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M27C512-90C1

STMicroelectronics

M27C512-90C1 by STMicroelectronics

M27C512-90C1 by STMicroelectronics is a 64KX8 OTP ROM chip with 90 ns access time, operating at 5V. It features a 3-STATE output and is designed for parallel operation in commercial temperature grade applications. The package style is chip carrier with dimensions of 13.97mm x 11.43mm x 3.56mm, making it suitable for various memory storage needs.

Median Price

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Lifecycle Status

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Vyrian

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DF Sales Co.

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DF Sales Co.

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Digiode

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Anansix

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Nova Conductors

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ComSIT Distribution GmbH

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Sunrise Surplus Inc.

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Bristol Electronics

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Atlantic Semiconductor

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Mil-Aero Solutions, Inc.

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Legend Electronics Inc.

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Euro-Tech

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ACDS - Activité Composants Distribution Service

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EPE Components Inc.

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NAC Semi

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Component Electronics Inc.

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Corohmni

South Africa . 103 parts In-Stock

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$2.209

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IDEA Electronic Components Group

UK . 1,576 parts In-Stock

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$3.487

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Aztec Data Supply Inc.

USA . 4,947 parts In-Stock

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Semicontronic

India . 727 parts In-Stock

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$4.875

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$5.306

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$5.040

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MKK Technologies

India . 673 parts In-Stock

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DigiPath Technology Company

USA . 673 parts In-Stock

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Microchip USA

USA . 417 parts In-Stock

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AZTECH Wire

Italy . 662 parts In-Stock

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Ampacity Inc.

Singapore . 1,246 parts In-Stock

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Lixinc

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Germany . 7,494 parts In-Stock

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Metaverse IC Inc.

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Brazil . 1,000 parts In-Stock

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Lucentia Tech

USA . 1,000 parts In-Stock

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Parana Technologies

USA . 989 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Modulus Dynamics

Lithuania . 450 parts In-Stock

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Corphita

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Computer Components Inc. - USA

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Overview

Unlock a world of possibilities with the M27C512-90C1 by STMicroelectronics, a high-quality OTP ROM that offers reliable performance and versatility. Manufactured by industry leader STMicroelectronics, this chip is designed for a wide range of applications, delivering seamless operation and superior data storage capabilities. With a focus on value and efficiency, the M27C512-90C1 provides customers with a cost-effective solution that meets their needs while ensuring optimal performance. Experience the benefits of cutting-edge technology with this innovative product and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the OTP ROM a reliable choice for long-term use.

Surface Mount: YES

This feature allows for easy installation and soldering onto circuit boards, saving time and effort during manufacturing.

Operating Mode: ASYNCHRONOUS

The asynchronous operation ensures efficient data retrieval and processing, making the OTP ROM suitable for various applications.

Input/Output Type: COMMON

The common input/output type simplifies connectivity with other components, improving compatibility and ease of integration.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with most systems and reduces the risk of damage from overvoltage.

Power Supplies (V): 5

The consistent power supply voltage of 5V ensures stable performance and reliable operation of the OTP ROM.

No. of Terminals: 32

With 32 terminals, the OTP ROM offers ample connection points for seamless communication with other components in the system.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and efficient design, saving space on the circuit board.

Maximum Operating Temperature: 70 °C

Operating at temperatures up to 70°C guarantees reliable performance even in harsh environmental conditions.

Organization: 64KX8

The 64KX8 organization offers a balance between storage capacity and data retrieval speed, making the OTP ROM versatile for various applications.

Technical Specifications

OTP ROM M27C512-90C1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

90 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.97 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

M27C512-90C1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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