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B2716

Intel

B2716 by Intel

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T24;

Median Price

$31.690

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

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State Motor and Control Solutions

USA . 2 parts In-Stock

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$26.610

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$26.610

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RS (Exports)

UK . 2 parts In-Stock

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$36.770

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$33.090

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Forefront Electronics and Design

USA . 3 parts In-Stock

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$0.740

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$0.740

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Freelance Electronics

USA . 2 parts In-Stock

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$8.975

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Digiode

USA . 145 parts In-Stock

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$25.280

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$25.280

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Vyrian

USA . 7,241 parts In-Stock

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VNN

France . 3,865 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 225 parts In-Stock

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Electronic Expediters

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Q Components

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MRC Electronics

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Prism Electronics

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Electronics Depot

USA . 24 parts In-Stock

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J & M Industries LLC

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Sinequanon

UK . 7 parts In-Stock

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First Choice Components Inc.

USA . 7 parts In-Stock

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Resion

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GES GmbH

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MARBEL Systems

Belgium . 4,332 parts In-Stock

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$2.558

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$2.558

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Texas Native Microelectronics

USA . 3,609 parts In-Stock

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$2.940

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$2.822

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$2.734

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$2.587

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$2.940

$2.822

$2.734

$2.587

Kenton Components

USA . 100 parts In-Stock

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$3.528

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$3.105

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$3.528

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Qasali Group International

UK . 10,986 parts In-Stock

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$7.938

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$7.382

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$6.985

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$6.985

Andel Nordic

Denmark . 2,053 parts In-Stock

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$11.247

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$10.797

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$10.797

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$10.797

Ampacity Inc.

Singapore . 2 parts In-Stock

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$22.620

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Corphita

USA . 90 parts In-Stock

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$23.949

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Continental Prestige Electronics

USA . 2,583 parts In-Stock

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Argo Parts USA

USA . 1,933 parts In-Stock

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Aranea Global

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Aztec Data Supply Inc.

USA . 67 parts In-Stock

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Perfect Parts

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Assy Fe

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Technical Specifications

OTP ROM B2716 attributes and parameters. Explore more OTP ROM devices from Intel

Specs

Maximum Access Time:

450 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T24

JESD-609 Code:

e0

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

2048 words

No. of Words Code:

2K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Programming Voltage (V):

25

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

B2716 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

NSN

5962-01-107-1082, 5962011071082, 5962-01-118-8116, 5962011188116, 5962-01-086-2717, 5962010862717, 5962-01-118-6409, 5962011186409, 5962-01-162-8125, 5962011628125, 5962-99-662-3520, 5962996623520, 5998-17-051-0279, 5998170510279

NIIN

011071082, 011188116, 010862717, 011186409, 011628125, 996623520, 170510279

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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