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5962-01-054-8692

Texas Instruments

5962-01-054-8692 by Texas Instruments

Texas Instruments' 5962-01-054-8692 is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grade. This rectangular package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,393 parts In-Stock

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4,393

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Digiode

USA . 126 parts In-Stock

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126

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Distributors (Availability)

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Native Components

USA . 590 parts In-Stock

1+ parts

$0.069

100+ parts

-

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-

10k+ parts

$0.066

590

$0.069

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-

$0.066

Northwest PG Solutions

USA . 329 parts In-Stock

1+ parts

$0.076

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-

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$0.067

329

$0.076

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$0.067

Parana Technologies

USA . 969 parts In-Stock

1+ parts

$5.158

100+ parts

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$5.755

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969

$5.158

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$5.755

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DigiPath Technology Company

USA . 694 parts In-Stock

1+ parts

$5.680

100+ parts

$5.226

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694

$5.680

$5.226

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ChromeModa Solutions

Germany . 5,433 parts In-Stock

1+ parts

$5.796

100+ parts

$4.753

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5,433

$5.796

$4.753

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IDEA Electronic Components Group

UK . 357 parts In-Stock

1+ parts

$5.796

100+ parts

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$5.216

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357

$5.796

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$5.216

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AZTECH Wire

Italy . 398 parts In-Stock

1+ parts

$8.298

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398

$8.298

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One Stop Electronics

USA . 633 parts In-Stock

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$11.000

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633

$11.000

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Corphita

USA . 4,031 parts In-Stock

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Overview

Unlock the power of reliable and high-quality memory solutions with Texas Instruments' 5962-01-054-8692 OTP ROM. Built with precision and expertise, this product offers unmatched performance and durability for a wide range of applications. From industrial automation to consumer electronics, this ROM delivers seamless operation and fast access time, ensuring smooth functionality in any environment. Trust Texas Instruments to provide you with the value, benefits, and advantages you need to take your projects to the next level. Upgrade your memory solutions today with the 5962-01-054-8692 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the OTP ROM, ensuring a longer lifespan.

Nominal Supply Voltage / Vsup (V): 5

Operating at 5 volts makes this OTP ROM compatible with standard power supplies, making it easy to integrate into existing systems.

No. of Terminals: 20

Having 20 terminals allows for flexibility in connecting the OTP ROM to other components, enabling customization for different applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this OTP ROM can perform reliably in a variety of environments without overheating.

Organization: 256X8

The 256X8 organization provides ample storage capacity and allows for efficient data retrieval, enhancing the overall performance of the OTP ROM.

Technology: TTL

Using TTL technology ensures fast and reliable data transfer within the OTP ROM, contributing to its efficiency and speed.

Memory Density: 2048 bit

With a high memory density of 2048 bits, this OTP ROM can store a large amount of data in a compact package, making it a space-efficient choice.

Memory IC Type: OTP ROM

Being an OTP ROM means that the memory in this device is non-volatile and can be programmed only once, providing secure storage for critical data.

Technical Specifications

OTP ROM 5962-01-054-8692 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

R-PDIP-T20

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

20

No. of Words:

256 words

No. of Words Code:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-054-8692 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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