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SN74S472NP1

Texas Instruments

SN74S472NP1 by Texas Instruments

SN74S472NP1 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in commercial temperature grade. This rectangular package IC with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,665 parts In-Stock

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4,665

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Digiode

USA . 367 parts In-Stock

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367

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,323 parts In-Stock

1+ parts

$5.287

100+ parts

$490.941

1k+ parts

$4.758

10k+ parts

-

2,323

$5.287

$490.941

$4.758

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DigiPath Technology Company

USA . 916 parts In-Stock

1+ parts

$5.821

100+ parts

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916

$5.821

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ChromeModa Solutions

Germany . 3,445 parts In-Stock

1+ parts

$5.940

100+ parts

$4.871

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-

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3,445

$5.940

$4.871

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IDEA Electronic Components Group

UK . 2,110 parts In-Stock

1+ parts

$5.940

100+ parts

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$5.346

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2,110

$5.940

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$5.346

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AZTECH Wire

Italy . 546 parts In-Stock

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$13.049

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546

$13.049

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One Stop Electronics

USA . 1,612 parts In-Stock

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$24.000

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1,612

$24.000

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Corphita

USA . 3,638 parts In-Stock

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3,638

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Overview

Unlock the power of secure and reliable data storage with the Texas Instruments SN74S472NP1 OTP ROM chip. Designed with precision and expertise by Texas Instruments, a trusted leader in semiconductor technology, this versatile chip offers unparalleled quality and performance. Ideal for a wide range of applications, from consumer electronics to industrial automation, this OTP ROM chip provides seamless integration and lasting durability. Experience the value and benefits of Texas Instruments' cutting-edge technology with the SN74S472NP1, delivering efficient data storage solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the OTP ROM, making it suitable for various environments and handling.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with standard power supplies, making it easy to integrate the OTP ROM into existing systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this OTP ROM can function reliably in normal operating conditions without overheating.

Organization: 512X8

The 512X8 organization allows for efficient storage and retrieval of data, providing a good balance between capacity and access speed.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of systems and devices, enhancing the versatility of the OTP ROM.

Memory Density: 4096 bit

With a memory density of 4096 bits, this OTP ROM can store a significant amount of data in a compact package, making it efficient and cost-effective.

Technical Specifications

OTP ROM SN74S472NP1 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

75 ns

JESD-30 Code:

R-PDIP-T20

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

20

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74S472NP1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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