Loading...

M27C1001-70C1

STMicroelectronics

M27C1001-70C1 by STMicroelectronics

M27C1001-70C1 by STMicroelectronics is a 128KX8 OTP ROM with a max operating temperature of 70°C. It has a memory density of 1048576 bit and operates in parallel mode. This chip is commonly used for applications requiring non-volatile memory storage.

Median Price

$16.550

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 57,892 parts In-Stock

1+ parts

$16.550

100+ parts

$2.810

1k+ parts

$2.300

10k+ parts

$2.100

57,892

$16.550

$2.810

$2.300

$2.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 81 parts In-Stock

1+ parts

$2.310

100+ parts

$1.730

1k+ parts

$1.500

10k+ parts

-

81

$2.310

$1.730

$1.500

-

Digiode

USA . 617 parts In-Stock

1+ parts

$15.722

100+ parts

-

1k+ parts

-

10k+ parts

-

617

$15.722

-

-

-

Vyrian

USA . 3,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,896

-

-

-

-

Halfin

Belgium . 1,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,820

-

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Anansix

USA . 971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

971

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

672

-

-

-

-

Electronic Expediters

USA . 320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

320

-

-

-

-

ECAB

Sweden . 307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

307

-

-

-

-

NexGen Digital

USA . 174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

174

-

-

-

-

PC Components Company LLC

USA . 133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

133

-

-

-

-

Bristol Electronics

USA . 133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

133

-

-

-

-

J & M Industries LLC

USA . 110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

110

-

-

-

-

Sogenti Electronics

Canada . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

96

-

-

-

-

North Shore Components

USA . 57 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

57

-

-

-

-

Odyssey Electronics LTD

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Lantek

USA . 32 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32

-

-

-

-

ComSIT Distribution GmbH

Germany . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

ComSIT USA

USA . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

Speed Components Ltd

Israel . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 295 parts In-Stock

1+ parts

$2.486

100+ parts

-

1k+ parts

$2.237

10k+ parts

-

295

$2.486

-

$2.237

-

MKK Technologies

India . 2,372 parts In-Stock

1+ parts

$4.674

100+ parts

-

1k+ parts

-

10k+ parts

-

2,372

$4.674

-

-

-

DigiPath Technology Company

USA . 2,372 parts In-Stock

1+ parts

$4.674

100+ parts

-

1k+ parts

-

10k+ parts

-

2,372

$4.674

-

-

-

Microchip USA

USA . 213 parts In-Stock

1+ parts

$6.661

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$6.661

-

-

-

Ampacity Inc.

Singapore . 57,758 parts In-Stock

1+ parts

$14.070

100+ parts

-

1k+ parts

-

10k+ parts

-

57,758

$14.070

-

-

-

AZTECH Wire

Italy . 907 parts In-Stock

1+ parts

$14.200

100+ parts

-

1k+ parts

-

10k+ parts

-

907

$14.200

-

-

-

Corphita

USA . 1,048 parts In-Stock

1+ parts

$14.895

100+ parts

-

1k+ parts

-

10k+ parts

-

1,048

$14.895

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Continental Prestige Electronics

USA . 5,812 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,812

-

-

-

-

Perfect Parts

USA . 2,289 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,289

-

-

-

-

Argo Parts USA

USA . 1,731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,731

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Parana Technologies

USA . 735 parts In-Stock

1+ parts

-

100+ parts

$2.972

1k+ parts

-

10k+ parts

-

735

-

$2.972

-

-

Cyclops Electronics Ltd (Excess)

UK . 672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

672

-

-

-

-

Glotronic Ltd.

UK . 538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

538

-

-

-

-

A-Z Elektronik GmbH

Germany . 387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

387

-

-

-

-

Kepictronics

USA . 128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

128

-

-

-

-

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

120

-

-

-

-

GreenTree Electronics

Israel . 52 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

52

-

-

-

-

Overview

Discover the M27C1001-70C1, an exceptional OTP ROM by STMicroelectronics. With its superior quality and advanced technology, this versatile chip offers countless benefits to customers. Whether you're in need of reliable data storage, secure firmware updates, or efficient code execution, this product delivers unmatched performance. Featuring a compact package shape and surface mount capability, it's easy to integrate into any project. Plus, with its low power consumption and wide operating temperature range, the M27C1001-70C1 guarantees long-lasting and dependable operation. Experience the value and advantages of this incredible memory IC type and unlock endless possibilities for your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable and lightweight plastic/epoxy material, making it suitable for various applications and easy to handle.

Surface Mount: YES

With surface mount capability, this product can be easily mounted onto circuit boards and integrated into compact electronic devices, offering convenience and space efficiency.

No. of Functions: 1

This product features one function, ensuring simplified usage and straightforward integration into electronic systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization and enables seamless integration with other components, making this product a good choice for compact designs.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent control of data transfer, promoting flexibility and compatibility, making it a versatile option for various applications.

Input/Output Type: COMMON

The product features a common input/output type, simplifying connections and enhancing compatibility with a wide range of devices, making it a reliable choice for diverse electronic systems.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this product ensures stable and reliable performance, making it suitable for standard electronic applications.

Power Supplies (V): 5

With a power supply of 5V, this product offers a consistent and reliable power source, ensuring optimal functionality and performance.

No. of Terminals: 32

With 32 terminals, this product provides an ample number of connection points, allowing for flexible integration and compatibility with various circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for easy installation and secure placement of the product, providing enhanced stability and reliability.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can operate reliably even in demanding environments, making it suitable for industrial applications.

Organization: 128KX8

The 128KX8 organization provides a large storage capacity and efficient organization of data, offering ample space for various applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for multiple output states, providing flexibility and facilitating communication compatibility in complex electronic systems.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this product remains functional even in low-temperature environments, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable and durable connections, making this product a reliable choice for long-term usage.

Terminal Position: QUAD

The quad terminal position enables easy and secure insertion into circuit boards, promoting stable connections and facilitating efficient assembly, making it a convenient option for integration.

Maximum Seated Height: 3.56 mm

With a maximum seated height of 3.56mm, this product is compact and low-profile, making it suitable for space-constrained applications where height is a critical consideration.

Width: 11.43 mm

The width of 11.43mm ensures a compact footprint, allowing for easy integration and space optimization in electronic designs, making it an efficient choice for applications with size restrictions.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, this product can operate reliably even with slightly lower power supply levels, ensuring stability and flexibility in various environments.

Length: 13.97 mm

The length of 13.97mm provides a compact form factor, allowing for streamlined integration into electronic systems with limited space, making it suitable for tight applications.

Temperature Grade: COMMERCIAL

Meeting commercial temperature grade standards, this product offers a wide operating temperature range, making it suitable for various commercial electronic applications.

Technology: CMOS

Utilizing CMOS technology, this product ensures low power consumption and high noise immunity, making it energy-efficient and reliable for extended use.

Parallel or Serial: PARALLEL

Featuring a parallel interface, this product enables fast and simultaneous data transfer, making it suitable for applications that require quick and efficient data exchange.

Terminal Form: J BEND

The J bend terminal form allows for easy insertion and secure connections, providing reliability and convenience during assembly, making it a practical option for manufacturing processes.

Maximum Supply Current: 30 mA

With a maximum supply current of 30mA, this product ensures efficient power consumption, reducing energy costs and promoting overall system efficiency.

No. of Words: 131072 words

With a large capacity of 131,072 words, this product provides ample space for storing data, making it suitable for applications that require extensive memory capabilities.

Memory Width: 8

The memory width of 8 ensures efficient handling and storage of data, promoting smooth data processing and retrieval, making it an excellent choice for applications that require precise data management.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for precise and reliable connections, facilitating efficient integration and ensuring optimum signal transfer.

No. of Words Code: 128K

Featuring a 128K words code, this product offers a high storage capacity, ensuring efficient data storage and retrieval for various applications.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product ensures compatibility with a wide range of power sources, offering flexibility and versatility in different operating conditions.

Memory Density: 1048576 bit

With a memory density of 1048576 bits, this product provides a large amount of storage space, accommodating extensive data requirements for diverse applications.

Memory IC Type: OTP ROM

As an OTP ROM memory integrated circuit, this product offers non-volatile data storage and permanent programming, providing reliable and secure data retention.

Maximum Standby Current: 0.0001 Amp

With a maximum standby current of 0.0001 Amp, this product consumes minimal power when in a standby state, promoting energy efficiency and prolonging battery life.

Maximum Access Time: 70 ns

With a maximum access time of 70 nanoseconds, this product provides fast and efficient data retrieval, ensuring quick response times for applications that require rapid data access.

Technical Specifications

OTP ROM M27C1001-70C1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

M27C1001-70C1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19