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M27W016100B1

STMicroelectronics

M27W016100B1 by STMicroelectronics

M27W016100B1 by STMicroelectronics is a 16-bit OTP ROM with a 1M x 16 organization, operating asynchronously at supply voltages of 2.7V to 3.6V. It features a max access time of 100 ns and operates within -0 °C to +70 °C. Ideal for commercial applications requiring reliable memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,935 parts In-Stock

1+ parts

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2,935

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Vyrian

USA . 1,917 parts In-Stock

1+ parts

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1,917

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Anansix

USA . 496 parts In-Stock

1+ parts

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100+ parts

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496

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 246 parts In-Stock

1+ parts

$2.869

100+ parts

-

1k+ parts

$2.583

10k+ parts

-

246

$2.869

-

$2.583

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MKK Technologies

India . 330 parts In-Stock

1+ parts

$5.396

100+ parts

-

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330

$5.396

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DigiPath Technology Company

USA . 330 parts In-Stock

1+ parts

$5.396

100+ parts

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330

$5.396

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Corphita

USA . 3,920 parts In-Stock

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3,920

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Parana Technologies

USA . 2,319 parts In-Stock

1+ parts

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100+ parts

$3.431

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2,319

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$3.431

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Overview

Unlock the potential of your next project with the M27W016100B1 OTP ROM from STMicroelectronics, a leader in innovative semiconductor solutions. Offering unmatched reliability and performance, this high-quality device is ideal for a range of applications—from consumer electronics to industrial systems. With its seamless integration and low power consumption, you’ll enjoy enhanced efficiency and longevity, making it the smart choice for engineers seeking exceptional value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring reliability in various applications.

Package Shape: RECTANGULAR

Ideal for efficient space utilization on PCBs.

Operating Mode: ASYNCHRONOUS

Allows for simpler system design and faster data processing.

Input/Output Type: COMMON

Facilitates easier integration with a wide range of systems.

Nominal Supply Voltage / Vsup: 3 V

Standard voltage level ensures compatibility with many devices.

Power Supplies (V): 3/3.3 V

Flexible power supply options enhance versatility in applications.

No. of Terminals: 42

Multiple terminals provide enhanced connectivity options.

Package Style (Meter): IN-LINE

In-line configuration simplifies assembly and routing on PCBs.

Maximum Operating Temperature: 70 °C

Suitable for commercial environments without risk of overheating.

Organization: 1MX16

Efficient memory organization supports complex applications.

Output Characteristics: 3-STATE

Allows for efficient bus sharing in multi-device environments.

Minimum Operating Temperature: 0 °C

Ensures functionality in a wide range of operating conditions.

Terminal Finish: MATTE TIN

Provides good solderability and corrosion resistance.

Terminal Position: DUAL

Enables flexible PC board layout and design.

Maximum Seated Height: 5.08 mm

Compact height enhances compatibility with thin devices.

Width: 15.24 mm

Compact width allows for denser packing on PCBs.

Minimum Supply Voltage (Vsup): 2.7 V

Lower voltage options enhance energy efficiency.

Length: 52.455 mm

Size enables fitting into various electronic devices.

Temperature Grade: COMMERCIAL

Reliability in typical commercial environments serves a broad market.

Technology: CMOS

Low power consumption makes it excellent for battery-operated devices.

Parallel or Serial: PARALLEL

Faster data access speeds due to simultaneous data handling.

Terminal Form: THROUGH-HOLE

Robust mechanical connection increases durability.

No. of Words: 1048576 words

High storage capacity supports large data sets and applications.

Memory Width: 16

Allows for efficient data transfer rates, making it suitable for performance-critical applications.

Terminal Pitch: 2.54 mm

Standard pitch facilitates integration with various PCB designs.

No. of Words Code: 1M

Large memory size enables use in sophisticated applications.

Maximum Supply Voltage (Vsup): 3.6 V

Flexible operating range allows adaptability in different designs.

Memory Density: 16777216 bit

High memory density allows for more compact designs while retaining functionality.

Memory IC Type: OTP ROM

One-Time Programmable nature suits applications needing permanent data storage.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current enhances energy efficiency.

Maximum Access Time: 100 ns

Fast access time ensures quick data retrieval for performance-sensitive applications.

Technical Specifications

OTP ROM M27W016100B1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Additional Features:

90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.

Input/Output Type:

COMMON

JESD-30 Code:

R-PDIP-T42

JESD-609 Code:

e3

Length:

52.455 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

42

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27W016100B1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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