

$4.312

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Continental Prestige Electronics

USA . 1,364 parts In-Stock

1+ parts

$4.553

100+ parts

-

1k+ parts

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10k+ parts

$4.462

1,364

$4.553

-

-

$4.462

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.553

100+ parts

-

1k+ parts

$4.325

10k+ parts

$4.234

100

$4.553

-

$4.325

$4.234

Corohmni

South Africa . 653 parts In-Stock

1+ parts

$5.484

100+ parts

-

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653

$5.484

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QUARKTWIN TECHNOLOGY LTD

USA . 14,270 parts In-Stock

1+ parts

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14,270

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Lixinc

USA . 4,866 parts In-Stock

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4,866

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Fulton Briggs Corp.

USA . 2,518 parts In-Stock

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2,518

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Argo Parts USA

USA . 1,213 parts In-Stock

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1,213

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Discover the cutting-edge AT27C020-55JU-T from Microchip Technology, a leading manufacturer known for top-quality products. This OTP ROM device offers unparalleled reliability and performance for a wide range of applications. With its advanced technology and industrial-grade design, this chip provides customers with a seamless experience and maximum value. Upgrade your projects with the AT27C020-55JU-T and unlock endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to mount on circuit boards, saving time and effort during assembly.

Operating Mode: ASYNCHRONOUS

Allows for independent operation without synchronization, providing flexibility in usage.

Nominal Supply Voltage / Vsup (V): 5

Stable voltage supply for consistent performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Output Characteristics: 3-STATE

Allows for tristate outputs, enhancing versatility in design.

Technology: CMOS

Low power consumption and high noise immunity, ideal for energy-efficient applications.

Memory Density: 2097152 bit

High memory density for storing large amounts of data.

Maximum Access Time: 55 ns

Fast access time for quick data retrieval.

Technical Specifications

OTP ROM AT27C020-55JU-T attributes and parameters. Explore more OTP ROM devices from Microchip Technology

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

32

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.45X.55

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

245

Programming Voltage (V):

13

Maximum Seated Height:

3.556 mm

Maximum Standby Current:

.0001 Amp

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

AT27C020-55JU-T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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