Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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SN54S3708J by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density and TTL technology. It operates b/w -55°C to 125°C, making it suitable for military-grade applications. The package style is in-line with a rectangular ceramic body, featuring 24 terminals in dual position through-hole form.
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Ceramic material offers good thermal conductivity and high resistance to heat, making it suitable for high temperature environments.
Sufficient number of terminals for connecting to external circuits and peripherals.
Capable of operating at high temperatures without performance degradation.
Organized in 1K x 8 configuration, offering a total of 1024 words with a width of 8 memory bits each.
Uses Transistor-Transistor Logic technology known for its reliability and compatibility with various digital systems.
Provides a decent amount of memory capacity for storing program data or instructions.
Standard terminal pitch for easy integration into existing circuit boards or systems.
Offers a high memory density for storing a significant amount of data or instructions.
OTP ROM SN54S3708J attributes and parameters. Explore more OTP ROM devices from Texas Instruments
JESD-30 Code:
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No. of Words Code:
Maximum Operating Temperature:
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Organization:
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Peak Reflow Temperature (C):
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SN54S3708J Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
1N4148
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Semitronics
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Fairchild Semiconductor
Itt Semiconductor
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WT
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Telefunken
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
Kec
TBP28L22MJ
Texas Instruments
TBP28L22MJ by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it offers a max access time of 75ns and operates in parallel mode. Ideal for military-grade applications requiring fast and reliable non-volatile memory storage.
JBP38L03XMFK
Texas Instruments' JBP38L03XMFK is a 32x8 OTP ROM with 20 terminals in a ceramic chip carrier package. Operating b/w -55 to 125 °C, it has a supply voltage of 5V and TTL technology. Ideal for military applications requiring non-volatile memory storage.
AT27C4096-55JU
Microchip Technology
Microchip Technology's AT27C4096-55JU is a 256KX16 OTP ROM with 55 ns access time, operating at 5V. It features a 44-terminal chip carrier package and supports asynchronous mode. Ideal for industrial applications requiring non-volatile memory storage in a compact form factor.
JBP18SA46MJ
JBP18SA46MJ by Texas Instruments is a MILITARY-grade OTP ROM with 512x8 organization and 4096-bit memory density. Featuring a max operating temperature of 125°C, it has an access time of 85ns. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
SNC54S3708J
SNC54S3708J by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 1KX8 organization, 8192-bit memory density, and TTL technology. It operates b/w -55°C to 125°C, making it ideal for military applications requiring reliable data storage in harsh environments. The package style is IN-LINE with 24 terminals on a RECTANGULAR CERAMIC body.
JBP38SA166MJW
JBP38SA166MJW by Texas Instruments is a MILITARY-grade OTP ROM with 2KX8 organization and 16384-bit memory density. Featuring a temperature range of -55 to 125 °C, it has 24 terminals in an IN-LINE package style. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
5962-01-214-2170
Texas Instruments' 5962-01-214-2170 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
SN74S477JP4
SN74S477JP4 by Texas Instruments is a 1KX4 OTP ROM IC with 4096-bit memory density. Operating b/w 0°C to 70°C, it features TTL technology and a rectangular ceramic package with 18 terminals. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.
AT27C512R-70PC
Atmel
AT27C512R-70PC by Atmel is a 64KX8 OTP ROM with 70ns access time, operating at 5V. It features a 3-STATE output and operates in parallel mode. Commonly used in commercial applications requiring non-volatile memory storage with a memory density of 524288 bits.
TBP24SA81JP4
TBP24SA81JP4 by Texas Instruments is a 2Kx4 OTP ROM with 8192-bit memory density and 70ns max access time. It features a ceramic rectangular package with 18 terminals in an in-line style, suitable for commercial temperature grade applications.
5962-01-050-6948
Texas Instruments' 5962-01-050-6948 is a 1KX4 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 60ns and operates in commercial temperature grade. This rectangular package with 18 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
DS2406P+T&R
Maxim Integrated
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;
CMS68P512-200
Texas Instruments' CMS68P512-200 is a 512KX8 OTP ROM with 3-STATE output. Operating at 5V, it offers 524288 words of memory in a MICROELECTRONIC ASSEMBLY package. Ideal for applications requiring fast access times and low standby current in commercial temperature grades.
M27C1001-10C1
M27C1001-10C1 by STMicroelectronics is a 128KX8 OTP ROM chip with 3-STATE output, operating at 5V. It has a max access time of 100ns and consumes up to 30mA. Commonly used in commercial applications requiring non-volatile memory storage with parallel interface.
SN74S477J4
SN74S477J4 by Texas Instruments is a 1KX4 OTP ROM with 4096-bit memory density and TTL technology. It operates b/w 0-70°C, has 18 terminals in an in-line package style, and is commonly used for storing fixed data in electronic devices.
SNM54S473J
SNM54S473J by Texas Instruments is a MIL-STD-883 Class C OTP ROM with 512x8 organization and 4096-bit memory density. It operates b/w -55°C to 125°C, has a max access time of 85ns, and is ideal for military-grade applications requiring reliable non-volatile memory storage.
AT27C4096-12PC
Atmel's AT27C4096-12PC is a 256KX16 OTP ROM with 3-STATE output, operating at 5V. It has a max access time of 120ns and consumes up to 40mA. Commonly used in commercial applications requiring reliable non-volatile memory storage due to its high memory density and parallel interface.
5962-01-236-1522
Texas Instruments' 5962-01-236-1522 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
AM27C512-200JI
Spansion
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
TBP24S10N3
TBP24S10N3 by Texas Instruments is a 256x4 OTP ROM with 1024-bit memory density. It operates at 5V, has a max access time of 55ns, and supports TTL technology. This rectangular package with 16 terminals is ideal for commercial applications requiring non-volatile memory storage.
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UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
SN54S476J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
SN54S470J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
SN54S188J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;
SN54S475J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 85 ns;
SN54S472J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 512 words;
SN54S450J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SN54S477J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
SN54186W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Terminal Form: FLAT;
SN54S471J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
SN54S188W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Maximum Access Time: 50 ns;
SN54S474W
SN54S473J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;
SN54S475W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
SN54188AW
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDFP-F16;
SN54S451J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 1K;
SN54186J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
SN54188AJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;
SN54S2708J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 8192 bit;
SN54S474J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 512 words;
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