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M27W016100M1T

STMicroelectronics

M27W016100M1T by STMicroelectronics

M27W016100M1T by STMicroelectronics is a 16Mb OTP ROM with a 3V nominal voltage and asynchronous operation. It features a max access time of 100 ns and operates in temperatures from 0 °C to 70 °C, ideal for commercial applications. Its compact SO package makes it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,972 parts In-Stock

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1,972

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Vyrian

USA . 1,708 parts In-Stock

1+ parts

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1,708

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Digiode

USA . 1,372 parts In-Stock

1+ parts

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1,372

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,842 parts In-Stock

1+ parts

$2.874

100+ parts

-

1k+ parts

$2.587

10k+ parts

-

1,842

$2.874

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$2.587

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MKK Technologies

India . 2,103 parts In-Stock

1+ parts

$5.405

100+ parts

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2,103

$5.405

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DigiPath Technology Company

USA . 2,103 parts In-Stock

1+ parts

$5.405

100+ parts

-

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10k+ parts

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2,103

$5.405

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Corphita

USA . 2,202 parts In-Stock

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2,202

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Parana Technologies

USA . 1,533 parts In-Stock

1+ parts

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100+ parts

$3.436

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1,533

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$3.436

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Overview

Unlock the potential of your projects with the M27W016100M1T from STMicroelectronics—a leader in innovation and quality. This high-performance OTP ROM delivers reliability and versatility for a range of applications, from automotive to consumer electronics. With its compact design and low power consumption, it offers exceptional value, ensuring your devices run smoothly and efficiently. Elevate your solutions with STMicroelectronics' trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this OTP ROM reliable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and enables automated assembly, making it cost-effective and efficient.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout on PCB, facilitating compact design and efficient thermal management.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible interfacing with other components, providing easy integration into existing systems.

Input/Output Type: COMMON

Common I/O type simplifies signal routing on PCBs, enhancing design convenience and reducing potential errors.

Nominal Supply Voltage / Vsup: 3 V

Operating at a standard nominal supply voltage of 3V allows compatibility with a wide range of digital circuits and systems.

Power Supplies: 3/3.3 V

Dual voltage capability supports a variety of applications, offering flexibility in system design.

No. of Terminals: 44

A higher number of terminals allows for more connectivity options, making it versatile for various design requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint on the PCB, making it suitable for compact electronic designs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in warm environments, ideal for commercial applications.

Organization: 1MX16

The organization supports efficient data access and manipulation, making it suitable for high-performance applications.

Output Characteristics: 3-STATE

3-state output allows for bus sharing between multiple devices, enhancing design flexibility and efficiency.

Minimum Operating Temperature: 0 °C

The operational range starting from 0 °C ensures reliable functioning in typical operating environments.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and reduces the risk of whisker growth, enhancing overall reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing on the PCB, optimizing space and connection options.

Maximum Seated Height: 3 mm

Low seated height allows for compact assembly, making it suitable for space-constrained applications.

Width: 12.6 mm

A width of 12.6 mm strikes a balance between compactness and ease of handling during assembly.

Minimum Supply Voltage (Vsup): 2.7 V

Operating with a minimum supply voltage of 2.7 V allows for energy-efficient designs and compatibility with low-power systems.

Length: 28.5 mm

The length of 28.5 mm is designed for optimal PCB layout in standard applications, ensuring compatibility with existing designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade guarantees performance under standard operating conditions, suitable for most consumer applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, making it ideal for modern electronic devices.

Parallel or Serial: PARALLEL

Parallel operation enables faster data access, improving overall system performance and efficiency.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide robust connectivity for reliable operation.

No. of Words: 1048576 words

A large word count provides ample storage for applications, accommodating complex data needs.

Memory Width: 16

With a memory width of 16 bits, the device can efficiently handle larger data packets and improve overall throughput.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard for many designs, simplifying integration into existing layouts.

No. of Words Code: 1M

Having a coding capability of 1M words ensures robust programming options for various applications.

Maximum Supply Voltage (Vsup): 3.6 V

The upper limit of 3.6 V provides flexibility in power supply design, ensuring compatibility with various components.

Memory Density: 16777216 bit

High memory density allows for more data storage capacity in a compact form factor, addressing advanced requirements.

Memory IC Type: OTP ROM

As an OTP ROM, this memory IC offers a cost-effective solution for applications needing one-time programmability.

Maximum Standby Current: 0.0001 Amp

Low standby current enhances energy efficiency, making the product ideal for battery-operated devices.

Maximum Access Time: 100 ns

Fast access time of 100 ns ensures quick data retrieval, improving system responsiveness.

Technical Specifications

OTP ROM M27W016100M1T attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Additional Features:

90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

28.5 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

44

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP44,.63

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

12.6 mm

Trade Compliance

M27W016100M1T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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