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TBP24SA81NP3

Texas Instruments

TBP24SA81NP3 by Texas Instruments

TBP24SA81NP3 by Texas Instruments is a 2Kx4 OTP ROM with 8192-bit memory density. It operates b/w 0°C to 70°C, has a max access time of 70ns, and uses TTL technology. This rectangular package with 18 terminals in an in-line style is ideal for commercial applications requiring non-volatile memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,302 parts In-Stock

1+ parts

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6,302

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Digiode

USA . 706 parts In-Stock

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706

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,056 parts In-Stock

1+ parts

$3.448

100+ parts

-

1k+ parts

$3.973

10k+ parts

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1,056

$3.448

-

$3.973

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DigiPath Technology Company

USA . 595 parts In-Stock

1+ parts

$3.797

100+ parts

-

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595

$3.797

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ChromeModa Solutions

Germany . 2,183 parts In-Stock

1+ parts

$3.874

100+ parts

$3.177

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2,183

$3.874

$3.177

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IDEA Electronic Components Group

UK . 1,816 parts In-Stock

1+ parts

$3.874

100+ parts

-

1k+ parts

$3.487

10k+ parts

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1,816

$3.874

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$3.487

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One Stop Electronics

USA . 767 parts In-Stock

1+ parts

$8.000

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767

$8.000

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AZTECH Wire

Italy . 696 parts In-Stock

1+ parts

$16.557

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696

$16.557

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Corphita

USA . 2,812 parts In-Stock

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Overview

Unlock the power of quality and reliability with the TBP24SA81NP3 by Texas Instruments, a leading manufacturer in the industry. This OTP ROM offers a wide range of applications and is designed to meet the needs of various electronic devices. With its durable plastic/epoxy package body and high-performance technology, this product provides customers with exceptional value and benefits. Trust Texas Instruments for superior products that deliver unmatched performance and reliability in every application. Choose the TBP24SA81NP3 for all your memory needs and experience the advantage of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the internal components of the OTP ROM, making it suitable for various operating environments.

No. of Terminals: 18

The 18 terminals allow for efficient connectivity and interaction with external devices, enhancing the versatility of the OTP ROM.

Organization: 2KX4

The 2KX4 organization ensures efficient storage and retrieval of data, offering a reliable performance for the product.

Technology: TTL

The TTL technology used in this OTP ROM provides fast and reliable operation, making it ideal for applications where speed is crucial.

Memory Density: 8192 bit

With a memory density of 8192 bits, this OTP ROM offers ample storage capacity for data, increasing its utility for various applications.

Technical Specifications

OTP ROM TBP24SA81NP3 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

R-PDIP-T18

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

2048 words

No. of Words Code:

2K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

OTP ROMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TBP24SA81NP3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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