Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TBP18S42NP3 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at 5V, has a max access time of 75ns, and supports TTL technology. This rectangular package with 20 terminals is ideal for commercial applications requiring non-volatile memory storage.
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The use of plastic/epoxy as the package body material makes this OTP ROM durable and resistant to damage.
With a supply voltage of 5V, this OTP ROM can easily be integrated into various electronic systems and circuits.
The rectangular package shape allows for easy placement and installation of this OTP ROM in different electronic devices.
The OTP ROM can operate efficiently at temperatures up to 70°C, ensuring reliable performance in various environments.
With an organization of 512 words by 8 memory width, this OTP ROM offers sufficient storage capacity for storing program data.
The use of TTL technology in this OTP ROM ensures fast and reliable data processing and retrieval.
The OTP ROM has a high number of words, allowing for extensive data storage and access.
An 8 memory width enhances the data processing capabilities of this OTP ROM, making it suitable for complex applications.
With a memory density of 4096 bit, this OTP ROM offers ample storage space for program data.
The maximum access time of 75 ns ensures quick retrieval of data from this OTP ROM, enhancing overall system performance.
OTP ROM TBP18S42NP3 attributes and parameters. Explore more OTP ROM devices from Texas Instruments
Maximum Access Time:
JESD-30 Code:
Memory Density:
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Memory Width:
No. of Terminals:
No. of Words:
No. of Words Code:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Power Supplies (V):
Sub-Category:
Nominal Supply Voltage / Vsup (V):
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Technology:
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Terminal Position:
TBP18S42NP3 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N7002
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Rectron
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
Digitron Semiconductors
Diotec Semiconductor Ag
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
MC7805CTG
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
SS14
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
TBP24S81N3
Texas Instruments
TBP24S81N3 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density. It operates at temperatures from 0 to 70°C, with a max access time of 70ns. Ideal for commercial applications requiring reliable memory storage in a compact IN-LINE package style.
5962-01-165-3114
Texas Instruments' 5962-01-165-3114 is a 32X8 OTP ROM with 5V supply, 16 terminals, and 40ns access time. Ideal for commercial applications requiring fast memory access in a rectangular plastic package with through-hole terminals.
TBP18SA030NP1
TBP18SA030NP1 by Texas Instruments is a 32x8 OTP ROM with 5V supply, 40ns access time, and 110mA max supply current. It is used in commercial applications requiring non-volatile memory storage in a rectangular plastic/epoxy package with 16 terminals.
5962-01-138-5796
Texas Instruments' 5962-01-138-5796 is a 1KX4 OTP ROM with 4096-bit memory density. Operating at 5V, it offers a max access time of 60ns and operates in commercial temperature grades. This rectangular package with 18 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
5962-01-165-3131
Texas Instruments' 5962-01-165-3131 is a 32X8 OTP ROM with 5V supply, 40ns access time, and 110mA max supply current. Ideal for commercial applications requiring fast memory access in a rectangular plastic package with through-hole terminals.
SN74S188N1
SN74S188N1 by Texas Instruments is a 32x8 OTP ROM IC with 40ns max access time. Operating at 5V, it has 16 terminals in an IN-LINE package style. Ideal for commercial applications requiring fast memory retrieval and a temperature range of 0-70°C.
AT27C256R-70JI
Atmel
Atmel's AT27C256R-70JI is a 32Kx8 OTP ROM with 70ns access time, operating at 5V. It features asynchronous mode, 3-STATE output, and industrial temperature grade. Commonly used in applications requiring non-volatile memory storage with parallel interface.
AT27C512R-70PC
AT27C512R-70PC by Atmel is a 64KX8 OTP ROM with 70ns access time, operating at 5V. It features a 3-STATE output and operates in parallel mode. Commonly used in commercial applications requiring non-volatile memory storage with a memory density of 524288 bits.
BQ2022ALPRE3
BQ2022ALPRE3 by Texas Instruments is an OTP ROM with 1024-bit memory density. It operates asynchronously at a max clock frequency of 0.01667 MHz and has a nominal voltage of 2.7V. This device, in a cylindrical package shape, is commonly used for applications requiring non-volatile memory storage with low power consumption.
5962-01-050-6948
Texas Instruments' 5962-01-050-6948 is a 1KX4 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 60ns and operates in commercial temperature grade. This rectangular package with 18 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
TBP18S22MJ
TBP18S22MJ by Texas Instruments is a MILITARY-grade OTP ROM with 256x8 organization, 2048-bit memory density, and 80ns max access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
82S123/BEA
Philips Semiconductors
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T16;
5962-01-140-2997
Texas Instruments' 5962-01-140-2997 is a 5V OTP ROM with 1KX4 organization, 4096-bit memory density, and operates b/w 0 to 70°C. It has an IN-LINE package style, suitable for commercial-grade applications requiring reliable non-volatile memory storage in a compact form factor.
TBP24S81-55MJ
TBP24S81-55MJ by Texas Instruments is a MILITARY-grade OTP ROM with 2KX4 organization, 8192-bit memory density, and 55ns max access time. It operates b/w -55°C to 125°C, making it suitable for rugged environments requiring fast data retrieval in military applications.
DS2505P+T&R
Maxim Integrated
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Additional Features: MICROLAN COMPATIBLE;
AT27LV020A-12JU
Microchip Technology
AT27LV020A-12JU by Microchip: 256KX8 OTP ROM with 3.3V/5V supplies, 120ns access time, and 85°C max temp. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact chip carrier package.
JBP28LA22MJ
JBP28LA22MJ by Texas Instruments is a MILITARY-grade OTP ROM with 256x8 organization, 2048-bit memory density, and 80ns max access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
DS2506S+
DS2506S+ by Analog Devices is a 64KX1 OTP ROM with 65536 bit memory density. It operates at 5V, -40 to 85 °C, and has a serial interface. Suitable for industrial applications, it comes in a small outline package with gull wing terminals for surface mounting.
TBP24SA81-55JP4
TBP24SA81-55JP4 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 55ns max access time. It features a rectangular ceramic package with 18 terminals in-line, suitable for commercial-grade TTL technology applications.
5962-01-135-8054
Texas Instruments' 5962-01-135-8054 is a 1KX4 OTP ROM with 4096-bit memory density. Operating at 5V, it offers a max access time of 60ns and operates in commercial temperature grades. This rectangular ceramic package with 18 terminals is ideal for applications requiring reliable non-volatile memory storage in TTL technology.
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UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TBP18S42J
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 512;
TBP18S22J4
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;
TBP18S030N
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
TBP18S22NP1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T20;
TBP18S030NP3
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
TBP18S42J4
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP20,.3;
TBP18S030J4
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
TBP18S22JP4
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 256X8;
TBP18S030N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP16,.3;
TBP18S22N3
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;
TBP18S22N
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 2048 bit;
TBP18S030NP1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T16;
TBP18S22NP3
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
TBP18S030MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 32X8;
TBP18S22J
TBP18S030J
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T16;
TBP18S030JP4
TBP18S030N3
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
TBP18S22N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
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