Loading...

M27W01690N1

STMicroelectronics

M27W01690N1 by STMicroelectronics

M27W01690N1 by STMicroelectronics is a 16Mbit OTP ROM featuring a 3.3V supply and asynchronous operation. With a max access time of 90 ns and a compact SOIC package, it's ideal for embedded systems requiring reliable data storage in commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,884

-

-

-

-

Vyrian

USA . 3,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,513

-

-

-

-

Anansix

USA . 2,106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,106

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,006 parts In-Stock

1+ parts

$2.458

100+ parts

-

1k+ parts

$2.212

10k+ parts

-

1,006

$2.458

-

$2.212

-

MKK Technologies

India . 1,257 parts In-Stock

1+ parts

$4.623

100+ parts

-

1k+ parts

-

10k+ parts

-

1,257

$4.623

-

-

-

DigiPath Technology Company

USA . 1,257 parts In-Stock

1+ parts

$4.623

100+ parts

-

1k+ parts

-

10k+ parts

-

1,257

$4.623

-

-

-

Corphita

USA . 1,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,713

-

-

-

-

Parana Technologies

USA . 1,181 parts In-Stock

1+ parts

-

100+ parts

$2.939

1k+ parts

-

10k+ parts

-

1,181

-

$2.939

-

-

Overview

Unlock the potential of your projects with the M27W01690N1 OTP ROM from STMicroelectronics, a trusted leader in semiconductor innovation. This high-quality memory solution ensures reliable performance with minimal power consumption, making it perfect for various applications in consumer electronics, automotive systems, and industrial controls. Experience the seamless integration and robust design that enhance your product's efficiency and longevity, delivering exceptional value to your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight, durable, and cost-effective packaging, making it ideal for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient space usage on PCBs, enabling smaller and more compact device designs.

Package Shape: RECTANGULAR

The rectangular shape provides a standard form factor that is easy to handle and place on circuit boards.

Operating Mode: ASYNCHRONOUS

Asynchronous mode allows for faster operation without the need for a clock signal, improving system flexibility.

Input/Output Type: COMMON

A common input/output type enhances compatibility with various systems and reduces design complexity.

Nominal Supply Voltage / Vsup (V): 3.3

Running at a nominal voltage of 3.3V optimizes power consumption while maintaining performance, suitable for modern digital circuits.

Power Supplies (V): 3.3

Power supply at 3.3V aligns with prevalent standards in consumer electronics, ensuring broad applicability.

No. of Terminals: 48

With 48 terminals, this product offers ample connectivity options for more complex applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile make this ROM suitable for compact devices where space is a premium.

Maximum Operating Temperature: 70 °C

Rated to operate at up to 70 °C, this product is suitable for a wide range of environmental conditions.

Organization: 1MX16

The 1MX16 organization allows for higher data throughput and efficient memory usage.

Output Characteristics: 3-STATE

3-state output characteristics provide flexibility in design and prevent conflicts in multi-device configurations.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures performance in a variety of environments, including cold conditions.

Terminal Finish: TIN LEAD

Tin-lead finish offers excellent solderability and ensures robust connections on PCBs, enhancing reliability.

Terminal Position: DUAL

Dual terminal position facilitates easier integration into circuit boards, allowing for diverse layout options.

Maximum Seated Height: 1.2 mm

With a seated height of just 1.2mm, this component allows for low-profile designs and reduced overall product height.

Width: 12 mm

The compact width of 12mm contributes to space-efficient designs, beneficial for portable electronics.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum voltage of 3V provides flexibility in supply options and power management.

Length: 18.4 mm

The length of 18.4mm provides compatibility with standard PCB layouts while also maintaining a slim profile.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, this product ensures reliable performance across typical usage conditions.

Technology: CMOS

Using CMOS technology, this ROM delivers low power consumption and high speed, making it ideal for battery-operated devices.

Parallel or Serial: PARALLEL

Parallel access allows for faster data read operations, enhancing overall performance in data-intensive applications.

Terminal Form: GULL WING

Gull wing terminals provide improved solder joint strength and facilitate easier mounting on PCBs.

No. of Words: 1048576 words

With 1,048,576 words, this ROM delivers significant storage capacity for applications requiring large data sets.

Memory Width: 16

A memory width of 16 bits supports robust data handling and is suitable for various application requirements.

Terminal Pitch: 0.5 mm

A 0.5mm terminal pitch allows for higher density mounting, making it a great choice for compact designs.

No. of Words Code: 1M

The ability to store 1M words makes this OTP ROM a practical choice for applications needing substantial memory.

Maximum Supply Voltage (Vsup): 3.6 V

The upper limit of 3.6V allows for some voltage fluctuation without compromising performance, ensuring reliable operation.

Memory Density: 16777216 bit

A memory density of 16M bits indicates high capacity, suitable for extensive data storage needs.

Memory IC Type: OTP ROM

As an OTP ROM, this memory is ideal for applications requiring permanent data storage and is suitable for low-volume production runs.

Maximum Standby Current: 0.0001 Amp

With a max standby current of just 0.0001A, this product is power-efficient, making it perfect for energy-sensitive applications.

Maximum Access Time: 90 ns

A maximum access time of 90 ns ensures speedy access to stored data, enhancing system performance.

Technical Specifications

OTP ROM M27W01690N1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

90 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

18.4 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

12 mm

Trade Compliance

M27W01690N1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19