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M27W01690M1

STMicroelectronics

M27W01690M1 by STMicroelectronics

M27W01690M1 by STMicroelectronics is a 16Mb OTP ROM with a 3.3V supply, featuring asynchronous operation and a max access time of 90 ns. It comes in a compact SO package with 44 terminals, ideal for embedded applications. Its commercial grade ensures reliability in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,646 parts In-Stock

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Anansix

USA . 1,978 parts In-Stock

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1,978

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Vyrian

USA . 382 parts In-Stock

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382

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 925 parts In-Stock

1+ parts

$2.437

100+ parts

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$2.193

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925

$2.437

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MKK Technologies

India . 297 parts In-Stock

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$4.583

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297

$4.583

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DigiPath Technology Company

USA . 297 parts In-Stock

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$4.583

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297

$4.583

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Corphita

USA . 3,908 parts In-Stock

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Parana Technologies

USA . 226 parts In-Stock

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$2.914

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$2.914

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Overview

Unlock unparalleled performance with the M27W01690M1 from STMicroelectronics, your go-to solution for cutting-edge OTP ROM technology. Renowned for their commitment to quality and innovation, STMicroelectronics ensures that this robust 3.3V memory device delivers reliability in diverse applications—from consumer electronics to industrial automation. Benefit from its superior thermal stability and efficient power consumption, designed to elevate your projects while reducing overhead costs. Experience a seamless blend of functionality and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction provides reliability and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for easier integration in modern circuit designs, saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient layout and stacking in electronic devices.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster data access without the need for synchronous timing, enhancing overall performance.

Input/Output Type: COMMON

Common I/O type ensures compatibility with a wide range of systems and simplifies design.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a low supply voltage of 3.3V makes it energy-efficient and suitable for battery-powered applications.

Power Supplies: 3.3 V

With a standard power supply of 3.3V, it can easily integrate into modern electronic systems.

No. of Terminals: 44

The 44 terminals provide ample connectivity options for interfacing with various systems and components.

Package Style (Meter): SMALL OUTLINE

The small outline design conserves space on PCB, ideal for compact electronic devices.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows this product to perform reliably in standard commercial environments.

Organization: 1MX16

The memory organization of 1MX16 means it can store significant data efficiently, suited for various applications.

Output Characteristics: 3-STATE

3-state output characteristics enhance data handling capabilities, allowing multiple devices to share the same bus.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C ensures functionality in a wide variety of environments.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and enhances corrosion resistance for reliable long-term performance.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in design and layout, adapting to various PCB configurations.

Maximum Seated Height: 3 mm

The low profile of 3 mm supports compact design requirements in modern electronics.

Width: 12.6 mm

Its width is tailored for small form factor designs, optimizing space on the PCB.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3V allows for greater flexibility in power supply choices.

Length: 28.5 mm

With a manageable length of 28.5 mm, it aligns well with space-constrained designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade is sufficient for everyday applications and environments, balancing cost and performance.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, ideal for modern applications.

Parallel or Serial: PARALLEL

Parallel data access offers higher data throughput, making it suitable for performance-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate automated assembly processes, enhancing production efficiency.

No. of Words: 1048576 words

An extensive storage capacity of 1,048,576 words supports complex applications requiring large datasets.

Memory Width: 16

With a memory width of 16 bits, it strikes a good balance between capacity and performance for various applications.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm is standard for many PCB layouts, ensuring compatibility with existing designs.

No. of Words Code: 1M

Supporting 1M words code means it's suitable for applications needing substantial memory without complexity.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a range of power sources commonly used in electronics.

Memory Density: 16777216 bit

With a density of 16,777,216 bits, this OTP ROM can handle large data demands efficiently.

Memory IC Type: OTP ROM

As an OTP ROM, it provides a cost-effective solution for applications where data doesn't need to be rewritten.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current ensures energy efficiency and prolongs battery life in portable devices.

Maximum Access Time: 90 ns

A maximum access time of 90 ns ensures rapid data retrieval, improving overall system performance.

Technical Specifications

OTP ROM M27W01690M1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

90 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

28.5 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

44

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP44,.63

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

12.6 mm

Trade Compliance

M27W01690M1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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