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SMJ2516-35JM

Texas Instruments

SMJ2516-35JM by Texas Instruments

SMJ2516-35JM by Texas Instruments is a 2Kx8 OTP ROM with 16384-bit memory density. It operates at -55 to 125 °C, with a max access time of 350 ns. Ideal for military applications requiring fast and reliable non-volatile memory storage.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Vyrian

USA . 3,628 parts In-Stock

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Digiode

USA . 2,978 parts In-Stock

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Resion

USA . 169 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 33 parts In-Stock

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Q Components

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R&J Components

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Prism Electronics

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MRC Electronics

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Parana Technologies

USA . 1,068 parts In-Stock

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$4.490

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$4.929

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ChromeModa Solutions

Germany . 5,425 parts In-Stock

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$5.045

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$4.137

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IDEA Electronic Components Group

UK . 78 parts In-Stock

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$4.540

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AZTECH Wire

Italy . 884 parts In-Stock

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One Stop Electronics

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DigiPath Technology Company

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Corphita

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Montclair Electronics, Inc.

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SMJ2516-35JM OTP ROM. Designed by a trusted industry leader, this innovative product offers unmatched quality and reliability for a variety of applications. With a 2Kx8 organization and 3-state output characteristics, this device provides customers with seamless performance and efficiency. Say goodbye to slow access times and hello to enhanced productivity with the SMJ2516-35JM. Trust Texas Instruments to deliver top-notch solutions that exceed expectations. Experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and reliable material for electronic packages, ensuring the safety and longevity of the OTP ROM.

Nominal Supply Voltage / Vsup (V): 5

Operating at a stable voltage of 5V makes the OTP ROM compatible with standard power supplies and reduces the risk of voltage fluctuations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the OTP ROM can withstand harsh environmental conditions and maintain performance under stress.

Memory Density: 16384 bit

The high memory density allows for storing a large amount of data in a compact OTP ROM, making it suitable for various applications.

Maximum Access Time: 350 ns

The fast access time of 350 ns ensures quick retrieval of data, enhancing the overall performance of the OTP ROM.

Technical Specifications

OTP ROM SMJ2516-35JM attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

350 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T24

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

2048 words

No. of Words Code:

2K

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

2KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Programming Voltage (V):

25

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SMJ2516-35JM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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