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M27W016110N1T

STMicroelectronics

M27W016110N1T by STMicroelectronics

M27W016110N1T by STMicroelectronics is a 16Mbit OTP ROM with a 3V nominal voltage, featuring asynchronous operation and a max access time of 110 ns. Its compact SOIC package (12mm x 18.4mm) makes it ideal for space-constrained applications. This device operates efficiently within commercial temperature ranges from 0 °C to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,114 parts In-Stock

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Vyrian

USA . 1,320 parts In-Stock

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1,320

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Digiode

USA . 1,069 parts In-Stock

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1,069

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 696 parts In-Stock

1+ parts

$5.235

100+ parts

-

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$4.711

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696

$5.235

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$4.711

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MKK Technologies

India . 1,840 parts In-Stock

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$9.844

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$9.844

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DigiPath Technology Company

USA . 1,840 parts In-Stock

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$9.844

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1,840

$9.844

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Corphita

USA . 809 parts In-Stock

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Parana Technologies

USA . 516 parts In-Stock

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$6.259

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516

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$6.259

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Overview

Unlock unparalleled performance with the M27W016110N1T from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality OTP ROM offers reliable data retention and low power consumption, making it ideal for a myriad of applications, from consumer electronics to automotive systems. With ST’s renowned commitment to excellence, you gain peace of mind and enhanced efficiency, ensuring your projects are powered by cutting-edge technology that meets the highest standards.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring reliability and easy integration into various applications.

Surface Mount: YES

Allows for compact design and automatic assembly, improving manufacturing efficiency.

Package Shape: RECTANGULAR

Optimizes board space, making it suitable for dense circuit layouts.

Operating Mode: ASYNCHRONOUS

Provides flexibility in operation, enabling seamless integration with various systems.

Input/Output Type: COMMON

Facilitates easy interfacing with a range of other components, promoting versatility.

Nominal Supply Voltage / Vsup (V): 3

Standard voltage level ensures compatibility with many existing systems.

Power Supplies (V): 3/3.3

Offers flexibility for new designs using either power supply option.

No. of Terminals: 48

Provides ample connection options, allowing for greater functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Ideal for space-constrained designs, facilitating compact device architecture.

Maximum Operating Temperature: 70 °C

Suitable for applications with moderate temperature ranges, ensuring reliability and performance.

Organization: 1MX16

Efficient data organization allows improved system performance and quicker access times.

Output Characteristics: 3-STATE

Enables efficient data management among multiple components, reducing load and contention.

Minimum Operating Temperature: 0 °C

Supports a wide range of environmental conditions, enhancing application versatility.

Terminal Finish: TIN LEAD

Provides excellent solderability and long-term reliability.

Terminal Position: DUAL

Allows for versatile mounting options in different systems.

Maximum Seated Height: 1.2 mm

Ultra-thin profile ideal for space-sensitive applications.

Width: 12 mm

Compact width facilitates denser board designs without sacrificing performance.

Minimum Supply Voltage (Vsup): 2.7 V

Ensures operation in low-power designs, enhancing energy efficiency.

Length: 18.4 mm

Standard length for easy integration into various PCB layouts.

Temperature Grade: COMMERCIAL

Meets commercial standards suitable for a wide range of consumer applications.

Technology: CMOS

Offers low power consumption and high-speed operation, enhancing overall efficiency.

Parallel or Serial: PARALLEL

Facilitates faster data transfer rates, improving overall system performance.

Terminal Form: GULL WING

Supports efficient soldering processes and better mechanical stability on PCBs.

No. of Words: 1048576 words

Provides substantial memory capacity for data storage needs in applications.

Memory Width: 16

Enables efficient data handling and processing capabilities in various applications.

Terminal Pitch: 0.5 mm

Compact pitch allows for more connections in smaller footprints, beneficial in high-density designs.

No. of Words Code: 1M

Supports substantial code storage requirements for many applications.

Maximum Supply Voltage (Vsup): 3.6 V

Allows for operation in higher performance circuits, broadening application range.

Memory Density: 16777216 bit

High density data storage facilitates efficient and effective data management.

Memory IC Type: OTP ROM

One-time programmable memory is ideal for applications that require permanent data retention.

Maximum Standby Current: 0.0001 Amp

Low standby current consumption enhances energy efficiency, suitable for battery-powered devices.

Maximum Access Time: 110 ns

Fast access time ensures quick retrieval of stored data, improving system responsiveness.

Technical Specifications

OTP ROM M27W016110N1T attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

110 ns

Additional Features:

90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

18.4 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

12 mm

Trade Compliance

M27W016110N1T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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