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5962-01-104-8731

Texas Instruments

5962-01-104-8731 by Texas Instruments

Texas Instruments' 5962-01-104-8731 is a 32X8 OTP ROM with 5V supply, 16 terminals, and 40ns access time. Ideal for commercial applications requiring reliable memory storage in a rectangular plastic/epoxy package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,550 parts In-Stock

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3,550

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Digiode

USA . 255 parts In-Stock

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255

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Parana Technologies

USA . 122 parts In-Stock

1+ parts

$4.931

100+ parts

-

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$5.467

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122

$4.931

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$5.467

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DigiPath Technology Company

USA . 1,271 parts In-Stock

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$5.430

100+ parts

$4.996

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1,271

$5.430

$4.996

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ChromeModa Solutions

Germany . 1,924 parts In-Stock

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$5.541

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$4.544

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1,924

$5.541

$4.544

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IDEA Electronic Components Group

UK . 1,481 parts In-Stock

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$5.541

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$4.987

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1,481

$5.541

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$4.987

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AZTECH Wire

Italy . 883 parts In-Stock

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$6.472

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883

$6.472

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One Stop Electronics

USA . 1,351 parts In-Stock

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$19.000

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1,351

$19.000

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Corphita

USA . 4,919 parts In-Stock

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Supply Digital

USA . 2,015 parts In-Stock

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Native Components

USA . 304 parts In-Stock

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Northwest PG Solutions

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Overview

Unlock the power of reliable data storage with the 5962-01-104-8731 by Texas Instruments. Manufactured with the highest quality standards, this OTP ROM offers a secure and efficient solution for storing critical information in a range of applications. Whether you're looking to enhance your industrial equipment or streamline your consumer electronics, this product delivers unparalleled value, benefits, and advantages that will exceed your expectations. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and helps you stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the OTP ROM, ensuring long-term reliability.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with many existing systems and easy to integrate.

No. of Words: 32 words

With a capacity of 32 words, this OTP ROM can store a decent amount of data for various applications.

Technology: TTL

Utilizing TTL technology provides fast and reliable data transfers, essential for efficient read and write operations.

Maximum Access Time: 40 ns

Having a fast access time of 40 ns ensures quick retrieval of data, enhancing overall system performance.

Technical Specifications

OTP ROM 5962-01-104-8731 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

40 ns

JESD-30 Code:

R-PDIP-T16

Memory IC Type:

Memory Width:

8

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

110 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-104-8731 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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