Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M27W016110M1 from STMicroelectronics is a 16Mb OTP ROM featuring asynchronous operation and a max access time of 110 ns. It operates at supply voltages b/w 2.7V and 3.6V, making it ideal for commercial applications. Its compact SO package ensures efficient space utilization in electronic designs.
Median Price
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Vyrian
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Digiode
Anansix
IDEA Electronic Components Group
$5.430
$4.887
MKK Technologies
$10.210
DigiPath Technology Company
Parana Technologies
$6.492
Corphita
The durable plastic/epoxy material provides excellent protection and reliability, making it suitable for various applications.
Surface mount capability allows for efficient use of PCB space and supports modern manufacturing techniques.
The rectangular shape optimizes layout in PCB design, facilitating efficient integration into electronic devices.
Asynchronous operation enhances performance, allowing for faster data retrieval without the need for a clock signal.
Common I/O configuration simplifies connections in a circuit, enabling easier integration and reducing design complexity.
A nominal supply voltage of 3V is standard and widely supported, providing compatibility with many systems.
Support for both 3V and 3.3V power supplies enhances versatility, accommodating diverse electrical requirements.
With 44 terminals, the product offers ample connectivity options, making it suitable for complex applications.
The small outline package style maximizes space efficiency on PCBs, ideal for compact electronic designs.
A maximum operating temperature of 70 °C ensures reliability in varied environmental conditions.
This organization provides a balanced memory structure, facilitating efficient data storage and retrieval.
3-state output means multiple devices can share the same bus without interference, enhancing design flexibility.
Operational range starting at 0 °C allows for reliable performance in both indoor and outdoor applications.
Matte tin terminal finish provides good solderability and reduces oxidation, ensuring reliable electrical connections.
Dual terminal positioning allows for more compact layouts and enhanced routing options on PCBs.
A low seated height of 3mm is advantageous for space-constrained applications, minimizing overall device thickness.
Narrow width helps optimize PCB real estate, enabling the design of compact electronic devices.
Low minimum supply voltage ensures compatibility with a broad range of power sources.
The length of 28.5mm fits well in various applications, allowing for flexible PCB designs.
Commercial temperature grade indicates suitability for standard operating conditions in consumer electronics.
CMOS technology provides low power consumption and high-speed operation, making it ideal for modern electronic applications.
Parallel operation enables faster data transfer rates, improving overall system performance.
Gull wing terminals facilitate ease of soldering and improve reliability in surface mount applications.
With 1,048,576 words, the memory capacity caters to a variety of complex programming requirements.
A memory width of 16 bits allows for efficient data processing and storage, enhancing overall performance.
A 1.27mm terminal pitch enables easy connections with standard PCB layouts and components.
Support for 1M words provides substantial memory space for applications demanding significant data storage.
The maximum supply voltage of 3.6V allows for compatibility with various power sources while ensuring optimal performance.
High memory density of 16,777,216 bits makes it suitable for high-performance applications needing extensive data capacity.
As an OTP ROM, it provides a secure means of storing firmware and other critical data that does not require rewriting.
Ultra-low standby current enhances energy efficiency, vital for battery-powered devices and green electronics.
A maximum access time of 110 ns ensures quick data retrieval, boosting system performance across applications.
OTP ROM M27W016110M1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics
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M27W016110M1 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
1N4148WT
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
BAV99
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
1N4148WS
Dc Components
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
SS14
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRA160T3G
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
Changzhou Galaxy Century Microelectronics
Jinan Jingheng Electronics
MICRODIODE ELECTRONICS SHENZHEN CO LTD
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
SN74S474N1
Texas Instruments
SN74S474N1 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at 5V, has a max access time of 75ns, and consumes up to 155mA. This IC is ideal for commercial applications requiring non-volatile memory storage in a rectangular package style.
SNC54S473J
The Texas Instruments SNC54S473J is a MIL-STD-883 Class B OTP ROM with 512x8 organization and 4096-bit memory density. It operates b/w -55°C to 125°C, featuring a max access time of 85ns. Ideal for military applications requiring reliable TTL technology in a ceramic package.
AT27C1024-45JC
Atmel
Atmel's AT27C1024-45JC is a 64KX16 OTP ROM with 45 ns access time, operating at 5V. It features 3-STATE output and supports parallel interface. Commonly used in commercial applications requiring non-volatile memory storage.
HS1-6664RH-Q
Harris Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
DS2502-E48
DS2502-E48 by Maxim Integrated is a 1024-bit OTP ROM with 3/5V power supplies, operating in synchronous mode. Its cylindrical package and through-hole terminals make it suitable for industrial applications requiring reliable non-volatile memory storage. With a temperature range of -40 to 85°C, it offers secure data storage in harsh environments.
JBP34SA1XMFK
JBP34SA1XMFK by Texas Instruments is a 256x4 OTP ROM with 1024-bit memory density. Operating at -55 to 125°C, it has a 5V supply voltage and comes in a ceramic chip carrier package. Ideal for military-grade applications requiring reliable non-volatile memory storage.
CMS216-200
Texas Instruments' CMS216-200 is a 256KX8 OTP ROM with 60 terminals. Operating at 5V, it offers 3-STATE output and supports parallel mode. Ideal for commercial applications, this CMOS technology device has a memory density of 2097152 bit and max access time of 200 ns.
NM27C210VE150
National Semiconductor
NM27C210VE150 by National Semiconductor is a 64KX16 OTP ROM with 150 ns access time. Operating at 5V, it has 44 terminals in a chip carrier package. Ideal for industrial applications requiring non-volatile memory storage.
TBP18SA46NP3
TBP18SA46NP3 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates b/w 0-70°C, has a max access time of 75ns, and consumes up to 155mA. Ideal for commercial applications requiring reliable TTL technology in an in-line package style.
JBP28L42MJ
JBP28L42MJ by Texas Instruments is a 512x8 OTP ROM with 70ns access time, operating at 25MHz. It has a supply voltage of 5V and operates in military-grade temperature range. Suitable for applications requiring non-volatile memory storage in harsh environments.
CMS210-250
Texas Instruments' CMS210-250 is a 128KX16 OTP ROM with 60 terminals. Operating asynchronously at 5V, it offers 3-STATE output and supports parallel mode. Ideal for commercial applications, this CMOS technology microelectronic assembly has a max access time of 250ns.
5962-01-236-1522
Texas Instruments' 5962-01-236-1522 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
TBP24SA10J4
TBP24SA10J4 by Texas Instruments is a 256x4 OTP ROM with 1024-bit memory density. Operating at 5V, it has a max access time of 65ns and consumes up to 100mA. This TTL technology chip in ceramic package is ideal for commercial applications requiring reliable non-volatile memory storage.
TBP28L86AJW
TBP28L86AJW by Texas Instruments is an OTP ROM with 1KX8 organization, 8192 bit memory density, and 110 ns max access time. It is used in applications requiring non-volatile memory storage with a parallel interface, operating at temperatures b/w 0 to 70 °C.
5962-01-186-0376
Texas Instruments' 5962-01-186-0376 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
5962-01-053-0019
Texas Instruments' 5962-01-053-0019 is a 1KX4 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 60ns and operates in commercial temperature grade. This rectangular package with 18 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
JBP28S45MJ
JBP28S45MJ by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at a max temperature of 125°C and has an access time of 60ns. Ideal for military-grade applications requiring reliable non-volatile memory storage in harsh environments.
TBP24SA41J
TBP24SA41J by Texas Instruments is an OTP ROM with 1KX4 organization, operating at 5V. It features a memory density of 4096 bit and max access time of 60ns. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.
TBP18SA22J
TBP18SA22J by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology environments.
5962-01-050-6942
Texas Instruments' 5962-01-050-6942 is a 5V OTP ROM with 1KX4 organization, 4096-bit memory density, and 60ns max access time. Ideal for commercial applications requiring reliable non-volatile memory storage in a rectangular plastic/epoxy package with 18 terminals.
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M27W101-80K6
STMicroelectronics
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M27W101-80K6TR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .000015 Amp;
M27W01690M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
M27W016100N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M27W01690B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M27W016110B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1048576 words;
M27W01690N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M27W016100B1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
M27W016110M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
M27W016100N1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M27W016110N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Organization: 1MX16;
M27W016110S1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR; Terminal Pitch: 1.778 mm;
M27W016100S1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR; No. of Words Code: 1M;
M27W01690M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 3 mm;
M27W016100M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 16777216 bit;
M27W016110N1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 1M;
M27W016110B1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
M27W016100B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP42,.6;
M27W016100M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 3/3.3;
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