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SN74S477N3

Texas Instruments

SN74S477N3 by Texas Instruments

SN74S477N3 by Texas Instruments is a 1KX4 OTP ROM IC with 4096-bit memory density. Operating b/w 0°C to 70°C, it features TTL technology and comes in an IN-LINE package style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,558 parts In-Stock

1+ parts

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7,558

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Digiode

USA . 3,851 parts In-Stock

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3,851

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 342 parts In-Stock

1+ parts

$1.000

100+ parts

-

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342

$1.000

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Parana Technologies

USA . 2,138 parts In-Stock

1+ parts

$4.596

100+ parts

-

1k+ parts

$5.059

10k+ parts

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2,138

$4.596

-

$5.059

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DigiPath Technology Company

USA . 1,817 parts In-Stock

1+ parts

$5.061

100+ parts

$4.656

1k+ parts

-

10k+ parts

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1,817

$5.061

$4.656

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IDEA Electronic Components Group

UK . 565 parts In-Stock

1+ parts

$5.164

100+ parts

-

1k+ parts

$4.648

10k+ parts

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565

$5.164

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$4.648

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ChromeModa Solutions

Germany . 163 parts In-Stock

1+ parts

$5.164

100+ parts

$4.234

1k+ parts

-

10k+ parts

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163

$5.164

$4.234

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AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$9.594

100+ parts

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789

$9.594

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Corphita

USA . 2,750 parts In-Stock

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2,750

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Overview

Discover the unmatched quality and reliability of the SN74S477N3 by Texas Instruments, a leading manufacturer in the industry. This OTP ROM device offers a wide range of applications, providing customers with exceptional value and performance. With its advanced technology and commercial-grade temperature grade, this product guarantees optimal functionality and durability. Trust Texas Instruments to deliver top-notch products that exceed expectations and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring it can withstand various environmental conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into electronic circuits and systems, making it a versatile option for different applications.

No. of Terminals: 18

With a high number of terminals, this OTP ROM product can interface with multiple components or devices, enhancing its connectivity and functionality.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures the product can function reliably in demanding conditions without overheating or malfunctioning.

Organization: 1KX4

The organization of 1KX4 means that the OTP ROM has a capacity of 1K words, each consisting of 4 bits, providing sufficient memory storage for data or program codes.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the OTP ROM can operate effectively even in colder environments, expanding its usability.

Technology: TTL

Being based on TTL (Transistor-Transistor Logic) technology, this OTP ROM offers fast operation speed and low power consumption, making it suitable for high-performance applications.

No. of Words: 1024 words

With a capacity of 1024 words, this OTP ROM can store a substantial amount of data or instructions, enabling it to support complex programs or operations.

Memory Width: 4

The memory width of 4 bits allows for efficient data processing and retrieval, contributing to the overall performance and reliability of the OTP ROM.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm facilitates easy connection and installation of the OTP ROM in electronic circuits, ensuring compatibility with industry-standard layouts.

Memory Density: 4096 bit

With a memory density of 4096 bits, this OTP ROM can store a large amount of information in a compact form factor, making it a space-efficient solution for memory needs.

Memory IC Type: OTP ROM

As an OTP (One-Time Programmable) ROM, this product offers non-volatile memory storage that can be programmed only once, making it suitable for applications requiring permanent data storage.

Technical Specifications

OTP ROM SN74S477N3 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T18

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

OTP ROMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74S477N3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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