Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M27W01690N1 by STMicroelectronics is a 16Mbit OTP ROM featuring a 3.3V supply and asynchronous operation. With a max access time of 90 ns and a compact SOIC package, it's ideal for embedded systems requiring reliable data storage in commercial applications.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Anansix
IDEA Electronic Components Group
$2.458
$2.212
MKK Technologies
$4.623
DigiPath Technology Company
Corphita
Parana Technologies
$2.939
The use of plastic/epoxy material ensures lightweight, durable, and cost-effective packaging, making it ideal for a variety of applications.
Surface mount technology allows for efficient space usage on PCBs, enabling smaller and more compact device designs.
The rectangular shape provides a standard form factor that is easy to handle and place on circuit boards.
Asynchronous mode allows for faster operation without the need for a clock signal, improving system flexibility.
A common input/output type enhances compatibility with various systems and reduces design complexity.
Running at a nominal voltage of 3.3V optimizes power consumption while maintaining performance, suitable for modern digital circuits.
Power supply at 3.3V aligns with prevalent standards in consumer electronics, ensuring broad applicability.
With 48 terminals, this product offers ample connectivity options for more complex applications.
The small outline and thin profile make this ROM suitable for compact devices where space is a premium.
Rated to operate at up to 70 °C, this product is suitable for a wide range of environmental conditions.
The 1MX16 organization allows for higher data throughput and efficient memory usage.
3-state output characteristics provide flexibility in design and prevent conflicts in multi-device configurations.
A minimum operating temperature of 0 °C ensures performance in a variety of environments, including cold conditions.
Tin-lead finish offers excellent solderability and ensures robust connections on PCBs, enhancing reliability.
Dual terminal position facilitates easier integration into circuit boards, allowing for diverse layout options.
With a seated height of just 1.2mm, this component allows for low-profile designs and reduced overall product height.
The compact width of 12mm contributes to space-efficient designs, beneficial for portable electronics.
Operating at a minimum voltage of 3V provides flexibility in supply options and power management.
The length of 18.4mm provides compatibility with standard PCB layouts while also maintaining a slim profile.
Designed for commercial temperature ranges, this product ensures reliable performance across typical usage conditions.
Using CMOS technology, this ROM delivers low power consumption and high speed, making it ideal for battery-operated devices.
Parallel access allows for faster data read operations, enhancing overall performance in data-intensive applications.
Gull wing terminals provide improved solder joint strength and facilitate easier mounting on PCBs.
With 1,048,576 words, this ROM delivers significant storage capacity for applications requiring large data sets.
A memory width of 16 bits supports robust data handling and is suitable for various application requirements.
A 0.5mm terminal pitch allows for higher density mounting, making it a great choice for compact designs.
The ability to store 1M words makes this OTP ROM a practical choice for applications needing substantial memory.
The upper limit of 3.6V allows for some voltage fluctuation without compromising performance, ensuring reliable operation.
A memory density of 16M bits indicates high capacity, suitable for extensive data storage needs.
As an OTP ROM, this memory is ideal for applications requiring permanent data storage and is suitable for low-volume production runs.
With a max standby current of just 0.0001A, this product is power-efficient, making it perfect for energy-sensitive applications.
A maximum access time of 90 ns ensures speedy access to stored data, enhancing system performance.
OTP ROM M27W01690N1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics
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M27W01690N1 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
SN6505BDBVR
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
SMBJ18CA
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Bytesonic Electronics
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
World Products
M27C1001-45XC1
STMicroelectronics
STMicroelectronics M27C1001-45XC1 is a 128Kx8 OTP ROM with 45ns access time, operating at 5V. It features asynchronous mode, 3-STATE output, and common I/O type. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.
TBP18S42J4
TBP18S42J4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It operates at a nominal voltage of 5V, suitable for commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring reliable non-volatile memory storage in TTL technology.
TBP18SA46J4
TBP18SA46J4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates b/w 0-70°C, has a max access time of 75ns, and consumes up to 155mA. Ideal for commercial applications requiring reliable TTL technology in an IN-LINE package style.
AT27C256R-70JU
Microchip Technology
AT27C256R-70JU by Microchip Technology is a 32Kx8 OTP ROM with 70ns access time, operating at 5V. It features asynchronous mode, 3-STATE output, and industrial temperature grade. Commonly used in applications requiring non-volatile memory storage with parallel interface.
5962-01-093-8832
Texas Instruments' 5962-01-093-8832 is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and consumes up to 155mA. Ideal for commercial applications requiring reliable non-volatile memory storage in a rectangular plastic/epoxy package.
AT27LV512R-15TC
Atmel
AT27LV512R-15TC by Atmel is a 64KX8 OTP ROM with 150ns access time, operating at 5V. It features a small outline package, GULL WING terminals, and supports parallel operation. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.
AT27C512R-90PC
Atmel's AT27C512R-90PC is a 64KX8 OTP ROM with 90 ns access time, operating at 5V. It features 3-STATE output and common I/O type, suitable for commercial applications requiring reliable non-volatile memory storage in a compact IN-LINE package.
JBP34S1X-20MFK
JBP34S1X-20MFK by Texas Instruments is a 1024-bit OTP ROM with 256x4 organization and TTL technology. It operates b/w -55°C to 125°C, has a supply voltage of 5V, and comes in a ceramic chip carrier package. Ideal for military applications requiring reliable non-volatile memory storage.
AT27C040-90PI
AT27C040-90PI by Atmel is a 512KX8 OTP ROM with 90 ns access time, operating at 5V. It has 32 terminals in an IN-LINE package style and supports asynchronous operation. Ideal for industrial applications requiring non-volatile memory storage.
AT27C040-70JU
AT27C040-70JU by Microchip Technology is a 512KX8 OTP ROM with 70 ns access time, operating at 5V. It features a 3-STATE output and supports asynchronous operation. This chip carrier package is ideal for industrial applications requiring reliable non-volatile memory storage.
DS2406P/T&R
Maxim Integrated
DS2406P/T&R by Maxim Integrated is a 1Kx1 OTP ROM with 1024-bit memory density. Operating at 3V, it features a small outline package and industrial temperature grade. Suitable for applications requiring asynchronous operation and serial communication, it has a terminal pitch of 1.27mm and C-bend terminal form.
TBP24SA81-55J
TBP24SA81-55J by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 55 ns max access time. It features TTL technology, operates b/w 0 to 70°C, and has an IN-LINE package style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.
CY27C512-45JC
Cypress Semiconductor
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
DS2502+T&R
Analog Devices
Analog Devices' DS2502+T&R is a 1024-bit OTP ROM with 128x8 organization. Operating at 5V, it has a max access time of 15000ns and operates in industrial temperature range. Commonly used for secure data storage in applications requiring reliable non-volatile memory solutions.
5962-01-135-2700
Texas Instruments' 5962-01-135-2700 is a MILITARY-grade OTP ROM with 256X4 organization, 1024-bit memory density, and 75ns max access time. Ideal for applications requiring secure non-volatile memory storage in harsh environments.
AT27C512R-12JI
Atmel's AT27C512R-12JI is a 64KX8 OTP ROM chip with 120ns access time, operating at 5V. It features 3-STATE output and operates in asynchronous mode. Widely used in industrial applications due to its CMOS technology and 524288-bit memory density.
5962-01-165-3130
Texas Instruments' 5962-01-165-3130 is a 32X8 OTP ROM with 5V supply, 16 terminals, and 40ns access time. Ideal for commercial applications requiring fast memory access in a rectangular plastic package with through-hole terminals.
SN74S477N1
SN74S477N1 by Texas Instruments is a 1KX4 OTP ROM IC with 4096-bit memory density. Operating b/w 0°C to 70°C, it features TTL technology and an IN-LINE package style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.
TBP18SA46MJ
TBP18SA46MJ by Texas Instruments is a MILITARY-grade OTP ROM with 512x8 organization and 4096-bit memory density. Featuring a max operating temperature of 125°C, it has an access time of 85ns. Ideal for applications requiring secure non-volatile memory storage in harsh environments.
AT27C512R-45JC
Atmel's AT27C512R-45JC is a 64KX8 OTP ROM with 45 ns access time, operating at 5V. It features 3-STATE output and common I/O type, suitable for parallel applications in commercial-grade devices. The chip carrier package has a rectangular shape, measures 13.97mm x 11.43mm, and supports surface mount assembly.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M27W101-80K6
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M27W101-80K6TR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .000015 Amp;
M27W01690M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
M27W016100N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M27W016110M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
M27W01690B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M27W016110B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1048576 words;
M27W016100B1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
M27W016110M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
M27W016100N1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M27W016110N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Organization: 1MX16;
M27W016110S1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR; Terminal Pitch: 1.778 mm;
M27W016100S1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR; No. of Words Code: 1M;
M27W01690M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 3 mm;
M27W016100M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 16777216 bit;
M27W016110N1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 1M;
M27W016110B1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
M27W016100B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP42,.6;
M27W016100M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 3/3.3;
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