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TBP28L85J4

Texas Instruments

TBP28L85J4 by Texas Instruments

TBP28L85J4 by Texas Instruments is a 1Kx8 OTP ROM with 8192-bit memory density and operates at a nominal voltage of 5V. This rectangular ceramic package has 24 terminals, dual terminal position, and TTL technology. It is ideal for commercial applications requiring non-volatile memory storage in a compact IN-LINE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,131 parts In-Stock

1+ parts

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4,131

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Vyrian

USA . 2,981 parts In-Stock

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2,981

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,611 parts In-Stock

1+ parts

$4.604

100+ parts

-

1k+ parts

$5.070

10k+ parts

-

1,611

$4.604

-

$5.070

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DigiPath Technology Company

USA . 1,144 parts In-Stock

1+ parts

$5.070

100+ parts

$4.664

1k+ parts

-

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1,144

$5.070

$4.664

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ChromeModa Solutions

Germany . 6,439 parts In-Stock

1+ parts

$5.173

100+ parts

$4.242

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-

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6,439

$5.173

$4.242

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IDEA Electronic Components Group

UK . 2,159 parts In-Stock

1+ parts

$5.173

100+ parts

-

1k+ parts

$4.656

10k+ parts

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2,159

$5.173

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$4.656

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AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$17.627

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668

$17.627

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One Stop Electronics

USA . 678 parts In-Stock

1+ parts

$23.000

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678

$23.000

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Corphita

USA . 897 parts In-Stock

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897

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Overview

Elevate your electronic designs with the TBP28L85J4 by Texas Instruments, a cutting-edge OTP ROM that boasts unparalleled quality and reliability. Crafted by the renowned manufacturer, Texas Instruments, this device offers exceptional value and benefits to customers seeking high-performance memory solutions. With a wide range of applications in various industries, this product delivers superior performance and efficiency, making it a must-have for any project where reliability is key. Trust Texas Instruments to provide top-notch technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package provides excellent durability and thermal performance, making this product suitable for harsh operating conditions.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with a wide range of systems and applications.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and integration with various circuit configurations.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this OTP ROM can reliably function in high-temperature environments.

Organization: 1KX8

The 1KX8 organization means that this OTP ROM has a capacity of 1024 words, which is ideal for storing and accessing moderate amounts of data efficiently.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of digital systems and provides reliable performance in data transmission and processing.

Memory Density: 8192 bit

With a memory density of 8192 bits, this OTP ROM can store a significant amount of data in a compact and efficient manner.

Technical Specifications

OTP ROM TBP28L85J4 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TBP28L85J4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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