Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M27W016110B1T by STMicroelectronics is a 16-bit OTP ROM with a density of 16Mbit, operating asynchronously at supply voltages b/w 2.7V and 3.6V. It features a max access time of 110ns and operates within -40 °C to +70 °C. Ideal for commercial applications requiring reliable data storage.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Anansix
Vyrian
IDEA Electronic Components Group
$2.563
$2.307
MKK Technologies
$4.820
DigiPath Technology Company
Parana Technologies
$3.065
Corphita
The plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.
The rectangular shape optimizes space and allows for more efficient layout on PCBs.
Asynchronous operation provides flexibility and allows for simplified interfacing with other components in a circuit.
A nominal supply voltage of 3V ensures compatibility with a wide range of modern digital circuits.
Having 42 terminals facilitates multiple connections, enhancing integration possibilities.
In-line package style is favored for easy insertion into PCBs, simplifying assembly processes.
A maximum temperature rating of 70 °C makes the product suitable for a variety of operating environments.
The 1MX16 organization provides a good balance of capacity and data width, suitable for many applications.
A minimum operating temperature of 0 °C allows for usage in a wide range of environments.
Dual terminal position contributes to better mechanical stability and facilitates easier soldering.
A maximum seated height of 5.08 mm ensures that the component can fit into standard reconfirms constrained designs.
The width of 15.24 mm helps in optimizing board space for compact circuit designs.
Supporting a minimum supply voltage of 2.7 V enhances its compatibility with lower-power systems.
The length allows for efficient material usage while maintaining structural integrity and electrical performance.
A commercial temperature grade indicates reliability and stability for standard applications.
CMOS technology provides low power consumption and high noise immunity, making it suitable for battery-operated devices.
Parallel data access allows for quicker read/write operations, enhancing system performance.
Through-hole terminals provide strong mechanical support and are easier to solder in manual assembly processes.
With 1,048,576 words, this product offers a substantial data storage capacity for various applications.
A memory width of 16 bits strikes a good balance between capacity and access speed for performance-intensive applications.
A terminal pitch of 2.54 mm is standard for many electronics applications, ensuring compatibility with existing designs.
With 1 million words, it provides ample memory for a wide range of user applications.
A maximum supply voltage of 3.6 V allows for flexible power source options without compromising performance.
A memory density of 16 Mbits delivers substantial storage capabilities, perfect for data-rich applications.
As an OTP ROM, this memory IC is ideal for applications requiring permanent data storage with write-once functionality.
A maximum access time of 110 ns ensures quick data retrieval, enhancing overall system responsiveness.
OTP ROM M27W016110B1T attributes and parameters. Explore more OTP ROM devices from STMicroelectronics
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M27W016110B1T Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
BAV99
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
1N4148
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
1N4148WS
Synsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NXP Semiconductors
PIC18F4550-I/PT
Microchip Technology
PIC18F4550-I/PT by Microchip: 8-bit microcontroller with 44 terminals, 48 MHz clock frequency, and USB connectivity. Ideal for industrial applications requiring low power mode and 10-bit ADC channels.
2N2222A
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
AT90CAN128-16AU
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
LM107H
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
LD1117S33TR
LD1117S33TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It has a small outline package style, operates at an adjustable temperature range from 0 to 125°C, and is ideal for applications requiring stable voltage regulation in compact electronic devices.
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
SN74186JP4
Texas Instruments
SN74186JP4 by Texas Instruments is a 64x8 OTP ROM IC with TTL technology. It operates b/w 0°C to 70°C, featuring a rectangular ceramic package with 24 terminals in an in-line style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.
JBP28S42MJ
JBP28S42MJ by Texas Instruments is a 512x8 OTP ROM with 70ns access time, operating at up to 25MHz clock frequency. It has a MILITARY temperature grade and operates in ASYNCHRONOUS mode. This rectangular package with 20 terminals is suitable for applications requiring reliable non-volatile memory storage.
5962-01-218-8483
Texas Instruments' 5962-01-218-8483 is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in commercial temperature grade. This rectangular ceramic package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
5962-01-166-0116
Texas Instruments' 5962-01-166-0116 is a 32x8 OTP ROM with 5V supply, 40ns access time, and 110mA max supply current. Ideal for commercial applications, this TTL technology chip has a rectangular plastic/epoxy package with 16 terminals in an in-line style.
TBP28L85N1
TBP28L85N1 by Texas Instruments is a 24-terminal OTP ROM with 1KX8 organization and 8192-bit memory density. Operating at 5V, it has a temperature range of 0-70°C. This rectangular package is ideal for commercial applications requiring TTL technology and through-hole terminals.
AT27C1024-45JU-T
AT27C1024-45JU-T by Microchip Technology is a 64KX16 OTP ROM with 45 ns access time, operating at 5V. It features a 3-STATE output and supports parallel programming. Ideal for industrial applications requiring non-volatile memory with fast read times and low standby current consumption.
AT27BV512-70TU
AT27BV512-70TU by Microchip Technology is a 64KX8 OTP ROM with 3-STATE output, operating at -40 to 85 °C. It has a supply voltage of 2.7-3.6V and max access time of 70ns. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.
CBP24SA10MJ
CBP24SA10MJ by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 256x4 organization, 1024-bit memory density, and 75ns access time. Ideal for military applications due to its MILITARY temperature grade and ceramic package material.
SN54S470J
SN54S470J by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 80ns and supports MILITARY temperature grade. This TTL technology IC in IN-LINE package is ideal for applications requiring fast, non-volatile memory storage in harsh environments.
TBP18S22J4
TBP18S22J4 by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring reliable non-volatile memory storage in TTL technology environments.
CMS68P512-200
Texas Instruments' CMS68P512-200 is a 512KX8 OTP ROM with 3-STATE output. Operating at 5V, it offers 524288 words of memory in a MICROELECTRONIC ASSEMBLY package. Ideal for applications requiring fast access times and low standby current in commercial temperature grades.
5962-01-141-4360
Texas Instruments' 5962-01-141-4360 is a 32X8 OTP ROM with 16 terminals and a supply voltage of 5V. It operates b/w 0 to 70°C, has a max access time of 40ns, and consumes up to 110mA. Ideal for commercial applications requiring reliable memory storage in a rectangular plastic/epoxy package.
5962-01-381-5552
Texas Instruments' 5962-01-381-5552 is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in commercial temperature grades. This rectangular package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
5962-01-135-2700
Texas Instruments' 5962-01-135-2700 is a MILITARY-grade OTP ROM with 256X4 organization, 1024-bit memory density, and 75ns max access time. Ideal for applications requiring secure non-volatile memory storage in harsh environments.
JBP24S10MJ
JBP24S10MJ by Texas Instruments is a MILITARY-grade OTP ROM with 256x4 organization, 1024-bit memory density, and 75ns max access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring fast, reliable non-volatile memory in harsh environments.
TBP28L85J
TBP28L85J by Texas Instruments is a 1Kx8 OTP ROM with 8192-bit memory density. Operating at 5V, it has a temperature range of 0-70°C and comes in a ceramic rectangular package with 24 terminals. Ideal for commercial applications requiring reliable non-volatile memory storage in TTL technology.
5962-01-214-2157
Texas Instruments' 5962-01-214-2157 is a MILITARY-grade OTP ROM with 512x8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
TBP28L86NP3
TBP28L86NP3 by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density and 130 ns max access time. It operates at a nominal voltage of 5V and has a temperature range of 0 to 70°C. This device, in an IN-LINE package style, is ideal for applications requiring non-volatile memory storage in commercial-grade environments.
5962-01-143-5798
Advanced Micro Devices
5962-01-143-5798 by Advanced Micro Devices is an OTP ROM with 512x8 organization, MILITARY grade, and 70ns access time. It is used in applications requiring reliable memory storage in harsh environments.
AT27C010-45JU
AT27C010-45JU by Microchip Technology is a 128KX8 OTP ROM with 3-STATE output, operating at 5V. It has a fast access time of 45ns and low standby current of 0.00001Amp. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact chip carrier package.
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M27W101-80K6
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M27W101-80K6TR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .000015 Amp;
M27W01690M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
M27W016100N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M27W016110M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
M27W01690B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M27W016110B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1048576 words;
M27W01690N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M27W016100B1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
M27W016110M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
M27W016100N1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M27W016110N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Organization: 1MX16;
M27W016110S1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR; Terminal Pitch: 1.778 mm;
M27W016100S1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR; No. of Words Code: 1M;
M27W01690M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 3 mm;
M27W016100M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 16777216 bit;
M27W016110N1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 1M;
M27W016100B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP42,.6;
M27W016100M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 3/3.3;
Supply Digital Components
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