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5962-01-197-0047

Texas Instruments

5962-01-197-0047 by Texas Instruments

Texas Instruments' 5962-01-197-0047 is a MILITARY-grade OTP ROM with 512x8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,232 parts In-Stock

1+ parts

-

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6,232

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Digiode

USA . 3,549 parts In-Stock

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3,549

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 21 parts In-Stock

1+ parts

$0.431

100+ parts

-

1k+ parts

-

10k+ parts

$0.413

21

$0.431

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-

$0.413

Northwest PG Solutions

USA . 2,180 parts In-Stock

1+ parts

$0.474

100+ parts

-

1k+ parts

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$0.418

2,180

$0.474

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-

$0.418

Parana Technologies

USA . 2,336 parts In-Stock

1+ parts

$2.197

100+ parts

-

1k+ parts

$2.707

10k+ parts

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2,336

$2.197

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$2.707

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DigiPath Technology Company

USA . 772 parts In-Stock

1+ parts

$2.420

100+ parts

$2.226

1k+ parts

-

10k+ parts

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772

$2.420

$2.226

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ChromeModa Solutions

Germany . 4,835 parts In-Stock

1+ parts

$2.469

100+ parts

$2.025

1k+ parts

-

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4,835

$2.469

$2.025

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IDEA Electronic Components Group

UK . 827 parts In-Stock

1+ parts

$2.469

100+ parts

-

1k+ parts

$2.222

10k+ parts

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827

$2.469

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$2.222

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AZTECH Wire

Italy . 813 parts In-Stock

1+ parts

$8.006

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813

$8.006

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One Stop Electronics

USA . 1,104 parts In-Stock

1+ parts

$19.000

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1,104

$19.000

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Corphita

USA . 730 parts In-Stock

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730

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Overview

Experience unparalleled quality and reliability with the 5962-01-197-0047 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers top-of-the-line OTP ROM products that are perfect for military-grade applications. With a maximum operating temperature of 125°C and a memory density of 4096 bits, this product provides unmatched performance and durability. Trust Texas Instruments to deliver cutting-edge technology and innovation, ensuring that you get the best value for your investment. Elevate your projects with the 5962-01-197-0047 and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package body material provides excellent thermal conductivity, reliability, and durability, making it suitable for harsh operating conditions.

Screening Level: MIL-STD-883 Class B (Modified)

The MIL-STD-883 Class B screening level ensures high quality and reliability of the product, meeting stringent military standards.

Nominal Supply Voltage / Vsup: 5V

The 5V supply voltage is common and provides compatibility with a wide range of systems, making it easy to integrate this OTP ROM into existing designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this OTP ROM to function reliably in extreme temperature environments.

Organization: 512X8

The 512 words x 8 memory organization provides a good balance between memory capacity and data width, suitable for storing and retrieving data efficiently.

Technology: TTL

The TTL technology offers fast switching speeds and low power consumption, ensuring efficient performance of the OTP ROM.

Memory Density: 4096 bit

The high memory density of 4096 bits allows for storing large amounts of data in a compact form factor, making it ideal for space-constrained applications.

Maximum Access Time: 85 ns

The maximum access time of 85 ns ensures quick data retrieval, enabling fast processing speeds in applications that require rapid access to stored information.

Technical Specifications

OTP ROM 5962-01-197-0047 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

85 ns

JESD-30 Code:

R-XDIP-T20

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

20

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

512X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-197-0047 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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