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5962-01-149-9458

Texas Instruments

5962-01-149-9458 by Texas Instruments

Texas Instruments' 5962-01-149-9458 is an OTP ROM IC with 32x8 organization, ECL10K technology, and 20ns access time. Ideal for applications requiring non-volatile memory storage in harsh environments with operating temperatures ranging from 0 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,565 parts In-Stock

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Digiode

USA . 884 parts In-Stock

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884

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Native Components

USA . 160 parts In-Stock

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$0.167

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$0.160

160

$0.167

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$0.160

Northwest PG Solutions

USA . 1,413 parts In-Stock

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$0.183

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$0.162

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$0.183

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$0.162

Parana Technologies

USA . 1,500 parts In-Stock

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$2.388

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$2.887

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$2.388

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$2.887

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DigiPath Technology Company

USA . 904 parts In-Stock

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$2.629

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$2.419

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904

$2.629

$2.419

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ChromeModa Solutions

Germany . 4,211 parts In-Stock

1+ parts

$2.683

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$2.200

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$2.683

$2.200

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IDEA Electronic Components Group

UK . 723 parts In-Stock

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$2.683

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$2.415

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723

$2.683

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AZTECH Wire

Italy . 266 parts In-Stock

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$9.901

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$9.901

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One Stop Electronics

USA . 1,589 parts In-Stock

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$17.000

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Corphita

USA . 4,471 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the 5962-01-149-9458 by Texas Instruments, a premium OTP ROM that delivers unparalleled performance and reliability. Crafted from high-quality ceramic, this rectangular package boasts 16 terminals in an in-line style for seamless integration. Ideal for a wide range of applications, this OTP ROM offers customers exceptional value, benefits, and advantages, making it the perfect choice for your next project. Experience the innovation and excellence that Texas Instruments is known for, and elevate your designs to new heights with the 5962-01-149-9458.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides durability and thermal stability, making the product resistant to high temperatures and mechanical stress.

No. of Terminals: 16

Having 16 terminals allows for efficient connectivity and integration with other components in a system.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can function reliably in various environmental conditions.

Organization: 32X8

The 32X8 organization allows for storing 32 words with a memory width of 8, providing sufficient capacity for data storage and retrieval.

Technology: ECL10K

Utilizing ECL10K technology ensures high-speed performance and efficient data processing capabilities.

Maximum Supply Current: 145 mA

The maximum supply current of 145 mA ensures optimal power consumption and efficiency during operation.

Memory IC Type: OTP ROM

Being an OTP ROM (One-Time Programmable Read-Only Memory) type memory IC ensures secure data storage without the risk of data modification or corruption.

Maximum Access Time: 20 ns

With a maximum access time of 20 nanoseconds, the product offers fast data retrieval and processing speeds for enhanced performance.

Technical Specifications

OTP ROM 5962-01-149-9458 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

20 ns

JESD-30 Code:

R-XDIP-T16

Memory IC Type:

Memory Width:

8

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

145 mA

Surface Mount:

NO

Technology:

ECL10K

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-149-9458 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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