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CMS68P256-200

Texas Instruments

CMS68P256-200 by Texas Instruments

Texas Instruments' CMS68P256-200 is a 256KX8 OTP ROM with 3-STATE output, operating at 5V. It features a MICROELECTRONIC ASSEMBLY package and operates in ASYNCHRONOUS mode. Ideal for applications requiring fast access times and low standby current in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,203 parts In-Stock

1+ parts

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4,203

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Digiode

USA . 182 parts In-Stock

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182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 551 parts In-Stock

1+ parts

$0.208

100+ parts

-

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$0.200

551

$0.208

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-

$0.200

Northwest PG Solutions

USA . 33 parts In-Stock

1+ parts

$0.229

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-

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$0.202

33

$0.229

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$0.202

Parana Technologies

USA . 707 parts In-Stock

1+ parts

$4.431

100+ parts

-

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$4.856

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707

$4.431

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$4.856

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ChromeModa Solutions

Germany . 6,044 parts In-Stock

1+ parts

$4.979

100+ parts

$4.083

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-

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6,044

$4.979

$4.083

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IDEA Electronic Components Group

UK . 792 parts In-Stock

1+ parts

$4.979

100+ parts

-

1k+ parts

$4.481

10k+ parts

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792

$4.979

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$4.481

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$11.548

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281

$11.548

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One Stop Electronics

USA . 801 parts In-Stock

1+ parts

$28.000

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801

$28.000

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DigiPath Technology Company

USA . 206 parts In-Stock

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$4.489

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$4.489

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Corphita

USA . 105 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments CMS68P256-200 OTP ROM. Manufactured by industry leader Texas Instruments, this device offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. With a 256Kx8 organization and 3-STATE output characteristics, this product delivers exceptional performance and efficiency. Don't settle for anything less than the best - choose the CMS68P256-200 for all your memory needs and experience the difference that top-of-the-line technology can make in your projects.

Feature Benefit Bullets

Operating Mode: ASYNCHRONOUS

Allows for independent operation without requiring synchronization with other components, providing flexibility in system design.

Input/Output Type: COMMON

Simplifies interface connections and reduces complexity in circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage rating that is widely compatible and easily accessible in most applications.

No. of Terminals: 68

Provides a sufficient number of connection points for interfacing with other components in a system.

Organization: 256KX8

Offers a high organization capacity for storing a large amount of data efficiently.

Memory IC Type: OTP ROM

Being OTP (One-Time Programmable) ensures the security of stored data as it cannot be altered, making it ideal for applications requiring permanent storage.

Technical Specifications

OTP ROM CMS68P256-200 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

200 ns

Alternate Memory Width:

16

Input/Output Type:

COMMON

JESD-30 Code:

X-XXMA-X68

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

68

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX8

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

CARD68

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.002 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

UNSPECIFIED

Terminal Position:

UNSPECIFIED

Trade Compliance

CMS68P256-200 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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