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M27C512-15C1

STMicroelectronics

M27C512-15C1 by STMicroelectronics

M27C512-15C1 by STMicroelectronics is a 64KX8 OTP ROM chip with 150 ns access time and 3-STATE output. Operating at 5V, it has a memory density of 524288 bit and is ideal for applications requiring non-volatile memory storage in commercial temperature environments.

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 21 parts In-Stock

1+ parts

$3.460

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$2.600

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$2.250

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21

$3.460

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$2.250

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American Microsemiconductor Inc.

USA . 55 parts In-Stock

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$9.980

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55

$9.980

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R&J Components

USA . 23,456 parts In-Stock

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Vyrian

USA . 8,138 parts In-Stock

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Zilex Electronics Inc.

Canada . 2,201 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,410 parts In-Stock

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Anansix

USA . 1,335 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 598 parts In-Stock

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598

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A2Z Electronics, Inc.

USA . 492 parts In-Stock

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492

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Holdelec - ElecDif-Pro

France . 243 parts In-Stock

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Digiode

USA . 187 parts In-Stock

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Legend Electronics Inc.

USA . 100 parts In-Stock

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ComSIT Distribution GmbH

Germany . 96 parts In-Stock

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ComSIT USA

USA . 96 parts In-Stock

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Bristol Electronics

USA . 91 parts In-Stock

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Atlantic Semiconductor

USA . 91 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 57 parts In-Stock

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Sinequanon

UK . 55 parts In-Stock

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Prism Electronics

USA . 52 parts In-Stock

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J2 Sourcing AB

Sweden . 40 parts In-Stock

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40

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Manoshevitz Elec. Sales

Israel . 30 parts In-Stock

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30

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PC Components Company LLC

USA . 29 parts In-Stock

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Semi Source

USA . 28 parts In-Stock

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EPE Components Inc.

USA . 15 parts In-Stock

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15

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ECAB

Sweden . 14 parts In-Stock

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Electronic Expediters

USA . 8 parts In-Stock

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8

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Mil-Aero Solutions, Inc.

USA . 7 parts In-Stock

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A&K Electronics

USA . 7 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 615 parts In-Stock

1+ parts

$3.000

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615

$3.000

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Corohmni

South Africa . 117 parts In-Stock

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$4.301

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117

$4.301

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IDEA Electronic Components Group

UK . 2,066 parts In-Stock

1+ parts

$4.418

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$3.976

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2,066

$4.418

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$3.976

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Aztec Data Supply Inc.

USA . 3,278 parts In-Stock

1+ parts

$5.390

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3,278

$5.390

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Microchip USA

USA . 208 parts In-Stock

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$7.221

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208

$7.221

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MKK Technologies

India . 1,539 parts In-Stock

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$8.307

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1,539

$8.307

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DigiPath Technology Company

USA . 1,539 parts In-Stock

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$8.307

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1,539

$8.307

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Semicontronic

India . 299 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

1k+ parts

$14.550

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299

$15.000

$14.625

$14.550

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AZTECH Wire

Italy . 261 parts In-Stock

1+ parts

$16.524

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261

$16.524

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Infinite Electronics LLP (Excess)

. 80,109 parts In-Stock

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Lixinc

USA . 18,770 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,823 parts In-Stock

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Continental Prestige Electronics

USA . 4,813 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,882 parts In-Stock

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Argo Parts USA

USA . 1,568 parts In-Stock

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Parana Technologies

USA . 1,537 parts In-Stock

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$5.282

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1,537

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$5.282

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Corphita

USA . 1,262 parts In-Stock

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Kepictronics

USA . 864 parts In-Stock

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Assy Fe

Spain . 665 parts In-Stock

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665

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Schahn Electronic Components

Germany . 622 parts In-Stock

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622

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Perfect Parts

USA . 72 parts In-Stock

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72

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Overview

Experience unparalleled reliability and performance with the M27C512-15C1 from STMicroelectronics. As a leading manufacturer in the industry, this OTP ROM offers a wide range of applications for your electronic devices. With its high-quality construction and advanced technology, this product guarantees exceptional value and advantages for customers seeking top-notch memory solutions. Upgrade your projects with the M27C512-15C1 and enjoy seamless operation and superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and helps protect the internal components of the OTP ROM from external damage.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent operations without the need for a centralized clock signal, providing flexibility in design and performance.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and stability in performance.

Memory Density: 524288 bit

High memory density of 524288 bit allows for storing a large amount of data in a compact form, making it suitable for various applications requiring extensive memory storage.

Maximum Access Time: 150 ns

Fast maximum access time of 150 ns ensures quick data retrieval, improving overall efficiency and performance of the OTP ROM.

Technical Specifications

OTP ROM M27C512-15C1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

Length:

13.97 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

M27C512-15C1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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