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SN10139JE

Texas Instruments

SN10139JE by Texas Instruments

SN10139JE by Texas Instruments is an OTP ROM IC with 32x8 organization, ECL10K technology, and 20ns max access time. It is used in applications requiring non-volatile memory storage with a package style of IN-LINE for industrial temperature range from 0 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,825 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,825

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-

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Digiode

USA . 1,709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,709

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,890 parts In-Stock

1+ parts

$4.010

100+ parts

-

1k+ parts

$4.475

10k+ parts

-

1,890

$4.010

-

$4.475

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DigiPath Technology Company

USA . 268 parts In-Stock

1+ parts

$4.416

100+ parts

$4.063

1k+ parts

-

10k+ parts

-

268

$4.416

$4.063

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ChromeModa Solutions

Germany . 4,545 parts In-Stock

1+ parts

$4.506

100+ parts

$3.695

1k+ parts

-

10k+ parts

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4,545

$4.506

$3.695

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

1+ parts

$4.506

100+ parts

-

1k+ parts

$4.055

10k+ parts

-

1,982

$4.506

-

$4.055

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AZTECH Wire

Italy . 877 parts In-Stock

1+ parts

$9.606

100+ parts

-

1k+ parts

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10k+ parts

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877

$9.606

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One Stop Electronics

USA . 485 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

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10k+ parts

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485

$12.000

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Corphita

USA . 2,782 parts In-Stock

1+ parts

-

100+ parts

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2,782

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Overview

Unlock the power of reliable data storage with the SN10139JE by Texas Instruments. Crafted from high-quality ceramic, this OTP ROM offers fast access times and a wide memory width of 8 words. Perfect for a variety of applications, this rectangular package with 16 terminals provides customers with value and efficiency. Trust Texas Instruments for cutting-edge technology that delivers superior performance every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Provides durability and stable performance, ideal for long-term use.

Package Shape: RECTANGULAR

Convenient and easy to integrate into various systems.

No. of Terminals: 16

Allows for efficient connectivity and communication with other components.

No. of Words: 32 words

Offers ample storage capacity for data and instructions.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for demanding environments.

Technology: ECL10K

Utilizes advanced technology for fast and reliable performance.

Maximum Access Time: 20 ns

Provides quick access to data, minimizing delays in processing.

Technical Specifications

OTP ROM SN10139JE attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

20 ns

JESD-30 Code:

R-XDIP-T16

Memory IC Type:

Memory Width:

8

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

145 mA

Surface Mount:

NO

Technology:

ECL10K

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN10139JE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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