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DS2502X1+

Analog Devices

DS2502X1+ by Analog Devices

DS2502X1+ by Analog Devices is a CMOS OTP ROM with 1024-bit memory density, operating at 5V. It features a 128x8 organization, serial interface, and industrial temperature grade. Ideal for applications requiring common I/O type and asynchronous operation in a compact grid array package.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

DS2502X1+ by Analog Devices
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Distributors (In-Stock)

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Digiode

USA . 1,668 parts In-Stock

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Vyrian

USA . 1,405 parts In-Stock

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Anansix

USA . 766 parts In-Stock

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766

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Bristol Electronics

USA . 326 parts In-Stock

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326

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Nova Conductors

Japan . 54 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,229 parts In-Stock

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$2.000

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$2.000

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MARBEL Systems

Belgium . 500 parts In-Stock

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$3.781

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500

$3.781

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Texas Native Microelectronics

USA . 500 parts In-Stock

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$4.346

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$4.172

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$4.042

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$3.824

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$4.346

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$3.824

Kenton Components

USA . 704 parts In-Stock

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$5.215

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$4.589

704

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Corohmni

South Africa . 68 parts In-Stock

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$5.535

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Semicontronic

India . 1,575 parts In-Stock

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$8.000

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$7.800

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$7.760

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Qasali Group International

UK . 1,000 parts In-Stock

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$11.734

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$10.913

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$10.326

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One Stop Electronics

USA . 2,585 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,653 parts In-Stock

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Continental Prestige Electronics

USA . 5,728 parts In-Stock

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Argo Parts USA

USA . 4,155 parts In-Stock

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Microchip USA

USA . 3,371 parts In-Stock

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Corphita

USA . 2,349 parts In-Stock

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Vigor

Singapore . 211 parts In-Stock

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Bastille Electronics

Australia . 44 parts In-Stock

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Overview

Unlock the power of secure data storage with the DS2502X1+ by Analog Devices. This OTP ROM device offers unparalleled quality and reliability, thanks to its cutting-edge technology and top-notch manufacturing standards. Ideal for a wide range of applications, this product provides customers with peace of mind knowing their data is safe and easily accessible. With a compact design and easy installation, the DS2502X1+ delivers unbeatable value and performance, making it the perfect choice for all your memory needs. Experience the difference with Analog Devices today.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material is durable and cost-effective, making it a good choice for a wide range of applications.

Surface Mount

YES - Surface mount technology allows for easy installation and reduces overall size, making this product suitable for compact designs.

Package Shape

RECTANGULAR - The rectangular shape provides efficient use of space, making it ideal for applications with limited room for components.

Operating Mode

ASYNCHRONOUS - Asynchronous operation allows for flexibility and compatibility with various systems, making this product versatile and widely applicable.

Input/Output Type

COMMON - Common input/output type simplifies circuit design and integration, making this product easy to use in different systems.

Nominal Supply Voltage / Vsup (V)

5 - With a nominal supply voltage of 5V, this product can operate efficiently and reliably in standard voltage conditions.

Power Supplies (V)

3/5 - This product can operate within a range of 3V to 5V, providing flexibility and compatibility with different power sources.

No. of Terminals

2 - The limited number of terminals simplifies installation and reduces the risk of errors, making this product user-friendly.

Package Style (Meter)

GRID ARRAY, VERY THIN PROFILE - The grid array style with a very thin profile saves space and allows for high-density packaging, making this product suitable for compact designs.

Maximum Operating Temperature

85 °C - With a high maximum operating temperature, this product can withstand challenging environments and extended use.

Organization

128X8 - The organization of 128 words of 8 bits each allows for efficient data storage and retrieval, making this product suitable for storing small amounts of information.

Minimum Operating Temperature

40 °C - With a low minimum operating temperature, this product can function in cold environments without performance issues.

Terminal Finish

TIN SILVER COPPER NICKEL - The terminal finish of tin, silver, copper, and nickel provides corrosion resistance and good conductivity, ensuring long-term reliability.

Terminal Position

BOTTOM - The bottom terminal position simplifies installation and allows for easier connection to other components, making this product user-friendly.

Maximum Seated Height

0.639 mm - The low maximum seated height allows for compact designs and efficient use of space, making this product suitable for applications with height constraints.

Technical Specifications

OTP ROM DS2502X1+ attributes and parameters. Explore more OTP ROM devices from Analog Devices

Specs

Maximum Access Time:

15000 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B2

JESD-609 Code:

e2

Length:

1.6 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,37/16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.639 mm

Sub-Category:

Other Memory ICs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER NICKEL

Terminal Form:

BALL

Terminal Pitch:

.933 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.91 mm

Trade Compliance

DS2502X1+ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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