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M38510/20402BEA

NXP Semiconductors

M38510/20402BEA by NXP Semiconductors

NXP Semiconductors' M38510/20402BEA is a MIL-M-38510 Class B OTP ROM with 512x4 organization, 2048-bit memory density, and 85ns max access time. It operates asynchronously at temperatures ranging from -55 to 125°C. This rectangular IN-LINE package is ideal for military-grade applications requiring reliable non-volatile memory storage.

Median Price

$17.760

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

M38510/20402BEA by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,698 parts In-Stock

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$0.350

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$35.170

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Anansix

USA . 3,428 parts In-Stock

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Digiode

USA . 1,890 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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North Shore Components

USA . 26 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 10 parts In-Stock

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Electronics Depot

USA . 5 parts In-Stock

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Sunrise Surplus Inc.

USA . 2 parts In-Stock

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First Choice Components Inc.

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Distributors (Availability)

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Corohmni

South Africa . 658 parts In-Stock

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$3.680

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Advanced Electronics

New Zealand . 8,256 parts In-Stock

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$5.844

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$5.786

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$5.552

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One Stop Electronics

USA . 1,150 parts In-Stock

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$8.000

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Ampacity Inc.

Singapore . 1,225 parts In-Stock

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UNI Independent Distributors

Spain . 8,071 parts In-Stock

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Corphita

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Alle Elektronik GmbH

Germany . 4,399 parts In-Stock

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Continental Prestige Electronics

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Aranea Global

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Argo Parts USA

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Perfect Parts

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Overview

Unlock the power of reliable and high-quality memory solutions with the M38510/20402BEA by NXP Semiconductors. As a trusted manufacturer in the industry, NXP Semiconductors delivers top-notch OTP ROM products that are perfect for military applications. With a wide operating temperature range, fast access time, and robust construction, this memory IC offers unmatched performance and durability. Trust NXP Semiconductors to provide you with the cutting-edge technology you need for your critical projects.

Feature Benefit Bullets

Screening Level: MIL-M-38510 Class B

This product meets the stringent military standards, ensuring reliability and durability in harsh environments.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and efficient communication between the memory and the system, enhancing performance.

Nominal Supply Voltage: 5V

Operating at a standard 5V supply voltage makes it compatible with most systems and easy to integrate.

Temperature Grade: MILITARY

Designed to withstand extreme temperatures, making it suitable for military and aerospace applications.

Memory IC Type: OTP ROM

One-Time Programmable Read-Only Memory ensures secure and permanent storage of critical data.

Technical Specifications

OTP ROM M38510/20402BEA attributes and parameters. Explore more OTP ROM devices from NXP Semiconductors

Specs

Maximum Access Time:

85 ns

JESD-30 Code:

R-XDIP-T16

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Terminals:

16

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

512X4

Package Body Material:

UNSPECIFIED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

M38510/20402BEA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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