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M27W016110M1

STMicroelectronics

M27W016110M1 by STMicroelectronics

M27W016110M1 from STMicroelectronics is a 16Mb OTP ROM featuring asynchronous operation and a max access time of 110 ns. It operates at supply voltages b/w 2.7V and 3.6V, making it ideal for commercial applications. Its compact SO package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,849 parts In-Stock

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3,849

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Digiode

USA . 1,453 parts In-Stock

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1,453

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Anansix

USA . 831 parts In-Stock

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831

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,391 parts In-Stock

1+ parts

$5.430

100+ parts

-

1k+ parts

$4.887

10k+ parts

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1,391

$5.430

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$4.887

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MKK Technologies

India . 570 parts In-Stock

1+ parts

$10.210

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570

$10.210

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DigiPath Technology Company

USA . 570 parts In-Stock

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$10.210

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570

$10.210

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Parana Technologies

USA . 2,316 parts In-Stock

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$6.492

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2,316

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$6.492

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Corphita

USA . 1,284 parts In-Stock

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Overview

Unlock the potential of your projects with the M27W016110M1 OTP ROM from STMicroelectronics. Renowned for its superior quality and reliability, this compact solution offers seamless integration and robust performance across various applications, from consumer electronics to industrial systems. Enjoy the benefits of low power consumption and rapid access times, all while backed by STMicroelectronics' commitment to innovation and excellence. Choose M27W016110M1 for a smarter, more efficient design!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and supports modern manufacturing techniques.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout in PCB design, facilitating efficient integration into electronic devices.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enhances performance, allowing for faster data retrieval without the need for a clock signal.

Input/Output Type: COMMON

Common I/O configuration simplifies connections in a circuit, enabling easier integration and reducing design complexity.

Nominal Supply Voltage / Vsup: 3V

A nominal supply voltage of 3V is standard and widely supported, providing compatibility with many systems.

Power Supplies (V): 3/3.3V

Support for both 3V and 3.3V power supplies enhances versatility, accommodating diverse electrical requirements.

No. of Terminals: 44

With 44 terminals, the product offers ample connectivity options, making it suitable for complex applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style maximizes space efficiency on PCBs, ideal for compact electronic designs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in varied environmental conditions.

Organization: 1MX16

This organization provides a balanced memory structure, facilitating efficient data storage and retrieval.

Output Characteristics: 3-STATE

3-state output means multiple devices can share the same bus without interference, enhancing design flexibility.

Minimum Operating Temperature: 0 °C

Operational range starting at 0 °C allows for reliable performance in both indoor and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and reduces oxidation, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for more compact layouts and enhanced routing options on PCBs.

Maximum Seated Height: 3mm

A low seated height of 3mm is advantageous for space-constrained applications, minimizing overall device thickness.

Width: 12.6mm

Narrow width helps optimize PCB real estate, enabling the design of compact electronic devices.

Minimum Supply Voltage (Vsup): 2.7V

Low minimum supply voltage ensures compatibility with a broad range of power sources.

Length: 28.5mm

The length of 28.5mm fits well in various applications, allowing for flexible PCB designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard operating conditions in consumer electronics.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making it ideal for modern electronic applications.

Parallel or Serial: PARALLEL

Parallel operation enables faster data transfer rates, improving overall system performance.

Terminal Form: GULL WING

Gull wing terminals facilitate ease of soldering and improve reliability in surface mount applications.

No. of Words: 1048576 words

With 1,048,576 words, the memory capacity caters to a variety of complex programming requirements.

Memory Width: 16

A memory width of 16 bits allows for efficient data processing and storage, enhancing overall performance.

Terminal Pitch: 1.27mm

A 1.27mm terminal pitch enables easy connections with standard PCB layouts and components.

No. of Words Code: 1M

Support for 1M words provides substantial memory space for applications demanding significant data storage.

Maximum Supply Voltage (Vsup): 3.6V

The maximum supply voltage of 3.6V allows for compatibility with various power sources while ensuring optimal performance.

Memory Density: 16777216 bit

High memory density of 16,777,216 bits makes it suitable for high-performance applications needing extensive data capacity.

Memory IC Type: OTP ROM

As an OTP ROM, it provides a secure means of storing firmware and other critical data that does not require rewriting.

Maximum Standby Current: 0.0001 Amp

Ultra-low standby current enhances energy efficiency, vital for battery-powered devices and green electronics.

Maximum Access Time: 110 ns

A maximum access time of 110 ns ensures quick data retrieval, boosting system performance across applications.

Technical Specifications

OTP ROM M27W016110M1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

110 ns

Additional Features:

90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

28.5 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

44

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP44,.63

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

12.6 mm

Trade Compliance

M27W016110M1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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