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5962-01-196-1446

Texas Instruments

5962-01-196-1446 by Texas Instruments

Texas Instruments' 5962-01-196-1446 is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it offers a max access time of 60ns and operates in commercial temperature grades. This rectangular package with 20 terminals is ideal for applications requiring reliable non-volatile memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,643

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Digiode

USA . 404 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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404

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 474 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

-

10k+ parts

$0.374

474

$0.390

-

-

$0.374

Northwest PG Solutions

USA . 265 parts In-Stock

1+ parts

$0.429

100+ parts

-

1k+ parts

-

10k+ parts

$0.378

265

$0.429

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-

$0.378

Parana Technologies

USA . 2,126 parts In-Stock

1+ parts

$2.039

100+ parts

-

1k+ parts

$2.562

10k+ parts

-

2,126

$2.039

-

$2.562

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IDEA Electronic Components Group

UK . 1,751 parts In-Stock

1+ parts

$2.291

100+ parts

-

1k+ parts

$2.062

10k+ parts

-

1,751

$2.291

-

$2.062

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ChromeModa Solutions

Germany . 7 parts In-Stock

1+ parts

$2.291

100+ parts

$1.879

1k+ parts

-

10k+ parts

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7

$2.291

$1.879

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AZTECH Wire

Italy . 500 parts In-Stock

1+ parts

$5.793

100+ parts

-

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500

$5.793

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One Stop Electronics

USA . 1,155 parts In-Stock

1+ parts

$27.000

100+ parts

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1,155

$27.000

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DigiPath Technology Company

USA . 1,747 parts In-Stock

1+ parts

-

100+ parts

$2.066

1k+ parts

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1,747

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$2.066

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Corphita

USA . 643 parts In-Stock

1+ parts

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643

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Overview

Unlock endless possibilities with the 5962-01-196-1446 by Texas Instruments. This OTP ROM offers unparalleled quality and reliability, thanks to its renowned manufacturer. Perfect for a wide range of applications, this product provides customers with exceptional value and benefits. Say goodbye to limitations and hello to innovation with the 5962-01-196-1446.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective packaging material for the OTP ROM, ensuring that the product remains protected and reliable in various applications.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a common voltage level, making it compatible with many systems and easy to integrate into existing setups.

Organization: 512X8

Offers a good balance between storage capacity and data width, enabling efficient data storage and retrieval processes.

Technology: TTL

Utilizes TTL technology for reliable and fast operation, ensuring high performance and accuracy in data processing.

Memory IC Type: OTP ROM

Uses OTP ROM technology, which provides non-volatile memory storage that is reliable and secure, making it suitable for storing critical data.

Technical Specifications

OTP ROM 5962-01-196-1446 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

60 ns

JESD-30 Code:

R-PDIP-T20

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

20

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-196-1446 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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