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TBP24S81-55NP3

Texas Instruments

TBP24S81-55NP3 by Texas Instruments

TBP24S81-55NP3 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 55 ns max access time. It operates b/w 0 to 70 °C, ideal for commercial applications requiring reliable non-volatile memory storage in a rectangular package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,892 parts In-Stock

1+ parts

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4,892

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Vyrian

USA . 3,143 parts In-Stock

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3,143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,844 parts In-Stock

1+ parts

$3.273

100+ parts

-

1k+ parts

$3.800

10k+ parts

-

1,844

$3.273

-

$3.800

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ChromeModa Solutions

Germany . 2,154 parts In-Stock

1+ parts

$3.678

100+ parts

$3.016

1k+ parts

-

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2,154

$3.678

$3.016

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IDEA Electronic Components Group

UK . 149 parts In-Stock

1+ parts

$3.678

100+ parts

-

1k+ parts

$3.310

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149

$3.678

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$3.310

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AZTECH Wire

Italy . 372 parts In-Stock

1+ parts

$19.435

100+ parts

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372

$19.435

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One Stop Electronics

USA . 1,148 parts In-Stock

1+ parts

$23.000

100+ parts

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1,148

$23.000

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Corphita

USA . 1,384 parts In-Stock

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1,384

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DigiPath Technology Company

USA . 735 parts In-Stock

1+ parts

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100+ parts

$3.316

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735

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$3.316

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Overview

Elevate your projects with the TBP24S81-55NP3 from Texas Instruments, a leading manufacturer known for superior quality and reliability. This OTP ROM memory device offers a wide range of applications in various industries, providing unmatched value and benefits to customers. With a memory density of 8192 bits and a fast maximum access time of 55 ns, this product is perfect for demanding tasks that require quick data retrieval. Trust Texas Instruments for innovative technology that delivers outstanding performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to damage, ensuring a longer lifespan for the OTP ROM.

No. of Terminals: 18

Having 18 terminals allows for a sufficient number of connections, ensuring compatibility with a variety of systems and applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this OTP ROM can withstand higher temperatures without compromising its performance, making it suitable for different environments.

Organization: 2KX4

The organization of 2KX4 provides a good balance between capacity and performance, making it suitable for storing and accessing a moderate amount of data efficiently.

Technology: TTL

Being TTL technology ensures compatibility with a wide range of devices and systems, making it a versatile choice for various applications.

Memory Density: 8192 bit

With a memory density of 8192 bits, this OTP ROM offers ample storage capacity for data, allowing for efficient operation and data access.

Technical Specifications

OTP ROM TBP24S81-55NP3 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

55 ns

JESD-30 Code:

R-PDIP-T18

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

2048 words

No. of Words Code:

2K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

OTP ROMs

Maximum Supply Current:

175 mA

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TBP24S81-55NP3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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