Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M27W016100N1T by STMicroelectronics is a 16Mbit OTP ROM with a 3V nominal voltage and asynchronous operation. It features a compact SOIC package, ideal for space-constrained applications. With a max access time of 100 ns, it ensures efficient data retrieval.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Anansix
Digiode
IDEA Electronic Components Group
$3.679
$3.311
MKK Technologies
$6.918
DigiPath Technology Company
Corphita
Parana Technologies
$4.399
The use of plastic/epoxy material enhances durability and provides effective protection against environmental factors.
Surface mount technology allows for a more compact design and simpler assembly, making it easier to integrate into modern electronic devices.
The rectangular shape provides efficient use of space, facilitating better layout in PCB designs.
Asynchronous operation allows for flexible timing and ease of integration with various systems.
A common I/O type ensures compatibility with a wide range of applications and simplifies circuit design.
A nominal supply voltage of 3 V helps in power efficiency, making this product suitable for battery-operated devices.
Support for multiple power supply voltages increases versatility, allowing integration in various electronic systems.
The large number of terminals enables extensive connectivity options, enhancing functionality.
A small outline and thin profile save space on printed circuit boards (PCBs) and allow for more compact designs.
With a maximum operating temperature of 70 °C, it is suitable for diverse applications without overheating issues.
This organization provides substantial memory accessibility, making it powerful for programming applications.
3-state output characteristics allow for better control and communication among multiple devices, enhancing system design flexibility.
Operating in low temperatures ensures reliability in various environmental conditions.
Tin-lead terminals offer excellent solderability, contributing to easier assembly and improved reliability.
Dual terminal positioning facilitates orientation flexibility on PCB designs.
A low seated height contributes to a slim profile, making it suitable for space-constrained applications.
A width of 12 mm maintains a compact design, fitting well within small electronic devices.
A low minimum supply voltage requirement enhances compatibility with various power sources.
The length of 18.4 mm complements the small outline, maintaining an efficient and compact form factor.
A commercial temperature grade suggests suitability for standard applications, adding to its usability in consumer electronics.
The CMOS technology ensures low power consumption while maintaining high performance.
Parallel interfacing provides fast data access speeds, enhancing overall performance.
Gull-wing terminals allow for easy soldering and improved connection reliability.
A capacity of over a million words enables substantial data storage, suitable for many applications.
A 16-bit memory width provides capable data handling, essential for modern applications.
A 0.5 mm terminal pitch allows for high-density PCB designs, optimizing space usage.
The coding of 1M words supports versatile programming needs, attractive for embedded systems.
A maximum supply voltage of 3.6 V ensures the product can operate safely under higher voltage conditions.
A high memory density allows for complex applications, enhancing computational capabilities.
Being an OTP ROM type makes it suitable for applications requiring permanent storage after programming.
An extremely low standby current signifies excellent power efficiency, ideal for low-power applications.
A maximum access time of 100 ns contributes to fast data retrieval, essential for high-performance systems.
OTP ROM M27W016100N1T attributes and parameters. Explore more OTP ROM devices from STMicroelectronics
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M27W016100N1T Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
NDT2955
Onsemi
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
FDD5614P
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Micro Commercial Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Synsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
LM317T
Tt Electronics Plc
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Qualification Status: Not Qualified; JESD-30 Code: R-PSFM-T3;
Thinking Electronic Industrial
Microsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
BAV99
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
Hy Electronic
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
TBP18SA030NP3
Texas Instruments
TBP18SA030NP3 by Texas Instruments is a 32x8 OTP ROM with 5V supply, 16 terminals, and 40ns access time. Ideal for commercial applications requiring reliable memory storage in a rectangular plastic/epoxy package with through-hole terminals.
TBP28L46MJW
TBP28L46MJW by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 110ns and operates in parallel mode. This rectangular package with ceramic body material is ideal for military-grade applications requiring reliable non-volatile memory storage.
SN54188AJ
SN54188AJ by Texas Instruments is a 32x8 OTP ROM with 50ns access time, operating b/w -55 to 125°C. It has a supply voltage of 5V and max current of 110mA. Ideal for military-grade applications requiring reliable memory storage in a ceramic rectangular package.
5962-01-114-2078
Texas Instruments' 5962-01-114-2078 is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring reliable non-volatile memory storage.
SN74S477N1
SN74S477N1 by Texas Instruments is a 1KX4 OTP ROM IC with 4096-bit memory density. Operating b/w 0°C to 70°C, it features TTL technology and an IN-LINE package style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.
5962-01-050-6939
Texas Instruments' 5962-01-050-6939 is a 1KX4 OTP ROM with 4096-bit memory density. Operating at 5V, it offers a max access time of 60ns and operates in commercial temperature grades. Ideal for applications requiring non-volatile memory storage in industrial settings.
SNC54S188J
SNC54S188J by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 32x8 organization, TTL technology, and 50ns max access time. It operates b/w -55°C to 125°C, has a supply voltage of 5V, and consumes up to 110mA. Ideal for military applications requiring reliable memory storage in harsh environments.
AT27C256R-70PC
Atmel
AT27C256R-70PC by Atmel is a 32Kx8 OTP ROM with 70ns access time, operating at 5V. It features a 3-STATE output and uses CMOS technology. Commonly used in commercial applications requiring non-volatile memory storage.
SN74S2708N1
SN74S2708N1 by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density. It operates at temperatures from 0 to 70°C, with a max access time of 70ns. Ideal for commercial applications requiring reliable TTL technology in a rectangular package style.
DS2406P+T&R
Analog Devices
DS2406P+T&R by Analog Devices is a 1KX1 OTP ROM with 1024-bit memory density. It operates at 3/5V, has a supply voltage range of 2.8-6V, and can withstand industrial temperatures. Ideal for applications requiring small outline packages and asynchronous operation in various industries.
AT27C2048-55JU
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Maximum Access Time: 55 ns;
DS2505P/T&R
Maxim Integrated
DS2505P/T&R by Maxim Integrated is a 16KX1 OTP ROM with 16384 bit memory density. It operates at 3/5V, has a max access time of 15000ns, and uses serial communication. Ideal for industrial applications requiring non-volatile memory storage in compact designs.
TBP28L22N
TBP28L22N by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has an access time of 70ns and operates in parallel mode. This rectangular IC with through-hole terminals is ideal for commercial applications requiring non-volatile memory storage.
5962-01-135-9084
Texas Instruments' 5962-01-135-9084 is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and consumes up to 155mA. Ideal for commercial applications requiring reliable non-volatile memory storage in a ceramic rectangular package.
82S123/BEA
NXP Semiconductors' 82S123/BEA is a 256-bit OTP ROM with 32x8 organization, operating at 5V. It features a max access time of 50ns and operates in parallel mode. This ceramic, glass-sealed IC is ideal for military-grade applications requiring reliable non-volatile memory storage.
DS2506S
DS2506S by Maxim Integrated is an OTP ROM with 64KX1 organization, operating at -40 to 85 °C. It features a serial interface, 65536-bit memory density, and common I/O type. Ideal for industrial applications requiring small outline package style and asynchronous operation.
5962-01-166-0116
Texas Instruments' 5962-01-166-0116 is a 32x8 OTP ROM with 5V supply, 40ns access time, and 110mA max supply current. Ideal for commercial applications, this TTL technology chip has a rectangular plastic/epoxy package with 16 terminals in an in-line style.
5962-01-143-5793
Advanced Micro Devices
5962-01-143-5793 by Advanced Micro Devices is a MILITARY-grade OTP ROM with 512x8 organization, 70ns access time, and 4096-bit memory density. It operates b/w -55 to 125 °C and is ideal for high-reliability applications in military and aerospace sectors.
5962-01-205-3339
Texas Instruments' 5962-01-205-3339 is a MILITARY-grade OTP ROM with 256X8 organization, 2048-bit memory density, and 80ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
TBP24S41MJ
TBP24S41MJ by Texas Instruments is a 1KX4 OTP ROM with 4096 bit memory density. Operating at 5V, it offers a max access time of 75ns and operates in parallel mode. Ideal for military-grade applications requiring fast and reliable non-volatile memory storage.
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M27W101-80K6
STMicroelectronics
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M27W101-80K6TR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .000015 Amp;
M27W01690M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
M27W016100N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
M27W016110M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
M27W01690B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M27W016110B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1048576 words;
M27W01690N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M27W016100B1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
M27W016110M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
M27W016110N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Organization: 1MX16;
M27W016110S1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR; Terminal Pitch: 1.778 mm;
M27W016100S1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR; No. of Words Code: 1M;
M27W01690M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 3 mm;
M27W016100M1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 16777216 bit;
M27W016110N1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 1M;
M27W016110B1T
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
M27W016100B1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP42,.6;
M27W016100M1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 3/3.3;
Supply Digital Components
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